CN100456914C - Radiator module - Google Patents
Radiator module Download PDFInfo
- Publication number
- CN100456914C CN100456914C CNB2005101049730A CN200510104973A CN100456914C CN 100456914 C CN100456914 C CN 100456914C CN B2005101049730 A CNB2005101049730 A CN B2005101049730A CN 200510104973 A CN200510104973 A CN 200510104973A CN 100456914 C CN100456914 C CN 100456914C
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- CN
- China
- Prior art keywords
- radiating fin
- heat pipe
- base
- radiator module
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011159 matrix material Substances 0.000 claims description 22
- 238000005452 bending Methods 0.000 claims description 9
- 210000001503 joint Anatomy 0.000 claims description 9
- 230000006835 compression Effects 0.000 claims description 6
- 238000007906 compression Methods 0.000 claims description 6
- 239000007787 solid Substances 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000012224 working solution Substances 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 6
- 239000006071 cream Substances 0.000 abstract description 6
- 239000000853 adhesive Substances 0.000 abstract 2
- 230000001070 adhesive effect Effects 0.000 abstract 2
- 238000000465 moulding Methods 0.000 abstract 2
- 238000004026 adhesive bonding Methods 0.000 abstract 1
- 238000001816 cooling Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000007767 bonding agent Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
It is a radiator module, especially of the radiator module structure design without tin cream or any adhesive as adhesive bonding. It includes many cooling fins, many heat pipes and one base, the corresponding grooves which is located on base and matches with heat pipes. And there are molding pieces on both sides of corresponding grooves, they can heat pipe embed in corresponding grooves. It can press and bend the molding pieces and combines with heat pipe's body. So the meet of the base and the heat pipe doesn't need tin cream or any adhesive, this can effectively improves the thermal conduction efficiency of the base and heat pipe.
Description
Technical field
The invention provides a kind of radiator module, it is meant a kind of radiator module of using tin cream or any bonding agent to engage with the heat pipe media as base of not needing especially, so can effectively improve the heat conduction efficiency of base and heat pipe.
Background technology
The radiator module that tradition utilizes heat pipe to form, it mainly comprises: most radiating fins (mostly being aluminium matter or copper), most heat pipes (are the metal tubes of closed at both ends, working solution is equipped with in inside) and a base (adopt copper more, so also claim at the bottom of the copper), described radiating fin is stacked arrangement, and form to place with heat pipe and combine, and heat pipe and base solder bond; Above-mentioned traditional radiator module, heat pipe 20 is to adopt solder bond (as Figure 13) with base 30, so must be again (are unlike materials as heat pipe 20 with base 30 as the media of solder bond with tin cream or selected bonding agent, then must impose electronickelling in advance handles), therefore, the overall package manufacturing is comparatively complicated, not only increases its cost burden, fraction defective is also high, and can reduce the heat conduction efficiency of base 30 and heat pipe 20.
Known radiator module also can be locked frame in conjunction with a fan at the radiating fin periphery of stacked arrangement during use, so that the locking location of a radiator fan to be provided.
Summary of the invention
Main purpose of the present invention, be to provide a kind of radiator module, comprise that most radiating fins, most heat pipes and a base form, particularly base is provided with most corresponding grooves that are mutual coupling with the heat pipe body, and each corresponding groove both sides all has upwardly extending matrix band, after heat pipe embeds the base corresponding groove, both sides matrix band pressurization bending is incorporated into heat pipe, therefore make base needn't use tin cream or bonding agent with engaging fully of heat pipe, so assembling that can simplifying radiator module reaches fast in conjunction with effect.And corresponding groove both sides matrix band directly adheres on the heat pipe through the pressurization bending, does not need any mating substance, effectively improves and promote the heat conduction efficiency of base and heat pipe.
Another object of the present invention, be to provide a kind of radiator module, a described majority radiating fin can be divided into most section zones (for example four sections), integrate adjacent again and stacked arrangement, its radiating fin of being located at first section of front end is provided with through hole and lower end half arc groove (or any required form gap slots such as half elliptic gap slot or flat concavity gap slot), second section radiating fin is provided with simultaneously, following through hole, the 3rd section radiating fin is identical with first section radiating fin, the 4th section radiating fin is then shorter and smaller, only has last through hole, utilize described concentrating to be located at the radiating fin of interlude (on having, following through hole), make after lower tube body runs through simultaneously on the heat pipe, it is one huge to lower compression strength to force the upper tube body of heat pipe to produce, make heat pipe upper tube body can with first section with the 3rd section radiating fin (not having following through hole) to lower compression, so can guarantee that whole group radiating fin all is to post very closely with base contacts, and make the thermal source can be via base, heat pipe to the radiating fin radiator fan of a peripheral hardware (or to) a tunnel directly conducts, to obtain best radiating effect.
Fork one purpose of the present invention, be to provide a kind of radiator module, the body of described heat pipe can be embodied as any tubular because of the designed meter of demand such as tubular, flat pipe, oval pipe, the corresponding groove of base is then tubularly done collocation for what corresponding half slot, flat groove, half elliptic groove etc. implemented, makes body and base can form the good double team that connects airtight and makes up.
The object of the present invention is achieved like this, a kind of radiator module, its composition comprises: most radiating fins, most individual heat pipe and bases, this majority radiating fin can be shape identical or inequality, and be the arrangement form of adjacent stacks, and each radiating fin offers through hole at matched position mutually, and most heat pipes, be the body that two ends are sealing, and the inner working solution of loading of pipe;
Base, it is a solid metal pedestal, its end face is provided with most the corresponding grooves that can be mutual coupling with above-mentioned heat pipe, and the both sides of each corresponding groove all have upwardly extending matrix band, and the both sides matrix band cooperates corresponding groove and forms with heat pipe and connects airtight the double team combination in pressurization bending back;
By an above-mentioned majority radiating fin, most individual heat pipe and base, make most the corresponding corresponding grooves that embed base of heat pipe, and then the both sides matrix band of corresponding groove bestowed pressurization bending and directly post and be incorporated on the heat pipe, and heat pipe runs through the last through hole of radiating fin and forms described radiator module.
The selected local radiating fin of this majority radiating fin offers down through hole, runs through combination for heat pipe.
Selected half arc groove or half elliptic gap slot or the flat concavity gap slot collocation corresponding groove of being provided with of this majority radiating fin.
The both sides matrix band of this base half slot, its butt joint two ends are flat mouthful shape and engage.
The both sides matrix band of this base half slot, its butt joint two ends are the joint of relative step shape.
The both sides matrix band of this base half slot, its butt joint two ends are the joint of the shape of cutting sth. askew relatively.
Radiating fin periphery in most stacked arrangement is provided with fan lock frame.
This fan lock frame is made of half frame of two correspondences, and the two halves frame has the lower support pin respectively, fixedly is overlapped in the two side ends of base.
This majority radiating fin is divided into four sections zones and adjacent arrangement, its radiating fin of being located at first section of front end is provided with through hole and lower end half arc groove, second section radiating fin is provided with simultaneously, following through hole, the 3rd section radiating fin is identical with first section radiating fin, the 4th section radiating fin is then shorter and smaller, only has last through hole, utilize the last lower tube body of heat pipe to run through the last through hole and following through hole of second section radiating fin simultaneously, with the upper tube body that forces heat pipe first section radiating fin with the 3rd section formed tight solid posting to lower compression with base and contact.
The corresponding groove of base is half slot or flat groove or half elliptic groove, and the body of heat pipe is corresponding pipe or flat pipe or oval pipe.
Description of drawings
Fig. 1: be combination stereogram of the present invention.
Fig. 2: be exploded perspective view of the present invention.
Fig. 3: be the combination schematic diagram of heat pipe of the present invention and base.
Fig. 4: be another combination schematic diagram of heat pipe of the present invention and base.
Fig. 5: be the another combination schematic diagram of heat pipe of the present invention and base.
Fig. 6: the exploded perspective view that installs fan lock frame for the present invention additional.
Fig. 7: be the combination stereogram of Fig. 6.
Fig. 8: be combined side view of the present invention.
Fig. 9: be set as another embodiment exploded perspective view of flat pipe for the present invention makes the heat pipe body.
Figure 10: be the compound section schematic diagram of Fig. 9.
Figure 11: be set as the another embodiment exploded perspective view of oval pipe for the present invention makes the heat pipe body.
Figure 12: be the compound section schematic diagram of Figure 11.
Figure 13: be schematic diagram before the assembling of known heat pipe and known seat.
Embodiment
As shown in Figures 1 and 2, radiator module of the present invention, its composition comprises: most radiating fins 1, most individual heat pipe 2 and bases 3, wherein:
A most radiating fin 1, each radiating fin 1 can be shape identical or inequality, and be the arrangement form of adjacent stacks, and each radiating fin 1 offers through hole 11 at matched position mutually, and the radiating fin 1 of part then offers down through hole 12 or has half arc groove 13;
A most heat pipe 2 are known members, are the heat pipe that two ends are sealing, and the inner working solution of loading of pipe;
By an above-mentioned majority radiating fin 1, most heat pipe 2 and base 3, make most the heat pipes 2 corresponding half slots 31 that embed base 3, and then the both sides matrix band 311 of half slot 31 bestowed pressurization bending and directly post and be incorporated on the heat pipe 2, and the through hole (as above through hole 11 and through hole 12 down) of most radiating fins 1 is then run through at heat pipe 2 two ends respectively, making radiating fin 1 be to post closely with base 3 contacts, to make the thermal source can be via the base 3 that is sticked, heat pipe 2 reaches the heat radiation purpose to radiating fin 1 (or external radiator fan) one tunnel direct conduction, the radiator module that constitutes like this, because of base 3 and engaging of heat pipe 2 needn't be via welding, so entire combination need not to use welding media such as tin cream or bonding agent fast and fully, can improve the overall thermal conduction efficiency of radiator module.
Above-mentioned heat pipe 2 combines with base 3, the both sides matrix band 311 of this corresponding groove 31 (as half slot), its butt joint two ends are flat mouthful shape and engage (as Fig. 3) and can constitute a circular hole that equates with heat pipe 2 calibers, or shown in Fig. 4 embodiment, these butt joint two ends can be the joint of relative step shape, or also can shown in Fig. 5 embodiment, make the butt joint two ends can be the joint of the shape of cutting sth. askew relatively.
As Fig. 6, shown in Figure 7, radiator module of the present invention, it also can be provided with fan lock frame again at radiating fin 1 periphery of stacked arrangement, in order to the locking location that a radiator fan (not shown) can be provided, described fan lock frame can be made of half frame 41 of two correspondences, two halves frame 41 has lower support pin 411 respectively and can fixedly be overlapped in the clinch 32 of base 3 two side ends, to constitute a fan lock frame with four end lockholes 412.
Say again, as implement shown in the illustration, an above-mentioned majority radiating fin 1 can be divided into four sections (or selected most section) zone and adjacent arrangement (please refer to Fig. 8 and Fig. 2 is shown), its radiating fin 1 of being located at first section of front end is provided with through hole 11 and lower end half arc groove 13, second section radiating fin 1 is provided with simultaneously, following through hole 11,12, the 3rd section radiating fin 1 is identical with first section radiating fin 1, the 4th section radiating fin 1 is then shorter and smaller, only has last through hole 11, offer through hole 11 and following through hole 12 simultaneously because of concentrating the local radiating fin 1 in the middle of being located at, so can utilize the last lower tube body of heat pipe 2 to run through simultaneously, produce one huge to lower compression strength with the upper tube body that forces heat pipe 3, make heat pipe 3 upper tube body can with first section with the 3rd section radiating fin (not having following through hole) to lower compression, solid posting contacts to guarantee all to be whole group radiating fin (except the 4th section radiating fin 1) and base 3 very closely, make the thermal source can be via the base 3 that is sticked, heat pipe 2 to radiating fin 1 radiator fan of a peripheral hardware (or to) a tunnel directly conducts, and obtains best radiating effect.
Design according to the present invention, above-mentioned heat pipe 2 adopts and known identical round tube shape, so the half slot 31 of body 21 (as Fig. 8) base 3 corresponding of heat pipe 2 and half arc groove 13 of radiating fin 1 with it, the matched shape that also all is semi arch, make to form with tubular heat pipe 2 after the matrix band 311 pressurization bending of base 3 both sides and connect airtight double team, to obtain good thermal conductivity.
In like manner, as Fig. 9 and shown in Figure 10, for being had, heat pipe 2 better connects airtight double team combination and heat-conducting effect, it also can utilize draw mode to make the body 21a of heat pipe 2 be shaped to a flat pipe in advance, and make base 3 and radiating fin 1 be respectively equipped with corresponding flat groove 31a and flat concavity gap slot 13a, and the following through hole 12a that is flat hole shape relatively, make flat body 21a and matrix band 311 can add indentation folding and form the double team combination of very driving fit, and the flat concavity gap slot 13a of radiating fin 1 still can be good subsides with flat thermal conductance body 21a and touches with base 3.
Based on same design, as Figure 11 and shown in Figure 12, the body 21b of this heat pipe 2 or can be shaped to an oval pipe in advance, and make base 3 and radiating fin 1 be respectively equipped with corresponding half elliptic groove 31b and half elliptic gap slot 13b, and the following through hole 12b of relative ovalize, make oval body 21b and matrix band 311 add and press folding and form splendid driving fit double team with base 3, and the half elliptic gap slot 13b of radiating fin 1 still is good subsides with oval thermal conductance body 21b and touches, touch combination to obtain to paste more closely thus, make to have good thermal conductivity, and improve whole heat conduction efficiency.
Though the present invention discloses with specific embodiment; but it is not in order to limit the present invention; any those skilled in the art; the displacement of the equivalent assemblies of under the prerequisite that does not break away from design of the present invention and scope, having done; or, all should still belong to the category that this patent is contained according to equivalent variations and modification that scope of patent protection of the present invention is done.
Claims (10)
1. radiator module, its composition comprises: most radiating fins, most individual heat pipe and bases, this majority radiating fin can be shape identical or inequality, and be the arrangement form of adjacent stacks, and each radiating fin is offered through hole at mutual matched position, and most heat pipes are the body that two ends are sealing, and the inner working solution of loading of pipe; It is characterized in that:
Base, it is a solid metal pedestal, its end face is provided with most the corresponding grooves that can be mutual coupling with above-mentioned heat pipe, and the both sides of each corresponding groove all have upwardly extending matrix band, and the both sides matrix band cooperates corresponding groove and forms with heat pipe and connects airtight the double team combination in pressurization bending back;
By an above-mentioned majority radiating fin, most individual heat pipe and base, make most the corresponding corresponding grooves that embed base of heat pipe, and then the both sides matrix band of corresponding groove bestowed pressurization bending and directly post and be incorporated on the heat pipe, and heat pipe runs through the last through hole of radiating fin and forms described radiator module.
2. radiator module as claimed in claim 1 is characterized in that: the selected local radiating fin of this majority radiating fin offers down through hole, runs through combination for heat pipe.
3. radiator module as claimed in claim 1 is characterized in that: selected half arc groove or half elliptic gap slot or the flat concavity gap slot collocation corresponding groove of being provided with of this majority radiating fin.
4. radiator module as claimed in claim 1 is characterized in that: the both sides matrix band of this base corresponding groove, its butt joint two ends are flat mouthful shape and engage.
5. radiator module as claimed in claim 1 is characterized in that: the both sides matrix band of this base corresponding groove, its butt joint two ends are the joint of relative step shape.
6. radiator module as claimed in claim 1 is characterized in that: the both sides matrix band of this base corresponding groove, its butt joint two ends are the joint of the shape of cutting sth. askew relatively.
7. radiator module as claimed in claim 1 is characterized in that: the radiating fin periphery in most stacked arrangement is provided with fan lock frame.
8. radiator module as claimed in claim 7 is characterized in that: this fan lock frame is made of half frame of two correspondences, and the two halves frame has the lower support pin respectively, fixedly is overlapped in the two side ends of base.
9. radiator module as claimed in claim 1, it is characterized in that: this majority radiating fin is divided into four sections zones and adjacent arrangement, its radiating fin of being located at first section of front end is provided with through hole and lower end half arc groove, second section radiating fin is provided with simultaneously, following through hole, the 3rd section radiating fin is identical with first section radiating fin, the 4th section radiating fin is then shorter and smaller, only has last through hole, utilize the last lower tube body of heat pipe to run through the last through hole and following through hole of second section radiating fin simultaneously, with the upper tube body that forces heat pipe first section radiating fin with the 3rd section formed tight solid posting to lower compression with base and contact.
10. radiator module as claimed in claim 1 is characterized in that: the corresponding groove of base is half slot or flat groove or half elliptic groove, and the body of heat pipe is corresponding pipe or flat pipe or oval pipe.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005101049730A CN100456914C (en) | 2005-09-22 | 2005-09-22 | Radiator module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005101049730A CN100456914C (en) | 2005-09-22 | 2005-09-22 | Radiator module |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1937903A CN1937903A (en) | 2007-03-28 |
CN100456914C true CN100456914C (en) | 2009-01-28 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CNB2005101049730A Expired - Fee Related CN100456914C (en) | 2005-09-22 | 2005-09-22 | Radiator module |
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CN (1) | CN100456914C (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102005391B (en) * | 2009-09-03 | 2012-08-08 | 技嘉科技股份有限公司 | Heat-radiating module and assembling method thereof |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102291965A (en) * | 2011-07-04 | 2011-12-21 | 林俊宏 | Manufacturing method for fin-type radiator |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0206980A2 (en) * | 1985-05-22 | 1986-12-30 | Alusuisse-Lonza Services Ag | Heat sink for semiconductor devices and method for manufacturing the same |
JPH06198383A (en) * | 1992-09-21 | 1994-07-19 | Hideaki Serizawa | Heat radiation plate and its production |
JP2002324879A (en) * | 2001-04-24 | 2002-11-08 | Yamazaki Seisakusho:Kk | Heat sink for semiconductor device and manufacturing method therefor |
CN2566344Y (en) * | 2002-06-10 | 2003-08-13 | 双鸿科技股份有限公司 | Base with radiating conduit |
CN2854483Y (en) * | 2005-09-22 | 2007-01-03 | 黄崇贤 | Radiator mould set |
-
2005
- 2005-09-22 CN CNB2005101049730A patent/CN100456914C/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0206980A2 (en) * | 1985-05-22 | 1986-12-30 | Alusuisse-Lonza Services Ag | Heat sink for semiconductor devices and method for manufacturing the same |
JPH06198383A (en) * | 1992-09-21 | 1994-07-19 | Hideaki Serizawa | Heat radiation plate and its production |
JP2002324879A (en) * | 2001-04-24 | 2002-11-08 | Yamazaki Seisakusho:Kk | Heat sink for semiconductor device and manufacturing method therefor |
CN2566344Y (en) * | 2002-06-10 | 2003-08-13 | 双鸿科技股份有限公司 | Base with radiating conduit |
CN2854483Y (en) * | 2005-09-22 | 2007-01-03 | 黄崇贤 | Radiator mould set |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102005391B (en) * | 2009-09-03 | 2012-08-08 | 技嘉科技股份有限公司 | Heat-radiating module and assembling method thereof |
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Publication number | Publication date |
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CN1937903A (en) | 2007-03-28 |
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Effective date of registration: 20190508 Address after: Changling, Tianliao Group, Huzhen Town, Boluo County, Huizhou City, Guangdong Province Patentee after: Tsung-Hsien Huang Address before: Taiwan County, Yilan, China Patentee before: Huang Chongxian |
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Granted publication date: 20090128 |
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