JPS54154290A - Planar semiconductor integrated circuit - Google Patents

Planar semiconductor integrated circuit

Info

Publication number
JPS54154290A
JPS54154290A JP4553679A JP4553679A JPS54154290A JP S54154290 A JPS54154290 A JP S54154290A JP 4553679 A JP4553679 A JP 4553679A JP 4553679 A JP4553679 A JP 4553679A JP S54154290 A JPS54154290 A JP S54154290A
Authority
JP
Japan
Prior art keywords
integrated circuit
semiconductor integrated
planar semiconductor
planar
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4553679A
Other languages
Japanese (ja)
Inventor
Beriotsu Jiyon
Shii Chiyangu Chii
Chiyaarusu Fuotsukusu Berii
Ando Paarumeerii Jiyon
Jiyafugaichi Maajitsudo
Bureisu Muunii Donarudo
Jien Jiyuusen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS54154290A publication Critical patent/JPS54154290A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Geometry or layout of the interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/118—Masterslice integrated circuits
    • H01L27/11801—Masterslice integrated circuits using bipolar technology
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/923—Active solid-state devices, e.g. transistors, solid-state diodes with means to optimize electrical conductor current carrying capacity, e.g. particular conductor aspect ratio

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geometry (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP4553679A 1978-05-25 1979-04-16 Planar semiconductor integrated circuit Pending JPS54154290A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/909,605 US4249193A (en) 1978-05-25 1978-05-25 LSI Semiconductor device and fabrication thereof

Publications (1)

Publication Number Publication Date
JPS54154290A true JPS54154290A (en) 1979-12-05

Family

ID=25427538

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4553679A Pending JPS54154290A (en) 1978-05-25 1979-04-16 Planar semiconductor integrated circuit

Country Status (6)

Country Link
US (1) US4249193A (en)
EP (1) EP0005723B1 (en)
JP (1) JPS54154290A (en)
CA (1) CA1120606A (en)
DE (1) DE2963058D1 (en)
IT (1) IT1165446B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60263444A (en) * 1984-06-12 1985-12-26 Nec Corp Semiconductor device
JPS6144444A (en) * 1984-08-09 1986-03-04 Nec Corp Semiconductor ic

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4295149A (en) * 1978-12-29 1981-10-13 International Business Machines Corporation Master image chip organization technique or method
JPS5775438A (en) * 1980-10-29 1982-05-12 Toshiba Corp Semiconductor element
US4402044A (en) * 1980-11-24 1983-08-30 Texas Instruments Incorporated Microprocessor with strip layout of busses, ALU and registers
JPS57211248A (en) * 1981-06-22 1982-12-25 Hitachi Ltd Semiconductor integrated circuit device
JPS5844743A (en) * 1981-09-10 1983-03-15 Fujitsu Ltd Semiconductor integrated circuit
DE3276284D1 (en) * 1981-09-10 1987-06-11 Fujitsu Ltd Semiconductor integrated circuit comprising a semiconductor substrate and interconnecting layers
JPS5884445A (en) * 1981-11-16 1983-05-20 Hitachi Ltd Large scaled integrated circuit
JPS5890758A (en) * 1981-11-25 1983-05-30 Mitsubishi Electric Corp Complementary type integrated circuit device
FR2524206B1 (en) * 1982-03-26 1985-12-13 Thomson Csf Mat Tel PREDIFFUSED INTEGRATED CIRCUIT, AND METHOD FOR INTERCONNECTING CELLS OF THIS CIRCUIT
US4511914A (en) * 1982-07-01 1985-04-16 Motorola, Inc. Power bus routing for providing noise isolation in gate arrays
JPS5961944A (en) * 1982-09-30 1984-04-09 Fujitsu Ltd Manufacture of master slice integrated circuit
EP0119059B1 (en) * 1983-03-09 1988-10-05 Kabushiki Kaisha Toshiba Semiconductor integrated circuit with gate-array arrangement
US4607339A (en) * 1983-06-27 1986-08-19 International Business Machines Corporation Differential cascode current switch (DCCS) master slice for high efficiency/custom density physical design
US4608649A (en) * 1983-06-27 1986-08-26 International Business Machines Corporation Differential cascode voltage switch (DCVS) master slice for high efficiency/custom density physical design
US4615010A (en) * 1983-06-27 1986-09-30 International Business Machines Corporation Field effect transistor (FET) cascode current switch (FCCS)
US4862231A (en) * 1983-11-18 1989-08-29 Harris Corporation Non-contact I/O signal transmission in integrated circuit packaging
DE3584102D1 (en) * 1984-03-08 1991-10-24 Toshiba Kawasaki Kk INTEGRATED SEMICONDUCTOR CIRCUIT DEVICE.
EP0166027B1 (en) * 1984-06-19 1990-06-13 Siemens Aktiengesellschaft C-mos basic cell
JPH0644593B2 (en) * 1984-11-09 1994-06-08 株式会社東芝 Semiconductor integrated circuit device
US4774559A (en) * 1984-12-03 1988-09-27 International Business Machines Corporation Integrated circuit chip structure wiring and circuitry for driving highly capacitive on chip wiring nets
US4845052A (en) * 1986-02-07 1989-07-04 Harris Corporation Method of packaging a non-contact I/O signal transmission integrated circuit
US4760289A (en) * 1986-08-04 1988-07-26 International Business Machines Corporation Two-level differential cascode current switch masterslice
US4931946A (en) * 1988-03-10 1990-06-05 Cirrus Logic, Inc. Programmable tiles
US5021856A (en) * 1989-03-15 1991-06-04 Plessey Overseas Limited Universal cell for bipolar NPN and PNP transistors and resistive elements
JPH04340252A (en) * 1990-07-27 1992-11-26 Mitsubishi Electric Corp Semiconductor integrated circuit device, arrangement and wiring method of cell
US5703617A (en) * 1993-10-18 1997-12-30 Crystal Semiconductor Signal driver circuit for liquid crystal displays
JPH09139471A (en) * 1995-09-07 1997-05-27 Hewlett Packard Co <Hp> Auxiliary pad for on-circuit-array probing
US5858817A (en) * 1996-10-10 1999-01-12 Lockheed Martin Corporation Process to personalize master slice wafers and fabricate high density VLSI components with a single masking step
CN114442996A (en) * 2020-10-30 2022-05-06 深圳比特微电子科技有限公司 Computing chip, computing force plate and digital currency mining machine

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5125085A (en) * 1974-06-26 1976-03-01 Ibm BUREENAHANDOTAISHUSEKIKAIROCHITSUPUKOZO

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3312871A (en) * 1964-12-23 1967-04-04 Ibm Interconnection arrangement for integrated circuits
US3999214A (en) * 1974-06-26 1976-12-21 Ibm Corporation Wireable planar integrated circuit chip structure
JPS51117588A (en) * 1975-04-09 1976-10-15 Fujitsu Ltd Manufacturing method of semiconductor equipment
US4032962A (en) * 1975-12-29 1977-06-28 Ibm Corporation High density semiconductor integrated circuit layout
DE2643482A1 (en) * 1976-09-27 1978-03-30 Siemens Ag SEMI-CONDUCTOR PLATE FOR MANUFACTURING HIGHLY INTEGRATED COMPONENTS
CA1102009A (en) * 1977-09-06 1981-05-26 Algirdas J. Gruodis Integrated circuit layout utilizing separated active circuit and wiring regions

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5125085A (en) * 1974-06-26 1976-03-01 Ibm BUREENAHANDOTAISHUSEKIKAIROCHITSUPUKOZO

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60263444A (en) * 1984-06-12 1985-12-26 Nec Corp Semiconductor device
JPS6144444A (en) * 1984-08-09 1986-03-04 Nec Corp Semiconductor ic

Also Published As

Publication number Publication date
IT7922195A0 (en) 1979-04-27
US4249193A (en) 1981-02-03
CA1120606A (en) 1982-03-23
IT1165446B (en) 1987-04-22
EP0005723A1 (en) 1979-12-12
EP0005723B1 (en) 1982-06-09
DE2963058D1 (en) 1982-07-29

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