KR960043132A - 엘오씨(loc) 반도체 패키지 및 반도체 장치를 패키징하는 방법 - Google Patents
엘오씨(loc) 반도체 패키지 및 반도체 장치를 패키징하는 방법 Download PDFInfo
- Publication number
- KR960043132A KR960043132A KR1019950011774A KR19950011774A KR960043132A KR 960043132 A KR960043132 A KR 960043132A KR 1019950011774 A KR1019950011774 A KR 1019950011774A KR 19950011774 A KR19950011774 A KR 19950011774A KR 960043132 A KR960043132 A KR 960043132A
- Authority
- KR
- South Korea
- Prior art keywords
- leads
- bonding pads
- busbars
- inner leads
- bus bars
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 49
- 238000000034 method Methods 0.000 claims abstract 7
- 238000004806 packaging method and process Methods 0.000 claims abstract 4
- 239000002390 adhesive tape Substances 0.000 claims 21
- 150000001875 compounds Chemical class 0.000 claims 6
- 239000000853 adhesive Substances 0.000 claims 5
- 230000001070 adhesive effect Effects 0.000 claims 5
- 239000004020 conductor Substances 0.000 claims 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 2
- 238000000465 moulding Methods 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910000881 Cu alloy Inorganic materials 0.000 claims 1
- 229910000640 Fe alloy Inorganic materials 0.000 claims 1
- 229910000990 Ni alloy Inorganic materials 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
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- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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Abstract
상부표면상에 복수개의 본딩패드들을 갖는 반도체 칩; 반도체 칩의 상측에 위치되고 와이어들에 의해 상기 본딩 패드들과 전기적으로 연결되기 위한 복수개의 내부리드들; 각 내부리드들로 부터 연장되어 형성되는 복수개의 외부리드들; 그리고반도체칩의 상측에서 상기 내부리드들보다 낮은 높이로 형성되는 하나 또는 그 이상의 전원공급 및 그라운드용 버스바 또는 버스바들을 구비하는 LOC 반도체 패키지이다.
상부표면에 복수개의 본딩패드를 갖는 반도체 칩을 마련하는 스텝, 복수개의 내부리드들과 이 내부리드들로 부터 연장되는 복수개의 외부리드들을 반도체 칩 상측에 배열하는 스텝; 전원공급 및 그라운드용 버스바들을 반도체 칩의 상측에서 내부리드들보다 낮은 높이로 배열하는 스텝을 구비하는 반도체 장치를 패키징하는 방법이다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제7도는 본 발명의 제1실시예에 따른 반도체 칩이 부착된 상태의 LOC 리드프레임의 구성도, 제8도는 제7도의 A-A'선에 따른 단면도.
Claims (26)
- 상부표면상에 복수개의 본딩패드들을 갖는 반도체 칩; 상기 반도체칩의 상측에 위치되고 와이어들에 의해 상기 본딩패드들과 전기적으로 연결되기 위한 복수개의 내부리드들; 각 내부리드들로 부터 연장되어 형성되는 복수개의 외부리드들; 그리고 상기 반도체칩의 상측에서 상기 내부리드들보다 낮은 높이로 형성되는 하나 또는 그 이상의 전원공급 및 그라운드용 버스바 또는 버스바들로 구성됨을 특징으로 하는 LOC 반도체 패키지.
- 제1항에 있어서, 적어도 하나 이상의 버스바들은 상기 복수개의 내부리드들중 일부로 부터 연장되는 형태로 형성됨을 특징으로 하는 LOC 반도체 패키지.
- 제1항에 있어서, 복수개의 내부리드들의 선단부의 하부표면과 반도체 칩의 상부표면을 부착시키는 절연성양면 접착테이프가 더 구비됨을 특징으로 하는 LOC 반도체 패키지.
- 제3항에 있어서, 절연성 양면 접착테이프의 두께는 상기 버스바와 내부 리드사이의 높이차이와 동일함을특징으로 하는 LOC 반도체 패키지.
- 제3항에 있어서, 상기 절연성 접착테이프는 베이스 필름과 이 베이스 필름의 상부표면과 하부표면에 각각형성된 접착제로 구성됨을 특징으로 하는 LOC 반도체 패키지.
- 제1항에 있어서, 버스바들은 그것의 상부표면과 상기 내부리드들의 하부표면을 부착하고 그것의 하부표면과 반도체칩의 상부표면을 부착하기 위해 상부표면과 하부표면에 각각 절연성 양면 접착테이프를 갖는 것을 특징으로 하는 LOC 반도체 패키지.
- 제6항에 있어서, 버스바들의 상부표면에 형성된 절연성 양면 접착테이프는 상기 내부 리드들과 부착되기위한 위치들에서 아일랜드들의 형태로 형성됨을 특징으로 하는 LOC 반도체 패키지.
- 제6항에 있어서, 버스바들의 상부표면상에 형성된 절연성 양면 접착테이프는 버스바들과 본딩패드들 또는버스바들과 외부리드들과의 와이어 본딩을 위한 복수개의 오픈영역들을 갖는 것을 특징으로 하는 LOC 반도체 패키지.
- 제1항에 있어서, 버스바의 물질로서는 구리, 철과 니켈의 합금(ALLOY 42)및 알루미늄중 하나가 사용됨을특징으로 하는 LOC 반도체 패키지.
- 제1항에 있어서, 상기 내부리드들과 본딩패드들간의 전기적연결, 그리고 버스바들과 본딩패드들 또는 외부리드들간의 전기적 연결을 위한 복수개의 와이어들; 그리고 외부리드들을 제외한 다른 모든 패키지 요소들을 몰드한 콤파운드 바디(body)가 추가로 구비됨을 특징으로 하는 LOC 반도체 패키지.
- 상부표면상에 복수개의 본딩패드들을 갖는 반도체 칩; 반도체 칩의 상측에 형성되는 복수개의 내부리드들; 각 내부리드로부터 연장되어 형성되는 복수개의 외부리드들; 일부 내부리드들로부터 내부리드들과 본딩패드들사이로 연장되어 형성되고, 내리드를 향해 복수개의 돌출부들을 갖으며, 내부리드들보다 낮은 높이로 형성되는 하나 또는 그 이상의 버스바 또는 버스바들; 상기 내부리드들의 선단부의 하부표면과 돌출부들의 하부표면을 반도체 칩의 상부표면과 부착시키기 위한 절연성 양면 접착테이프; 내부리드들과 본딩패드들, 버스바들과 본딩패드들, 또는 외부리드들과 버스바들가늘전기적으로 연결하는 복수개의 와이어들; 그리고 외부리드들은 제외한 상기 모든 패키지 요소들을 몰드한 콤파운드바디로구성됨을 특징으로 하는 LOC 반도체 패키지.
- 제11항에 있어서, 돌출부들은 버스바들로 부터 내부리드를 향해 연장되고 내부리드들과 동일 높이로 형성됨을 특징으로 하는 LOC 반도체 패키지.
- 제11항에 있어서, 내부리드들과 본딩패드들간의 와이어 본딩을 용이하게 하기 위해 상기 내부리드들의 선단부의 상부표면에 코팅되는 복수개의 도전체들이 더 구비됨을 특징으로 하는 LOC 반도체 패키지.
- 제11항에 있어서, 절연성 양면 접착테이프에는 베이스필름과, 베이스필름의 상부표면에 형성된 제1절연접착테이프, 베이스필름의 하부표면에 형성된 제2절연접착테이프로 구성됨을 특징으로 하는 LOC 반도체 패키지.
- 상부표면상에 복수개의 본딩 패드들을 갖는 반도체칩; 반도체칩의 상측에 형성되는 복수개의 내부리드들; 각 내부 리드들로부터 연장되어 형성되는 복수개의 외부리드들; 일부 내부리드들로부터 다른 내부리드들의 선단부의 하측으로 연장되어 형성되는 전원공급 및 그라운드용 하나 또는 그 이상의 버스바 또는 버스바들; 버스바들의 상부표면과 상기 선단부의 하부표면을 부착하고 버스바들과 본딩패드들 또는 버스바들과 외부리드들간의 와이어 본딩을 위해 복수개의오픈영역을 갖는 제1절연접착테이프; 버스바들의 하부표면과 상기 반도체칩의 상부표면을 부착시키기 위한 제2절연접착테이프; 내부리드들과 본딩패드들, 버스바들과 본딩패드들 또는 외부리드들과 버스바들간을 전기적으로 연결하는 복수개의와이어들; 그리고 외부리드들을 제외한 상기 모든 패키지 요소들을 몰드한 콤파운드 바디로 구성됨을 특징으로 하는 LOC반도체 패키지.
- 제15항에 있어서, 상기 내부리드들의 선단부의 상부표면에는 내부리드들과 본딩패드들간의 와이어 본딩을 용이하게 하기위해 코팅되는 복수개의 도전체들이 더 구비됨을 특징으로 하는 LOC 반도체 패키지.
- 제15항에 있어서, 상기 제절연접착테이프와 제2절연접착테이프 및 버스바들은 일체의 구조로 형성됨을 특징으로 하는 LOC 반도체 패키지.
- 상부표면상에 복수개의 본딩패드들을 갖는 반도체 칩; 반도체칩의 상측에 형성되는 복수개의 내부리드들; 각 내부리드로 부터 연장되어 형성되는 복수개의 외부리드들; 일부 내부리드들로 부터 다른 내부리드들의 선단부의 하측으로 연장되어 형성되는 전원공급 및 그라운드용 하나 또는 그 이상의 버스바 또는 버스바들; 버스바들의 상부표면상에 형성되고 내부리드들의 선단부 하부표면과 버스바들의 상부표면을 부착하기 위한 복수개의 절연성 접착 아일랜드들; 버스바들의 하부표면과 상기 반도체 칩의 상부표면을 부착시키기 위한 절연접착테이프; 내부리드들과 본딩패드들, 버스바들과본딩패드들 또는 외부리드들과 버스바들간을 전기적으로 연결하는 복수개의 와이어들; 그리고 외부리드들을 제외한 상기모든 패키지 요소들을 몰드한 콤파운드 바디로 구성됨을 특징으로 하는 LOC 반도체 패키지.
- 제18항에 있어서, 상기 내부리드들의 선단부의 상부표면에는 내부리드들과 본딩패드들간의 와이어 본딩을 용이하게 하기위해 코팅된 복수개의 도전체들이 더 구비됨을 특징으로 하는 LOC 반도체 패키지.
- 제18항에 있어서, 상기 절연성 접착 아일랜드들과, 버스바들 및 절연접착테이프는 일체의 구조로 형성됨을 특징으로 하는 LOC 반도체 패키지.
- 상부표면상에 복수개의 본딩패드를 갖는 반도체칩을 마련하는 스텝; 복수개의 내부리드들과 이 내부리드들로 부터 연장되는 복수개의 외부리드들을 상기 반도체 칩 상측에 배열하는 스텝; 전원 공급 및 그라운드용 버스바들을 반도체칩의 상측에서 내부리드들보다 낮은 높이로 배열하는 스텝을 구비함을 특징으로 하는 반도체장치를 패키징하는 방법.
- 제21항에 있어서, 상기 버스바들은 일부 내부리드들로 부터 연장되어 내부리드들의 선단부의 하측에 배열됨을 특징으로 하는 반도체장치를 패키징하는 방법.
- 제21항에 있어서, 상기 버스바들은 일부 내부리드들로 부터 연장되어 내부리드들과 본딩패드들 사이에 배열됨을 특징으로 하는 반도체 장치를 패키징하는 방법.
- 제21항에 있어서, 복수개의 오픈영역을 갖는 절연접착테이프를 이용하여 상기 버스바들의 상부표면과 상기 내부리드들의 선단부 하부표면을 부착하는 스텝; 절연접착테이프를 이용하여 상기 버스바들의 하부표면과 반도체칩의상부표면을 부착하는 스텝; 상기 오픈영역들을 통해 외부리드들과 버스바들 또는 본딩패드들과 버스바들간을 와이어 본딩하고 내부리드들과 본딩패드들간을 와이어 본딩하는 스텝; 그리고 외부 리드들을 제외한 모든 반도체 패키징 요소들을 콤파운드로 몰딩하는 스텝이 더 구비됨을 특징으로 하는 반도체 장치를 패키징하는 방법.
- 제21항에 있어서, 상기 버스바들상에 복수개의 절연접착 아일랜드들을 형성하는 스텝; 상기 절연 접착아일랜드들에 의해 상기 내부리드들의 선단부의 하부표면을 버스바들상에 부착하는 스텝; 상기 버스바들의 하부표면상에 절연접착테이프를 형성하는 스텝; 상기 절연 접착테이프를 이용하여 반도체 칩의 상부표면과 버스바들의 하부표면을 부착하는스텝; 버스바들의 노출된 표면과 본딩 패드들 또는 외부 리드들을 와이어 본딩하고 내부 리드들과 본딩 패드들을 와이어본딩하는 스텝; 그리고 외부리드들을 제외한 나머지 반도체 패키징 요소들을 콤파운드로 몰딩하는 스텝을 구비함을 특징으로 하는 반도체 장치를 패키징하는 방법.
- 제21항에 있어서, 상기 내부 리드들의 선단부의 하부표면과 버스바들의 일부 하부표면을 절연성 양면 접착테이프로 반도체 칩의 상부표면상에 부착하는 스텝이 더 구비됨을 특징으로 하는 반도체 장치를 패키징하는 방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Priority Applications (4)
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KR1019950011774A KR0144164B1 (ko) | 1995-05-12 | 1995-05-12 | 엘오씨 반도체 패키지 및 반도체 장치를 패키징하는 방법 |
US08/510,233 US5821605A (en) | 1995-05-12 | 1995-08-02 | LOC semiconductor package |
JP8034266A JP2799850B2 (ja) | 1995-05-12 | 1996-01-30 | Loc半導体パッケージ及び半導体装置のパッケージング方法 |
US09/023,707 US6066887A (en) | 1995-05-12 | 1998-02-13 | LOC semiconductor package |
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KR1019950011774A KR0144164B1 (ko) | 1995-05-12 | 1995-05-12 | 엘오씨 반도체 패키지 및 반도체 장치를 패키징하는 방법 |
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KR960043132A true KR960043132A (ko) | 1996-12-23 |
KR0144164B1 KR0144164B1 (ko) | 1998-07-01 |
Family
ID=19414347
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950011774A KR0144164B1 (ko) | 1995-05-12 | 1995-05-12 | 엘오씨 반도체 패키지 및 반도체 장치를 패키징하는 방법 |
Country Status (3)
Country | Link |
---|---|
US (2) | US5821605A (ko) |
JP (1) | JP2799850B2 (ko) |
KR (1) | KR0144164B1 (ko) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6667560B2 (en) | 1996-05-29 | 2003-12-23 | Texas Instruments Incorporated | Board on chip ball grid array |
JPH10214933A (ja) * | 1997-01-29 | 1998-08-11 | Toshiba Corp | 半導体装置とその製造方法 |
JP3638750B2 (ja) * | 1997-03-25 | 2005-04-13 | 株式会社ルネサステクノロジ | 半導体装置 |
JP3611948B2 (ja) * | 1997-05-16 | 2005-01-19 | 日本テキサス・インスツルメンツ株式会社 | 半導体装置及びその製造方法 |
US6580157B2 (en) * | 1997-06-10 | 2003-06-17 | Micron Technology, Inc. | Assembly and method for modified bus bar with Kapton™ tape or insulative material in LOC packaged part |
US5780923A (en) * | 1997-06-10 | 1998-07-14 | Micron Technology, Inc. | Modified bus bar with Kapton™ tape or insulative material on LOC packaged part |
JP3036498B2 (ja) * | 1997-12-08 | 2000-04-24 | 日本電気株式会社 | 半導体パッケージ |
KR20010022174A (ko) * | 1997-08-29 | 2001-03-15 | 가나이 쓰토무 | 반도체 장치 및 그 제조방법 |
US6515359B1 (en) * | 1998-01-20 | 2003-02-04 | Micron Technology, Inc. | Lead frame decoupling capacitor semiconductor device packages including the same and methods |
US6610561B2 (en) | 1998-02-27 | 2003-08-26 | Hitachi, Ltd. | Method of fabricating a semiconductor device |
JPH11251506A (ja) * | 1998-02-27 | 1999-09-17 | Hitachi Ltd | 半導体装置およびその製造方法 |
JP3314754B2 (ja) * | 1999-04-22 | 2002-08-12 | 松下電器産業株式会社 | 鉛を含まない錫ベース半田皮膜を有する半導体装置およびその製造方法 |
US6265761B1 (en) | 1999-05-07 | 2001-07-24 | Maxim Integrated Products, Inc. | Semiconductor devices with improved lead frame structures |
US6534861B1 (en) | 1999-11-15 | 2003-03-18 | Substrate Technologies Incorporated | Ball grid substrate for lead-on-chip semiconductor package |
JP2001156237A (ja) * | 1999-11-25 | 2001-06-08 | Mitsubishi Electric Corp | リードフレーム及びそれを用いた樹脂封止型半導体装置 |
US7550842B2 (en) * | 2002-12-12 | 2009-06-23 | Formfactor, Inc. | Integrated circuit assembly |
JP4130167B2 (ja) * | 2003-10-06 | 2008-08-06 | 日東電工株式会社 | 半導体ウエハの剥離方法 |
TW200814247A (en) * | 2006-09-12 | 2008-03-16 | Chipmos Technologies Inc | Stacked chip package structure with lead-frame having bus bar with transfer pad |
US8264072B2 (en) | 2007-10-22 | 2012-09-11 | Infineon Technologies Ag | Electronic device |
WO2011040911A1 (en) * | 2009-09-30 | 2011-04-07 | Colgate-Palmolive Company | Antiperspirant/deodorant composition |
US9607953B1 (en) * | 2016-02-24 | 2017-03-28 | Nxp Usa, Inc. | Semiconductor package with isolation wall |
US10787303B2 (en) | 2016-05-29 | 2020-09-29 | Cellulose Material Solutions, LLC | Packaging insulation products and methods of making and using same |
US11078007B2 (en) | 2016-06-27 | 2021-08-03 | Cellulose Material Solutions, LLC | Thermoplastic packaging insulation products and methods of making and using same |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS595653A (ja) * | 1982-07-02 | 1984-01-12 | Nippon Steel Corp | 含クロム鋼基材リ−ドフレ−ム |
JPH0758753B2 (ja) * | 1986-02-20 | 1995-06-21 | 日本電気株式会社 | リードフレーム |
JP2567961B2 (ja) * | 1989-12-01 | 1996-12-25 | 株式会社日立製作所 | 半導体装置及びリ−ドフレ−ム |
US5227232A (en) * | 1991-01-23 | 1993-07-13 | Lim Thiam B | Conductive tape for semiconductor package, a lead frame without power buses for lead on chip package, and a semiconductor device with conductive tape power distribution |
JP2518569B2 (ja) * | 1991-09-19 | 1996-07-24 | 三菱電機株式会社 | 半導体装置 |
US5286999A (en) * | 1992-09-08 | 1994-02-15 | Texas Instruments Incorporated | Folded bus bar leadframe |
JPH06283659A (ja) * | 1993-03-25 | 1994-10-07 | Mitsubishi Electric Corp | 半導体装置 |
JPH08255866A (ja) * | 1995-03-16 | 1996-10-01 | Fujitsu Ltd | 半導体装置とその製造方法 |
-
1995
- 1995-05-12 KR KR1019950011774A patent/KR0144164B1/ko not_active IP Right Cessation
- 1995-08-02 US US08/510,233 patent/US5821605A/en not_active Expired - Lifetime
-
1996
- 1996-01-30 JP JP8034266A patent/JP2799850B2/ja not_active Expired - Fee Related
-
1998
- 1998-02-13 US US09/023,707 patent/US6066887A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR0144164B1 (ko) | 1998-07-01 |
JPH08316405A (ja) | 1996-11-29 |
US5821605A (en) | 1998-10-13 |
JP2799850B2 (ja) | 1998-09-21 |
US6066887A (en) | 2000-05-23 |
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