KR970067781A - 반도체 장치와 그의 제조방법 및 집합형 반도체 장치 - Google Patents

반도체 장치와 그의 제조방법 및 집합형 반도체 장치 Download PDF

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KR970067781A
KR970067781A KR1019970008969A KR19970008969A KR970067781A KR 970067781 A KR970067781 A KR 970067781A KR 1019970008969 A KR1019970008969 A KR 1019970008969A KR 19970008969 A KR19970008969 A KR 19970008969A KR 970067781 A KR970067781 A KR 970067781A
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South Korea
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semiconductor device
semiconductor
spot
leads
semiconductor element
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KR1019970008969A
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신지 오우찌
야스시 시라이시
히로시 가와노
에쓰오 야마다
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사와무라 시꼬
오끼 덴끼 고오교 가부시끼가이샤
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Publication of KR970067781A publication Critical patent/KR970067781A/ko

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Abstract

수지밀봉형 반도체 장치와 그의 제조 방법 및 그의 패키징 구조는 반도체 장치를 소형화 할 수 있으며 고밀도형 패키징을 얻을 수 있게 한다, 이것을 위하여, 외면에 노출된 리드를 갖는 수지밀봉형 반도체 장치에는, 그들 사이에 삽입된 절연성 접착 테이프를 갖는 반도체 소자의 회로 형성 표면에 접착되어 있으며, 내부에 반도체 소자가 배치되어 있으면서 각각이 독립적이며 규칙적으로 정렬되며, 외부로 노출된 리드가 설치되어 있다.

Description

반도체 장치와 그의 제조방법 및 집합형 반도체 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
도 1 은 본 발명의 제 1 실시예를 보여주는 수지밀봉형 반도체 장치의 단면도이다.

Claims (16)

  1. 반도체 회로로 형성된 반도체 소자와, 상기 반도체 회로로 형성된 표면의 상층에 설치된 절연성 접착 테이프로 구성된 절연층과, 상기 절연층의 상층에 전기적으로 독립적이며 규칙적으로 각각 배치되며,표면이 외부로 노출되어 있는 다수의 스폿 리드와, 적어도 상기 절연층과 상기 반도체 소자의 측면에 형성된 몰드 수지부를 구비하는 것을 특징으로 하는 반도체 장치.
  2. 제1항에 있어서, 상기 스폿 리드와 상기 반도체 회로로 형성된 표면 사이에 상기 절연층이 설치되지 않은 부분에 설치되어 있는 금속 범프를 또한 구비하는 것을 특징으로 하는 반도체 장치.
  3. 제1항에 있어서, 적어도 상기 스폿 리드의 노출된 외부면이 금속 도금으로 피복되는 것을 특징으로 하는 반도체 장치.
  4. 제1항에 있어서, 상기 스폿 리드와 독립적이며 상기 스폿 리드와 동일한 부재로 구성된 지지체부가 상기 절연층의 상층에 설치되는 것을 특징으로 하는 반도체 장치.
  5. 제4항에 있어서, 상기 스폿 리드와 상기 지지체부가 상기 스폿 리드로부터 연속으로 형성된 리드 프레임을 절단함으로써 상호 독립되는 것을 특징으로 하는 반도체 장치.
  6. 제2항에 있어서, 상기 스폿 리드는 연장 리드를 포함하며, 상기 연장 리드의 선단부 혹은 중간부에서 상기 금속 범프를 통하여 상기 반도체 소자와 전기적으로 접속되는 것을 특징으로 하는 반도체 장치.
  7. (a) 절연성 접착 테이프를 사용함으로써 리드 프레임 내의 지지체 부분에 다수의 스폿 리드의 적어도 한 표면을 고정적으로 접착시키는 단계와, (b) 상기 다수의 스폿 리드를 상기 리드 프레임으로부터 분리하는 단계를 구비하는 것을 특징으로 하는 수지밀봉형 반도체 장치의 제조 방법.
  8. (a) 절연성 접착 테이프의 사용에 의해서 다수의 스폿 리드의 한 표면에 금속 도금 한 후 다수의 스폿 리드를 리드 프레임 내의 지지체 부분에 고정적으로 접착시키는 단계와, (b) 상기 다수의 스폿 리드를 상기 리드 프레임으로부터 분리하는 단계와, (c) 상기 접착 테이프의 다른 표면에 반도체 소자를 접착시키고, 상기 반도체 소자를 몰드 수지로 수지 밀봉하는 단계를 구비하는 것을 특징으로 하는 수지밀봉형 반도체 장치의 제조 방법.
  9. 반도체 회로로 형성된 반도체 소자와, 상기 반도체 회로로 형성된 표면의 상층에 설치된 절연성 접착테이프로 구성되어 있는 절연층과, 그들 표면이 외부에 노출되어 있으며 그들의 선단이 상기 반도체 소자의 외측부로부터 L 형으로 아래로 연장되어 있는 상태로, 상기 절연층의 상층에 전기적으로 독립적이며 규칙적으로 각각 배치되어 있는 다수의 스폿 리드와, 적어도 상기 절연층과 상기 반도체 소자의 측면에 형성된 몰드 수지부를 구비하는 것을 특징으로 하는 반도체 장치.
  10. (a) 절연성 접착 테이프를 사용함으로써 리드 프레임 내의 다수의 스폿 리드의 한 표면에 고정적으로 접착시키는 단계와, (b) 상기 접착 테이프의 다른 표면에 상기 반도체 소자를 접착하고 상기 반도체 소자를 수지로 밀봉하는 단계와, (c) 상기 다수의 스폿 리드를 상기 리드 프레임으로부터 분리하고, 상기 반도체 소자의 외측부로부터 L 형으로 아래로 상기 스폿 리드의 선단을 굽히는 단계를 구비하는 것을 특징으로 하는 반도체 장치를 제조하는 방법.
  11. 몰드 수지부 내의 반도체 소자의 상부면으로부터 외부로 노출되어 있으며, 선단이 상기 반도체 소자의 외측부로부터 아래로 연장되어 있는 다수의 L 형 리드를 포함하는 다수의 반도체 장치를 나란히 배치하고, 상기 L 형 리드를 상호 접속하는 단계와, 배선 기판 상에 설치된 동일한 푸트 패턴으로 상기 L 형 리드의 접속부분을 접속하는 단계를 구비하는 것을 특징으로 하는 반도체 장치의 패키징.
  12. 몰드 수지부 내의 반도체 소자의 상부면으로부터 외부로 노출되고, 상기 반도체 소자의 외측부로부터 아래로 연장되어 있는 다수의 L 형 리드를 포함하는 다수의 반도체 장치를 구비하며, 상기 다수의 반도체 장치를 마주보게 배치하여서 상기 L 형 리드의 선단이 상호 마주보도록 하며, 상기 L 형 리드의 선단이 상호 접속되는 것을 특징으로 하는 집합형 반도체 장치.
  13. 제12항에 있어서, 수지 패키지는 상기 다수의 반도체 장치내의 몰드 수지로 각각 구성되며, 상기 수지 패키지의 저면이 접착제를가지고 상호 고정되는 것을 특징으로 하는 집합형 반도체 장치.
  14. 몰드 수지부 내의 반도체 소자의 상부면으로부터 외부로 노출되고, 상기 반도체 소자의 외측부로부터 아래로 연장되어 있는 다수의 L 형 리드를 포함하는 다수의 반도체 장치를 구비하며, 상기 다수의 반도체 장치가 상기 L 형 리드의 선단들이 상호 동일한 방향으로 설정되도록 적층되는 것을 것을 특징으로 하는 집합형 반도체 장치.
  15. 제 14 항에 있어서, 상기 다수의 적층된 반도체 장치에서 상기 상부 반도체 장치의 상기 L 형 리드가 상기 하부 반도체 장치의 상기 L 형 리드의 굽은 부분과 접속되는 것을 특징으로 하는 집합형 반도체 장치.
  16. 제 14 항에 있어서, 수지 패키지가 상기 다수의 반도체 장치에 있는 몰드 수지로 각각 구성되며, 접착제를 사용함으로써 상기 상부 반도체 장치의 수지 패키지의 저면이 상기 하부 반도체 장치의 수지 패키지의 상부면에 고정되는 것을 특징으로 하는 집합형 반도체 장치.
KR1019970008969A 1996-03-27 1997-03-17 반도체 장치와 그의 제조방법 및 집합형 반도체 장치 KR970067781A (ko)

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EP0798780A2 (en) 1997-10-01
JPH09260538A (ja) 1997-10-03
US6208021B1 (en) 2001-03-27
CN1151554C (zh) 2004-05-26
EP0798780A3 (en) 2000-09-13
CN1167339A (zh) 1997-12-10
US6403398B2 (en) 2002-06-11
US20010001217A1 (en) 2001-05-17

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