KR970705804A - 캐리어 요소(support element) - Google Patents

캐리어 요소(support element) Download PDF

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KR970705804A
KR970705804A KR1019970701474A KR19970701474A KR970705804A KR 970705804 A KR970705804 A KR 970705804A KR 1019970701474 A KR1019970701474 A KR 1019970701474A KR 19970701474 A KR19970701474 A KR 19970701474A KR 970705804 A KR970705804 A KR 970705804A
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contact
carrier element
element according
coil
connection
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KR1019970701474A
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KR100358786B1 (ko
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요제프 문디글
요제프 키르쉬바우어
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로더리히 네테부쉬; 롤프 옴케
지멘스 악티엔게젤샤프트
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773Antenna details
    • G06K19/07777Antenna details the antenna being of the inductive type
    • G06K19/07779Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773Antenna details
    • G06K19/07777Antenna details the antenna being of the inductive type
    • G06K19/07779Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
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    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/4501Shape
    • H01L2224/45012Cross-sectional shape
    • H01L2224/45014Ribbon connectors, e.g. rectangular cross-section
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    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2224/4809Loop shape
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    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
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    • H01L2224/73265Layer and wire connectors
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    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
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    • H01L2924/151Die mounting substrate
    • H01L2924/153Connection portion
    • H01L2924/1531Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
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    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
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Abstract

칩 카드에 결합하기 위한 캐리어 요소는 컨덕터 캐리어(1)에 배치되면서, 그의 접촉 탭(5,6:5,7)에 전기적으로 연결되는 반도체 칩(2)을 갖는데, 최소한의 반도체 칩(2)과, 상기 접촉 탭(5,6:5,7)과 상기 반도체 칩(2)의 연결을 위해 제공된 본드-와이어(3)는 상기 접촉 탭이 상기 반도체 칩(2)과의 전도성 연결로 인해 플라스틱 화합물(4)로부터 빠져나오도록 플라스틱 화합물(4)에 의해 둘러쌓이게 된다. 상기 접촉 탭은 상기 플라스틱 화합물(4)의 표면중 한 표면에서 접촉 영역을 형성하며, 상기 접촉 탭중 적어도 2개 접촉 탭은 상기 접촉 영역(5)의 연장부에서 안테나 코일의 단부를 위한 연결부(6:7)를 형성한다.

Description

캐리어 요소(SUPPORT ELEMENT)
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도 및 제2도는 본 발명에 따른 캐리어 요소를 통해서 본 단면도, 제2도는 설치된 캐리어 요소의 공간적인 도면, 제3도는 설치된 캐리어 요소의 공간적인 도면.

Claims (7)

  1. 칩 카드에 결합하기 위한 캐리어 요소는 컨덕터 캐리어(1)에 배치되면서, 그의 접촉 탭(5,6:5,7)에 전기적으로 연결되는 반도체 칩(2)을 갖는데, 상기 최소한의 반도체 칩(2)과, 상기 접촉 탭(5,6:5,7)과 상기 반도체 칩(2)의 연결을 위해 제공된 본드-와이어(3)는 상기 접촉 탭(5,6:5,7)이 상기 반도체 칩(2)과의 전도성 연결로 인해 플라스틱 화합물(4)로부터 빠져나오도록 플라스틱 화합물(4)에 의해 둘러쌓이게 되는 캐리어 요소에 있어서, 상기 접촉 탭은 상기 플라스틱 화합물(4)의 표면중 한 표면에서 접촉 영역을 형성하며, 상기 접촉 탭중 적어도 2개의 접촉 탭은 상기 접촉 영역(5)의 연장부에서 안테나 코일의 단부를 위한 연결부(6:7)를 형성하는 것을 특징으로 하는 캐리어 요소.
  2. 제1항에 있어서, 상기 적어도 2개 접촉 탭의 코일 연결부(6:7)는 서로 다른 길이를 갖는 것을 특징으로 하는 캐리어 요소.
  3. 제1항 또는 제2항에 있어서, 상기 적어도 2개 접촉 탭의 코일 연결부(6:7)는 상기 캐리어 요소의 반대측에 배치되는 것을 특징으로 하는 캐리어 요소.
  4. 제1항 또는 제2항에 있어서, 상기 적어도 2개 접촉 탭의 코일 연결부는 서로 평행하게 배치되는 것을 특징으로 하는 캐리어 요소.
  5. 제1항 또는 제2항에 있어서, 상기 적어도 2개 접촉 탭의 코일 연결부(6:7)는 서로 직각으로 배치되는 것을 특징으로 하는 캐리어 요소.
  6. 제1항 내지 제5항 중 어느 한 항에 있어서, 상기 적어도 2개 접촉 탭의 접촉 영역(5)과 코일 연결부(7)는 한면에 놓이는 것을 특징으로 하는 캐리어 요소.
  7. 제1항 내지 제5항 중 어느 한 항에 있어서, 상기 적어도 2개 접촉 탭의 접촉 영역(5)과 코일 연결부(6)는 서로 다른면에 놓이는 것을 특징으로 하는 캐리어 요소.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019970701474A 1994-09-06 1995-09-05 캐리어엘리먼트 KR100358786B1 (ko)

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DEP4431754.9 1994-09-06
DE4431754A DE4431754C1 (de) 1994-09-06 1994-09-06 Trägerelement

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KR100358786B1 KR100358786B1 (ko) 2003-04-23

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EP (1) EP0780005B1 (ko)
JP (1) JP2785232B2 (ko)
KR (1) KR100358786B1 (ko)
CN (1) CN1110771C (ko)
AT (1) ATE173552T1 (ko)
DE (2) DE4431754C1 (ko)
ES (1) ES2125649T3 (ko)
RU (1) RU2124756C1 (ko)
WO (1) WO1996007983A1 (ko)

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DE59504284D1 (de) 1998-12-24
KR100358786B1 (ko) 2003-04-23
ATE173552T1 (de) 1998-12-15
CN1110771C (zh) 2003-06-04
RU2124756C1 (ru) 1999-01-10
ES2125649T3 (es) 1999-03-01
DE4431754C1 (de) 1995-11-23
EP0780005A1 (de) 1997-06-25
EP0780005B1 (de) 1998-11-18
WO1996007983A1 (de) 1996-03-14
CN1160449A (zh) 1997-09-24
JP2785232B2 (ja) 1998-08-13

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