KR970705804A - 캐리어 요소(support element) - Google Patents

캐리어 요소(support element) Download PDF

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KR970705804A
KR970705804A KR1019970701474A KR19970701474A KR970705804A KR 970705804 A KR970705804 A KR 970705804A KR 1019970701474 A KR1019970701474 A KR 1019970701474A KR 19970701474 A KR19970701474 A KR 19970701474A KR 970705804 A KR970705804 A KR 970705804A
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South Korea
Prior art keywords
contact
carrier element
element according
coil
connection
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KR1019970701474A
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KR100358786B1 (ko
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요제프 문디글
요제프 키르쉬바우어
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로더리히 네테부쉬; 롤프 옴케
지멘스 악티엔게젤샤프트
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Publication of KR970705804A publication Critical patent/KR970705804A/ko
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
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    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
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    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45014—Ribbon connectors, e.g. rectangular cross-section
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01—ELECTRIC ELEMENTS
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    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract

칩 카드에 결합하기 위한 캐리어 요소는 컨덕터 캐리어(1)에 배치되면서, 그의 접촉 탭(5,6:5,7)에 전기적으로 연결되는 반도체 칩(2)을 갖는데, 최소한의 반도체 칩(2)과, 상기 접촉 탭(5,6:5,7)과 상기 반도체 칩(2)의 연결을 위해 제공된 본드-와이어(3)는 상기 접촉 탭이 상기 반도체 칩(2)과의 전도성 연결로 인해 플라스틱 화합물(4)로부터 빠져나오도록 플라스틱 화합물(4)에 의해 둘러쌓이게 된다. 상기 접촉 탭은 상기 플라스틱 화합물(4)의 표면중 한 표면에서 접촉 영역을 형성하며, 상기 접촉 탭중 적어도 2개 접촉 탭은 상기 접촉 영역(5)의 연장부에서 안테나 코일의 단부를 위한 연결부(6:7)를 형성한다.

Description

캐리어 요소(SUPPORT ELEMENT)
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도 및 제2도는 본 발명에 따른 캐리어 요소를 통해서 본 단면도, 제2도는 설치된 캐리어 요소의 공간적인 도면, 제3도는 설치된 캐리어 요소의 공간적인 도면.

Claims (7)

  1. 칩 카드에 결합하기 위한 캐리어 요소는 컨덕터 캐리어(1)에 배치되면서, 그의 접촉 탭(5,6:5,7)에 전기적으로 연결되는 반도체 칩(2)을 갖는데, 상기 최소한의 반도체 칩(2)과, 상기 접촉 탭(5,6:5,7)과 상기 반도체 칩(2)의 연결을 위해 제공된 본드-와이어(3)는 상기 접촉 탭(5,6:5,7)이 상기 반도체 칩(2)과의 전도성 연결로 인해 플라스틱 화합물(4)로부터 빠져나오도록 플라스틱 화합물(4)에 의해 둘러쌓이게 되는 캐리어 요소에 있어서, 상기 접촉 탭은 상기 플라스틱 화합물(4)의 표면중 한 표면에서 접촉 영역을 형성하며, 상기 접촉 탭중 적어도 2개의 접촉 탭은 상기 접촉 영역(5)의 연장부에서 안테나 코일의 단부를 위한 연결부(6:7)를 형성하는 것을 특징으로 하는 캐리어 요소.
  2. 제1항에 있어서, 상기 적어도 2개 접촉 탭의 코일 연결부(6:7)는 서로 다른 길이를 갖는 것을 특징으로 하는 캐리어 요소.
  3. 제1항 또는 제2항에 있어서, 상기 적어도 2개 접촉 탭의 코일 연결부(6:7)는 상기 캐리어 요소의 반대측에 배치되는 것을 특징으로 하는 캐리어 요소.
  4. 제1항 또는 제2항에 있어서, 상기 적어도 2개 접촉 탭의 코일 연결부는 서로 평행하게 배치되는 것을 특징으로 하는 캐리어 요소.
  5. 제1항 또는 제2항에 있어서, 상기 적어도 2개 접촉 탭의 코일 연결부(6:7)는 서로 직각으로 배치되는 것을 특징으로 하는 캐리어 요소.
  6. 제1항 내지 제5항 중 어느 한 항에 있어서, 상기 적어도 2개 접촉 탭의 접촉 영역(5)과 코일 연결부(7)는 한면에 놓이는 것을 특징으로 하는 캐리어 요소.
  7. 제1항 내지 제5항 중 어느 한 항에 있어서, 상기 적어도 2개 접촉 탭의 접촉 영역(5)과 코일 연결부(6)는 서로 다른면에 놓이는 것을 특징으로 하는 캐리어 요소.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019970701474A 1994-09-06 1995-09-05 캐리어엘리먼트 KR100358786B1 (ko)

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Application Number Priority Date Filing Date Title
DEP4431754.9 1994-09-06
DE4431754A DE4431754C1 (de) 1994-09-06 1994-09-06 Trägerelement

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KR970705804A true KR970705804A (ko) 1997-10-09
KR100358786B1 KR100358786B1 (ko) 2003-04-23

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EP (1) EP0780005B1 (ko)
JP (1) JP2785232B2 (ko)
KR (1) KR100358786B1 (ko)
CN (1) CN1110771C (ko)
AT (1) ATE173552T1 (ko)
DE (2) DE4431754C1 (ko)
ES (1) ES2125649T3 (ko)
RU (1) RU2124756C1 (ko)
WO (1) WO1996007983A1 (ko)

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DE19534480C2 (de) 1995-09-18 1999-11-11 David Finn IC-Kartenmodul zur Herstellung einer IC-Karte sowie IC-Karte mit einem IC-Kartenmodul
DE19610507C2 (de) * 1996-03-15 1997-12-04 David Finn Chipkarte
DE19654902C2 (de) * 1996-03-15 2000-02-03 David Finn Chipkarte
DE19639025C2 (de) * 1996-09-23 1999-10-28 Siemens Ag Chipmodul und Verfahren zur Herstellung eines Chipmoduls
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DE59504284D1 (de) 1998-12-24
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ATE173552T1 (de) 1998-12-15
CN1110771C (zh) 2003-06-04
RU2124756C1 (ru) 1999-01-10
ES2125649T3 (es) 1999-03-01
DE4431754C1 (de) 1995-11-23
EP0780005A1 (de) 1997-06-25
EP0780005B1 (de) 1998-11-18
WO1996007983A1 (de) 1996-03-14
CN1160449A (zh) 1997-09-24
JP2785232B2 (ja) 1998-08-13

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