KR970705804A - 캐리어 요소(support element) - Google Patents
캐리어 요소(support element) Download PDFInfo
- Publication number
- KR970705804A KR970705804A KR1019970701474A KR19970701474A KR970705804A KR 970705804 A KR970705804 A KR 970705804A KR 1019970701474 A KR1019970701474 A KR 1019970701474A KR 19970701474 A KR19970701474 A KR 19970701474A KR 970705804 A KR970705804 A KR 970705804A
- Authority
- KR
- South Korea
- Prior art keywords
- contact
- carrier element
- element according
- coil
- connection
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
- G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45014—Ribbon connectors, e.g. rectangular cross-section
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Computer Networks & Wireless Communication (AREA)
- Manufacturing & Machinery (AREA)
- Credit Cards Or The Like (AREA)
- Semiconductor Integrated Circuits (AREA)
- Wire Bonding (AREA)
Abstract
칩 카드에 결합하기 위한 캐리어 요소는 컨덕터 캐리어(1)에 배치되면서, 그의 접촉 탭(5,6:5,7)에 전기적으로 연결되는 반도체 칩(2)을 갖는데, 최소한의 반도체 칩(2)과, 상기 접촉 탭(5,6:5,7)과 상기 반도체 칩(2)의 연결을 위해 제공된 본드-와이어(3)는 상기 접촉 탭이 상기 반도체 칩(2)과의 전도성 연결로 인해 플라스틱 화합물(4)로부터 빠져나오도록 플라스틱 화합물(4)에 의해 둘러쌓이게 된다. 상기 접촉 탭은 상기 플라스틱 화합물(4)의 표면중 한 표면에서 접촉 영역을 형성하며, 상기 접촉 탭중 적어도 2개 접촉 탭은 상기 접촉 영역(5)의 연장부에서 안테나 코일의 단부를 위한 연결부(6:7)를 형성한다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도 및 제2도는 본 발명에 따른 캐리어 요소를 통해서 본 단면도, 제2도는 설치된 캐리어 요소의 공간적인 도면, 제3도는 설치된 캐리어 요소의 공간적인 도면.
Claims (7)
- 칩 카드에 결합하기 위한 캐리어 요소는 컨덕터 캐리어(1)에 배치되면서, 그의 접촉 탭(5,6:5,7)에 전기적으로 연결되는 반도체 칩(2)을 갖는데, 상기 최소한의 반도체 칩(2)과, 상기 접촉 탭(5,6:5,7)과 상기 반도체 칩(2)의 연결을 위해 제공된 본드-와이어(3)는 상기 접촉 탭(5,6:5,7)이 상기 반도체 칩(2)과의 전도성 연결로 인해 플라스틱 화합물(4)로부터 빠져나오도록 플라스틱 화합물(4)에 의해 둘러쌓이게 되는 캐리어 요소에 있어서, 상기 접촉 탭은 상기 플라스틱 화합물(4)의 표면중 한 표면에서 접촉 영역을 형성하며, 상기 접촉 탭중 적어도 2개의 접촉 탭은 상기 접촉 영역(5)의 연장부에서 안테나 코일의 단부를 위한 연결부(6:7)를 형성하는 것을 특징으로 하는 캐리어 요소.
- 제1항에 있어서, 상기 적어도 2개 접촉 탭의 코일 연결부(6:7)는 서로 다른 길이를 갖는 것을 특징으로 하는 캐리어 요소.
- 제1항 또는 제2항에 있어서, 상기 적어도 2개 접촉 탭의 코일 연결부(6:7)는 상기 캐리어 요소의 반대측에 배치되는 것을 특징으로 하는 캐리어 요소.
- 제1항 또는 제2항에 있어서, 상기 적어도 2개 접촉 탭의 코일 연결부는 서로 평행하게 배치되는 것을 특징으로 하는 캐리어 요소.
- 제1항 또는 제2항에 있어서, 상기 적어도 2개 접촉 탭의 코일 연결부(6:7)는 서로 직각으로 배치되는 것을 특징으로 하는 캐리어 요소.
- 제1항 내지 제5항 중 어느 한 항에 있어서, 상기 적어도 2개 접촉 탭의 접촉 영역(5)과 코일 연결부(7)는 한면에 놓이는 것을 특징으로 하는 캐리어 요소.
- 제1항 내지 제5항 중 어느 한 항에 있어서, 상기 적어도 2개 접촉 탭의 접촉 영역(5)과 코일 연결부(6)는 서로 다른면에 놓이는 것을 특징으로 하는 캐리어 요소.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DEP4431754.9 | 1994-09-06 | ||
DE4431754A DE4431754C1 (de) | 1994-09-06 | 1994-09-06 | Trägerelement |
Publications (2)
Publication Number | Publication Date |
---|---|
KR970705804A true KR970705804A (ko) | 1997-10-09 |
KR100358786B1 KR100358786B1 (ko) | 2003-04-23 |
Family
ID=6527572
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019970701474A KR100358786B1 (ko) | 1994-09-06 | 1995-09-05 | 캐리어엘리먼트 |
Country Status (9)
Country | Link |
---|---|
EP (1) | EP0780005B1 (ko) |
JP (1) | JP2785232B2 (ko) |
KR (1) | KR100358786B1 (ko) |
CN (1) | CN1110771C (ko) |
AT (1) | ATE173552T1 (ko) |
DE (2) | DE4431754C1 (ko) |
ES (1) | ES2125649T3 (ko) |
RU (1) | RU2124756C1 (ko) |
WO (1) | WO1996007983A1 (ko) |
Families Citing this family (58)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2814477B2 (ja) * | 1995-04-13 | 1998-10-22 | ソニーケミカル株式会社 | 非接触式icカード及びその製造方法 |
DE19534480C2 (de) | 1995-09-18 | 1999-11-11 | David Finn | IC-Kartenmodul zur Herstellung einer IC-Karte sowie IC-Karte mit einem IC-Kartenmodul |
DE19610507C2 (de) * | 1996-03-15 | 1997-12-04 | David Finn | Chipkarte |
DE19654902C2 (de) * | 1996-03-15 | 2000-02-03 | David Finn | Chipkarte |
DE19639025C2 (de) * | 1996-09-23 | 1999-10-28 | Siemens Ag | Chipmodul und Verfahren zur Herstellung eines Chipmoduls |
DE19716342C2 (de) * | 1997-04-18 | 1999-02-25 | Pav Card Gmbh | Verfahren zur Herstellung einer Chipkarte |
FR2781068B1 (fr) * | 1998-07-07 | 2000-10-13 | Rue Cartes Et Systemes De | Procede de fabrication d'une carte a microcircuit permettant de limiter les contraintes mecaniques transmises a celui-ci et carte ainsi obtenue |
JP3180086B2 (ja) * | 1998-08-31 | 2001-06-25 | 株式会社シーメディア | 携帯通信装置、情報伝達システム及び方法、携帯通信装置で利用可能な非接触icメディア |
FR2782822A1 (fr) * | 1998-09-02 | 2000-03-03 | Hitachi Maxell | Module a semi-conducteur et procede de production |
DE19932960C2 (de) * | 1998-10-08 | 2002-09-12 | Pav Card Gmbh | Verfahren zur Herstellung eines Chipkartenmoduls, Positioniervorrichtung zur Durchführung eines derartigen Verfahrens und Positionierverfahren |
WO2000043952A1 (en) * | 1999-01-22 | 2000-07-27 | Intermec Ip Corp. | Rfid transponder |
DE10014620A1 (de) * | 2000-03-24 | 2001-09-27 | Andreas Plettner | Verfahren zur Herstellung eines Trägerbandes mit einer Vielzahl von elektrischen Einheiten, jeweils aufweisend einen Chip und Kontaktelemente |
ES2236311T3 (es) * | 2001-10-31 | 2005-07-16 | Sokymat S.A. | Circuito integrado transportador de dimensiones optimizadas. |
JP2005309520A (ja) * | 2004-04-16 | 2005-11-04 | Dainippon Printing Co Ltd | インターポーザー付シート、その巻体およびその検査方法 |
US9064198B2 (en) | 2006-04-26 | 2015-06-23 | Murata Manufacturing Co., Ltd. | Electromagnetic-coupling-module-attached article |
JP4310589B2 (ja) | 2006-08-24 | 2009-08-12 | 株式会社村田製作所 | 無線icデバイスの検査システム及びそれを用いた無線icデバイスの製造方法 |
CN104078767B (zh) | 2007-07-09 | 2015-12-09 | 株式会社村田制作所 | 无线ic器件 |
JP5104865B2 (ja) | 2007-07-18 | 2012-12-19 | 株式会社村田製作所 | 無線icデバイス |
EP2717196B1 (en) | 2007-12-26 | 2020-05-13 | Murata Manufacturing Co., Ltd. | Antenna device and wireless IC device |
CN103729676B (zh) | 2008-05-21 | 2017-04-12 | 株式会社村田制作所 | 无线ic器件 |
CN104077622B (zh) | 2008-05-26 | 2016-07-06 | 株式会社村田制作所 | 无线ic器件系统及无线ic器件的真伪判定方法 |
WO2010001987A1 (ja) | 2008-07-04 | 2010-01-07 | 株式会社村田製作所 | 無線icデバイス |
CN102124605A (zh) | 2008-08-19 | 2011-07-13 | 株式会社村田制作所 | 无线ic器件及其制造方法 |
WO2010047214A1 (ja) | 2008-10-24 | 2010-04-29 | 株式会社村田製作所 | 無線icデバイス |
DE112009002384B4 (de) | 2008-11-17 | 2021-05-06 | Murata Manufacturing Co., Ltd. | Antenne und Drahtlose-IC-Bauelement |
EP2385580B1 (en) | 2009-01-30 | 2014-04-09 | Murata Manufacturing Co., Ltd. | Antenna and wireless ic device |
WO2010119854A1 (ja) | 2009-04-14 | 2010-10-21 | 株式会社村田製作所 | 無線icデバイス用部品及び無線icデバイス |
JP4687832B2 (ja) | 2009-04-21 | 2011-05-25 | 株式会社村田製作所 | アンテナ装置 |
CN102474009B (zh) | 2009-07-03 | 2015-01-07 | 株式会社村田制作所 | 天线及天线模块 |
WO2011040393A1 (ja) | 2009-09-30 | 2011-04-07 | 株式会社村田製作所 | 回路基板及びその製造方法 |
JP5304580B2 (ja) | 2009-10-02 | 2013-10-02 | 株式会社村田製作所 | 無線icデバイス |
CN102576939B (zh) | 2009-10-16 | 2015-11-25 | 株式会社村田制作所 | 天线及无线ic器件 |
JP5418600B2 (ja) | 2009-10-27 | 2014-02-19 | 株式会社村田製作所 | 送受信装置及び無線タグ読み取り装置 |
WO2011055703A1 (ja) | 2009-11-04 | 2011-05-12 | 株式会社村田製作所 | 通信端末及び情報処理システム |
CN102473244B (zh) | 2009-11-04 | 2014-10-08 | 株式会社村田制作所 | 无线ic标签、读写器及信息处理系统 |
GB2487315B (en) | 2009-11-04 | 2014-09-24 | Murata Manufacturing Co | Communication terminal and information processing system |
WO2011108340A1 (ja) | 2010-03-03 | 2011-09-09 | 株式会社村田製作所 | 無線通信モジュール及び無線通信デバイス |
GB2491447B (en) | 2010-03-24 | 2014-10-22 | Murata Manufacturing Co | RFID system |
WO2011122163A1 (ja) | 2010-03-31 | 2011-10-06 | 株式会社村田製作所 | アンテナ装置及び無線通信デバイス |
JP5299351B2 (ja) | 2010-05-14 | 2013-09-25 | 株式会社村田製作所 | 無線icデバイス |
JP5170156B2 (ja) | 2010-05-14 | 2013-03-27 | 株式会社村田製作所 | 無線icデバイス |
WO2012014939A1 (ja) | 2010-07-28 | 2012-02-02 | 株式会社村田製作所 | アンテナ装置および通信端末機器 |
WO2012020748A1 (ja) | 2010-08-10 | 2012-02-16 | 株式会社村田製作所 | プリント配線板及び無線通信システム |
JP5630506B2 (ja) | 2010-09-30 | 2014-11-26 | 株式会社村田製作所 | 無線icデバイス |
WO2012050037A1 (ja) | 2010-10-12 | 2012-04-19 | 株式会社村田製作所 | アンテナ装置および通信端末装置 |
CN102971909B (zh) | 2010-10-21 | 2014-10-15 | 株式会社村田制作所 | 通信终端装置 |
WO2012093541A1 (ja) | 2011-01-05 | 2012-07-12 | 株式会社村田製作所 | 無線通信デバイス |
JP5304956B2 (ja) | 2011-01-14 | 2013-10-02 | 株式会社村田製作所 | Rfidチップパッケージ及びrfidタグ |
CN103314656B (zh) * | 2011-01-20 | 2016-04-06 | 惠普发展公司,有限责任合伙企业 | 芯片载体支撑系统 |
JP5370616B2 (ja) | 2011-02-28 | 2013-12-18 | 株式会社村田製作所 | 無線通信デバイス |
EP2618424A4 (en) | 2011-04-05 | 2014-05-07 | Murata Manufacturing Co | WIRELESS COMMUNICATION DEVICE |
WO2012157596A1 (ja) | 2011-05-16 | 2012-11-22 | 株式会社村田製作所 | 無線icデバイス |
JP5488767B2 (ja) | 2011-07-14 | 2014-05-14 | 株式会社村田製作所 | 無線通信デバイス |
CN203553354U (zh) | 2011-09-09 | 2014-04-16 | 株式会社村田制作所 | 天线装置及无线器件 |
JP5344108B1 (ja) | 2011-12-01 | 2013-11-20 | 株式会社村田製作所 | 無線icデバイス及びその製造方法 |
JP5464307B2 (ja) | 2012-02-24 | 2014-04-09 | 株式会社村田製作所 | アンテナ装置および無線通信装置 |
CN104487985B (zh) | 2012-04-13 | 2020-06-26 | 株式会社村田制作所 | Rfid标签的检查方法及检查装置 |
CN107912065B (zh) * | 2015-06-23 | 2020-11-03 | 立联信控股有限公司 | 具有至少一个用于无接触地传输信息的接口的智能卡坯件 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4996411A (en) * | 1986-07-24 | 1991-02-26 | Schlumberger Industries | Method of manufacturing a card having electronic memory and a card obtained by performing said method |
EP0379592A4 (en) * | 1988-06-29 | 1991-06-19 | Matsushita Electric Industrial Co. Ltd. | Ic memory card |
US4931991A (en) * | 1988-12-22 | 1990-06-05 | Amp Incorporated | Machine readable memory card with capacitive interconnect |
FR2641102B1 (ko) * | 1988-12-27 | 1991-02-22 | Ebauchesfabrik Eta Ag | |
DE4115065A1 (de) * | 1991-05-08 | 1992-11-12 | Angewandte Digital Elektronik | Stromfluss kontroll-schaltung |
DE4345610B4 (de) * | 1992-06-17 | 2013-01-03 | Micron Technology Inc. | Verfahren zur Herstellung einer Hochfrequenz-Identifikationseinrichtung (HFID) |
JP2672924B2 (ja) * | 1992-07-30 | 1997-11-05 | 三菱電機株式会社 | 非接触icカードとその製造方法及びテスト方法 |
GB9222460D0 (en) * | 1992-10-26 | 1992-12-09 | Hughes Microelectronics Europa | Radio frequency baggage tag |
-
1994
- 1994-09-06 DE DE4431754A patent/DE4431754C1/de not_active Expired - Fee Related
-
1995
- 1995-09-05 EP EP95929752A patent/EP0780005B1/de not_active Expired - Lifetime
- 1995-09-05 DE DE59504284T patent/DE59504284D1/de not_active Expired - Fee Related
- 1995-09-05 CN CN95195673A patent/CN1110771C/zh not_active Expired - Lifetime
- 1995-09-05 RU RU97105188A patent/RU2124756C1/ru not_active IP Right Cessation
- 1995-09-05 ES ES95929752T patent/ES2125649T3/es not_active Expired - Lifetime
- 1995-09-05 WO PCT/DE1995/001200 patent/WO1996007983A1/de active IP Right Grant
- 1995-09-05 KR KR1019970701474A patent/KR100358786B1/ko not_active IP Right Cessation
- 1995-09-05 AT AT95929752T patent/ATE173552T1/de not_active IP Right Cessation
- 1995-09-05 JP JP8509118A patent/JP2785232B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH09512367A (ja) | 1997-12-09 |
DE59504284D1 (de) | 1998-12-24 |
KR100358786B1 (ko) | 2003-04-23 |
ATE173552T1 (de) | 1998-12-15 |
CN1110771C (zh) | 2003-06-04 |
RU2124756C1 (ru) | 1999-01-10 |
ES2125649T3 (es) | 1999-03-01 |
DE4431754C1 (de) | 1995-11-23 |
EP0780005A1 (de) | 1997-06-25 |
EP0780005B1 (de) | 1998-11-18 |
WO1996007983A1 (de) | 1996-03-14 |
CN1160449A (zh) | 1997-09-24 |
JP2785232B2 (ja) | 1998-08-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR970705804A (ko) | 캐리어 요소(support element) | |
KR930024145A (ko) | 적층된 다중칩 모듈 및 그의 제조방법 | |
KR900005587A (ko) | 반도체 디바이스 및 그 제작방법 | |
EP0399447A2 (en) | Plastic molded type semiconductor device | |
ATE342582T1 (de) | Mikroelektronische montage mit mehrfachen leiterverformungen | |
DE59504352D1 (de) | Schaltungsanordnung mit einem chipkartenmodul und einer damit verbundenen spule | |
RU97105188A (ru) | Несущий элемент | |
KR920003567A (ko) | 반도체장치 | |
KR970013236A (ko) | 금속 회로 기판을 갖는 칩 스케일 패키지 | |
KR870009613A (ko) | 집적회로 칩 마운팅 및 패키징 조립품 | |
KR930009036A (ko) | 반전형 IC의 제조방법 및 그것을 사용한 IC모듈(module) | |
US5892275A (en) | High performance power and ground edge connect IC package | |
KR870700172A (ko) | 반도체 회로장치 | |
RU99115169A (ru) | Несущий элемент для полупроводникового кристалла, предназначенный для встраивания в карточку с интегральными схемами | |
KR860001478A (ko) | 리이드 프레임과 이것을 사용한 전자장치 | |
KR940020539A (ko) | 저 인덕턴스 반도체 패키지(Low inductance semiconductor package) | |
KR890013750A (ko) | 반도체 장치 | |
KR970018460A (ko) | 점프 오버 와이어링없는 리드 온 칩 리드프레임의 설계 | |
KR960702178A (ko) | 플라스틱으로 캡슐봉입된 집적회로 패키지 및 그 제조방법(palstic encapsulated integrated circuit package and method of manufacturing the same) | |
KR0169272B1 (ko) | 반도체장치 | |
KR960015882A (ko) | 반도체 장치 | |
KR960704278A (ko) | 전자 스마트 카드 접속용 전기 커넥터(electric connector for connecting an electronic smart card) | |
KR910005404A (ko) | 반도체 장치 | |
EP1235273A3 (en) | Semiconductor device formed by mounting semiconductor chip on support substrate, and the support substrate | |
KR920000126A (ko) | 마이크로파 반도체 부품용 칩 캐리어 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
LAPS | Lapse due to unpaid annual fee |