CN1160449A - 载体构件 - Google Patents

载体构件 Download PDF

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CN1160449A
CN1160449A CN95195673A CN95195673A CN1160449A CN 1160449 A CN1160449 A CN 1160449A CN 95195673 A CN95195673 A CN 95195673A CN 95195673 A CN95195673 A CN 95195673A CN 1160449 A CN1160449 A CN 1160449A
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contact
chip
support element
plastic material
described support
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CN1110771C (zh
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J·蒙迪戈尔
J·基施鲍尔
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Infineon Technologies AG
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Siemens AG
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Abstract

用于装入芯片卡的载体构件，具有安置在导线支架(1)上并与其接触片(5、6；5、7)电连接的一块半导体芯片(2)，其中至少半导体芯片(2)以及为芯片与接触片(5、6；5、7)的连接而设置的接合线(3)用塑料材料(4)这样包封，使接触片(5、6；5、7)伸出塑料材料(4)用作通向半导体芯片(2)的导电连接。在塑料材料(4)的一个表面上的接触片构成接触面(5)，其中至少两个接触片在接触面(5)的附加延伸部分构成用于连接天线线圈末端的接头(6；7)。

Description

载体构件
本发明涉及一种载体构件，主要用于装入芯片卡，该构件具有安置在一个导线支架上的一块半导体芯片，专业人员通常称导线支架为引线架(leadframe)，并且导线支架上的接触片与半导体芯片电连接，其中至少半导体芯片以及为芯片与接触片的连接而设置的接合线用塑料材料这样包封，使接触片伸出塑料材料用作通向半导体芯片的导电连接。
由专利EP0254640 A1已知一种这样的载体构件。这种已知载体构件被置入一种芯片卡，该卡经由读数器借助机械接触经接触片提供电能。同样，数据流也借助机械接触流经这些接触片。
由专利DE4115065 C2已知一种无触点芯片卡，这种卡经天线线圈，也就是经电感耦合传输电能和数据。在这种情况下，天线线圈的末端与芯片卡上的半导体芯片连接，其中芯片卡没有任何暴露在外的接触区。这种无接触式芯片卡上的芯片的任何测试只有经装配的线圈才有可能。
本发明的任务是提出一种载体构件，这种构件适于装入无触点芯片卡中，并提供没有连接线圈的情况下进行测试的可能性，而且适于在其上装配线圈。
该项任务通过权利要求1所述载体构件得以解决。在从属权利要求中给出本发明的其它优良结构。
在包封半导体芯片的塑料材料的一个表面上，通过经接触片形成的本发明的接触面，有可能借助机械接触为到达芯片提供一电学的路径，例如用于测量目的，而不必在接触片的延长部分连接天线。然而，如果连接了天线也可以进行测试，但是根据本发明的结构必须不采用这种天线。
如果接触片的延长部分安置在载体构件的相对边，则可把载体构件以良好的方式直接安置在平面线圈的绕组上，并与线圈末端接通，使线圈末端不必与绕组交叉，以这种方式有可能易于实现载体构件与线圈连接的自动化生产，这种制造方法可提供线圈参数，例如线圈品质因数的高重现性。
经制成接触片的不同长度的延长部分同样可以实现线圈末端的无交叉接通，因为接触片的延长部分中较长的那一个可以经绕组的上方或下方引出。在此，有可能把载体构件安置在靠近芯片卡的边缘或者甚至安置在某一角区，使其位于在远离芯片卡承受弯曲应力最大的中心线处。
下面借助附图用实施例进一步阐述本发明。这些附图是：
附图1和2各示出一个本发明载体构件的截面图，和
附图3示出已装配载体构件的立体示意图。
按照附图1、2和3，半导体芯片2固定在导线支架1上，例如粘接，和借助接合线3与导线支架1的接触片5、6或5、7导电连接。半导体芯片2和接合线3用构成外壳4的塑料材料4浇注。导线支架1的接触片制成这样的形状，使这些接触片形成接触面5，这些接触面位于塑料材料4的一个表面。接触面5的延长部分构成用于连接天线线圈末端的接头6、7。在图1中接触片的延长部分经两次弯曲使它们能通向天线绕组的下侧。在图2中接触面的延长部分与接触面位于同一平面内，使这些延长部分通向天线绕组的上侧。图3示出本发明载体构件一种特别良好的装配。其中载体构件直接安置在平面线圈的绕组9上，并且在载体构件两个相对边的接触片的延长部分与线圈的末端连接。依这种方式载体构件自身形成线圈绕组的跨接。从而提供了一种特别容易自动化的、重现性良好的装配方法。其中天线绕组9可以在卡片引入板(Karteninlet)8上作为印刷线路予以实现。在本发明载体构件上半导体芯片借助接触面5可在装配的载体构件情况下也可在未装配的载体构件情况下毫无问题地借助机械接触进行测试。

Claims (7)

1、载体构件，尤其是用于装入芯片卡，该构件具有一块安置在导线支架(1)上并与其接触片(5、6；5、7)电连接的半导体芯片(2)，其中至少半导体芯片(2)以及为芯片与接触片(5、6；5、7)的连接而设置的接合线(3)用塑料材料(4)这样包封，使接触片(5、6；5、7)伸出塑料材料(4)，用作通向半导体芯片(2)的导电连接，
其特征在于，
在塑料材料(4)的一个表面上接触片构成接触面(5)，其中至少两个接触片在接触面(5)的附加延伸部分构成用于连接天线线圈末端的接头(6；7)。
2、根据权利要求1所述载体构件，
其特征在于，
至少两个接触片的线圈接头(6；7)具有不同的长度。
3、根据权利要求1或2所述载体构件，
其特征在于，
至少两个接触片的线圈接头(6；7)安置在载体构件的相对边上。
4、根据权利要求1或2所述载体构件，
其特征在于，
至少两个接触片的线圈接头相互平行安置。
5、根据权利要求1或2所述载体构件，
其特征在于，
至少两个接触片的线圈接头(6；7)相互垂直安置。
6、根据权利要求1至5之一所述载体构件，
其特征在于，
至少两个接触片的接触面(5)和线圈接头(7)位于同一平面。
7、根据权利要求1至5之一所述载体构件，
其特征在于，
至少两个接触片的接触面(5)和线圈接头(6)位于不同的平面。
CN95195673A 1994-09-06 1995-09-05 载体构件 Expired - Lifetime CN1110771C (zh)

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DE4431754C1 (de) 1995-11-23
EP0780005A1 (de) 1997-06-25
DE59504284D1 (de) 1998-12-24
ES2125649T3 (es) 1999-03-01
WO1996007983A1 (de) 1996-03-14
CN1110771C (zh) 2003-06-04
JP2785232B2 (ja) 1998-08-13
JPH09512367A (ja) 1997-12-09
RU2124756C1 (ru) 1999-01-10
ATE173552T1 (de) 1998-12-15
EP0780005B1 (de) 1998-11-18
KR100358786B1 (ko) 2003-04-23
KR970705804A (ko) 1997-10-09

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