KR100358786B1 - 캐리어엘리먼트 - Google Patents
캐리어엘리먼트 Download PDFInfo
- Publication number
- KR100358786B1 KR100358786B1 KR1019970701474A KR19970701474A KR100358786B1 KR 100358786 B1 KR100358786 B1 KR 100358786B1 KR 1019970701474 A KR1019970701474 A KR 1019970701474A KR 19970701474 A KR19970701474 A KR 19970701474A KR 100358786 B1 KR100358786 B1 KR 100358786B1
- Authority
- KR
- South Korea
- Prior art keywords
- contact
- carrier element
- coil
- semiconductor chip
- contact tabs
- Prior art date
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
- G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45014—Ribbon connectors, e.g. rectangular cross-section
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Power Engineering (AREA)
- Computer Networks & Wireless Communication (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Credit Cards Or The Like (AREA)
- Wire Bonding (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
칩 카드에 결합하기위한 캐리어 요소는 컨덕터 캐리어(1)에 배치되면서, 그의 접촉 탭(5,6 ; 5,7)에 전기적으로 연결되는 반도체 칩(2)을 갖는데, 최소한의 반도체 칩(2)과, 상기 접촉 탭(5,6 ; 5,7)과 상기 반도체 칩(2)의 연결을 위해 제공된 본드-와이어(3)는 상기 접촉 탭이 상기 반도체 칩(2)과의 전도성 연결로 인해 플라스틱 화합물(4)로 부터 빠져나오도록 플라스틱 화합물(4)에 의해 둘러쌓이게 된다. 상기 접촉 탭은 상기 플라스틱 화합물(4)의 표면중 한 표면에서 접촉 영역을 형성하며, 상기 접촉 탭중 적어도 2개 접촉 탭은 상기 접촉 영역(5)의 연장부에서 안테나 코일의 단부를 위한 연결부(6;7)를 형성한다.
Description
본 발명은 칩 카드에 결합되는 캐리어 엘리먼트에 관한 것으로, 상기 캐리어 엘리먼트는 리드 프레임으로 보통 명명되는 컨덕터 캐리어에 배치되고, 컨덕터 캐리어의 접촉 댑에 전기적으로 연결되는 반도체 칩을 갖는데, 최소한의 상기 반도체칩과, 상기 접촉 댑과 상기 반도체 칩의 연결을 위해 제공된 본드-와이어는 상기 접촉 댑이 반도체 칩과의 전도성 연결로 인해 플라스틱 화합물로부터 빠져나오도록 플라스틱 화합물에 의해 둘러 쌓이게 된다.
이러한 캐리어 엘리먼트는 유럽 특허 공개 제 0,254,640 A1호에 공지되어 있다. 이 공지된 캐리어 엘리먼트는 기계적인 접촉에 의한 접촉 탭을 통해 리더가 요구하는 만큼의 전력이 공급되는 칩 카드에 삽입된다. 또한 데이타 흐름은 기계적인 접촉에 의한 접촉 탭을 통해 발생한다.
독일 특허 제 4,115,065 C2호에는 무 접촉 칩 카드를 개시하고 있는데, 전력과 데이타는 안테나 코일을 통해, 다시 말해 유도 결합을 통해 전송된다. 여기서 안테나 코일의 단부는 외부에 대해 어떤 다른 접촉을 갖지 않는 칩 카드의 반도체 칩에 연결된다. 그러한 무 접촉 칩 카드의 칩 테스트는 설치된 코일을 통해서만 가능하다.
본 발명은 칩 카드에 결합되는 캐리어 엘리먼트에 관한 것이다.
도1 및 도2는 본 발명에 따른 캐리어 엘리먼트를 통해서 본 단면도.
도3는 설치된 캐리어 엘리먼트의 공간적인 도면.
본 발명의 목적은 무 접촉 칩 카드에 결합하는데 적합하고, 연결된 코일 없이 테스트가 가능하며 이 카드에 코일을 설치하는데 적합한 캐리어 엘리먼트를 기술하는데 있다.
이러한 목적은 청구항 1항에 따른 캐리어 엘리먼트에 의하여 성취된다. 본 발명의 부가의 개선은 종속항에서 구체화된다.
본 발명에 따라 상기 반도체 칩의 플라스틱 슬리브의 한 표면에서 접촉 탭을 통한 접촉 영역의 구성결과로, 기계적인 접촉에 의한 칩으로의 전기적인 엑세스는 안테나가 접촉 탭 연장부에 연결되지 않고 테스트 목적을 위해 가능하다, 그러나, 테스트는 안테나가 연결될때도 가능하지만, 이것은 본 발명에 따른 구성으로 인해 소용이 없다.
접촉 탭 연장부가 캐리어 엘리먼트의 반대측에 배치되면, 캐리어 엘리먼트는 평면 코일의 와인딩에 유리한 방법으로 직접 세트될 수 있고 코일의 단부에 접촉될수 있으며, 그 결과 코일의 단부는 와인딩에 겹쳐질 필요가 없으며; 이러한 방법으로 캐리어 엘리먼트와 코일간의 연결 제조가 쉽게 자동화될 수 있으며, 이러한 제조에 의해, 코일의 품질만큼 코일의 재생산성도 높아진다.
다른 길이를 갖는 접촉 탭 연장부를 구성함으로서, 코일 단부의 겹침이 없는 접촉이 마찬가지로 가능해지는데, 왜냐하면, 더 긴 접촉 탭의 연장부가 와인딩 위 또는 아래로 유인되기 때문이다. 이러한 장치에서 캐리어 엘리먼트는 칩 카드 가장자리 또는 한 모서리에 근접하여 배치될 수 있으며, 그 결과 캐리어 엘리먼트는 칩카드의 중앙선으로부터 이격 배치되며, 칩 카드의 중앙선은 휘는 압력에 의해 심하게 로드된다.
본 발명을 도면을 참고로 예시적인 실시예와 관련하여 더 상세히 설명하겠다. 도1, 도2 및 도3에 따르면, 반도체 칩(2)은 예를 들어 컨덕터 캐리어(1)에 결합되어 고정되며, 본드-와이어(3)에 의하여 접촉 탭(5,6 또는 5,7)에 도전적으로 연결된다. 반도체 칩과 본드-와이어(3)는 하우징(4)을 형성하는 캐스트 플라스틱 화합물(4)에 의해 둘러 쌓여 있다. 컨덕터 캐리어(1)의 접촉 탭은 플라스틱 화합물(4)의 한 표면에 배치되는 접촉 영역(5)을 형성하도록 모양을 갖추고 있다. 접촉 영역(5)의 연장부는 안테나 코일의 단부를 위한 연결부(6,7)를 형성한다. 도1에서, 접촉 탭 연장부는 2번 이상 구부러지며, 그 결과 이 연장부는 안테나 와인딩 아래로 유인될 수 있다. 도2에서, 접촉 탭의 연잡부는 접촉 영역과 동일한 면에 연장되며, 그 결과 상기 연장부는 안테나 와인딩 위로 유인된다. 도3은 본 발명에 따른 캐리어 엘리먼트의 특히 바람직한 어셈블리를 나타낸다. 여기서, 캐리어 엘리먼트는 평면 코일의 와인딩(9)에 바로 설치되고, 상기 캐리어 엘리먼트의 반대측에 배치된 2개의 접촉 영역 탭 연장부는 코일의 단부에 연결된다. 이런 방법으로, 캐리어 엘리먼트는 코일 와인딩 양단에 링크를 형성한다. 그러므로, 특히 용이하게 자동화 될 수 있고 바람직하게 재생될 수 있는 설치가능성이 주어진다. 안테나 와인딩(9)은 이 경우에 카드 인서트(8)에서 인쇄된 선으로 수행될 수 있다. 본 발명에 따른 캐리어 엘리먼트의 경우에, 반도체 칩은 기계적인 접촉에 의한 문제없이 접촉영역(5)에 의해서, 설치된 캐리어 엘리먼트의 경우와 또한 설치되지 않은 캐리어 엘리먼트의 경우 모두에 테스트 될 수 있다.
Claims (7)
- 컨덕터 캐리어(1)에 배치되면서, 컨덕터 캐리어의 접촉 탭(5,6 ; 5,7)에 전기적으로 연결되는 반도체 칩(2)을 갖는데, 적어도 상기 반도체 칩(2) 및 상기 접촉 탭(5,6 ; 5,7)과 상기 반도체 칩(2)의 연결을 위해 제공된 본드-와이어(3)는 상기 접촉 탭(5,6 ; 5,7)이 상기 반도체 칩(2)과의 전도성 연결로 인해 플라스틱 화합물(4)로부터 빠져나오도록 상기 플라스틱 화합물(4)에 의해 둘러쌓이게 되는 칩 카드에 결합하기 위한 캐리어 엘리먼트에 있어서,상기 접촉 탭은 상기 플라스틱 화합물(4)의 표면중 한 표면위에 접촉 영역(5)을 형성하며, 상기 접촉 탭중 적어도 2개의 접촉 탭은, 상기 접촉 영역(5)의 연장부에서, 안테나 코일의 단부를 위한 연결부(6;7)를 형성하는 것을 특징으로하는 캐리어 엘리먼트.
- 제1항에 있어서, 상기 적어도 2개 접촉 탭의 코일 연결부(6;7)는 서로 다른 길이를 갖는 것을 특징으로하는 캐리어 엘리먼트.
- 제1항 또는 제2항에 있어서, 상기 적어도 2개 접촉 탭의 코일 연결부(6;7)는 상기 캐리어 엘리먼트의 반대측에 배치되는 것을 특징으로하는 캐리어 엘리먼트.
- 제1항 또는 제2항에 있어서, 상기 적어도 2개 접촉 탭의 코일 연결부는 서로평행하게 배치되는 것을 특징으로하는 캐리어 엘리먼트.
- 제1항 또는 제2항에 있어서, 상기 적어도 2개 접촉 탭의 코일 연결부(6;7)는 서로 직각으로 배치되는 것을 특징으로하는 캐리어 엘리먼트.
- 제1항 내지 제2항에 있어서, 상기 적어도 2개 접촉 탭의 접촉 영역(5)과 코일 연결부(7)는 한면에 놓이는 것을 특징으로하는 캐리어 엘리먼트.
- 제1항 내지 제2항에 있어서, 상기 적어도 2개 접촉 탭의 접촉 영역(5)과 코일 연결부(6)는 서로 다른면에 놓이는 것을 특징으로하는 캐리어 엘리먼트.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4431754A DE4431754C1 (de) | 1994-09-06 | 1994-09-06 | Trägerelement |
DEP4431754.9 | 1994-09-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR970705804A KR970705804A (ko) | 1997-10-09 |
KR100358786B1 true KR100358786B1 (ko) | 2003-04-23 |
Family
ID=6527572
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019970701474A KR100358786B1 (ko) | 1994-09-06 | 1995-09-05 | 캐리어엘리먼트 |
Country Status (9)
Country | Link |
---|---|
EP (1) | EP0780005B1 (ko) |
JP (1) | JP2785232B2 (ko) |
KR (1) | KR100358786B1 (ko) |
CN (1) | CN1110771C (ko) |
AT (1) | ATE173552T1 (ko) |
DE (2) | DE4431754C1 (ko) |
ES (1) | ES2125649T3 (ko) |
RU (1) | RU2124756C1 (ko) |
WO (1) | WO1996007983A1 (ko) |
Families Citing this family (58)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2814477B2 (ja) * | 1995-04-13 | 1998-10-22 | ソニーケミカル株式会社 | 非接触式icカード及びその製造方法 |
DE19534480C2 (de) | 1995-09-18 | 1999-11-11 | David Finn | IC-Kartenmodul zur Herstellung einer IC-Karte sowie IC-Karte mit einem IC-Kartenmodul |
DE19610507C2 (de) * | 1996-03-15 | 1997-12-04 | David Finn | Chipkarte |
DE19654902C2 (de) * | 1996-03-15 | 2000-02-03 | David Finn | Chipkarte |
DE19639025C2 (de) | 1996-09-23 | 1999-10-28 | Siemens Ag | Chipmodul und Verfahren zur Herstellung eines Chipmoduls |
DE19716342C2 (de) * | 1997-04-18 | 1999-02-25 | Pav Card Gmbh | Verfahren zur Herstellung einer Chipkarte |
FR2781068B1 (fr) * | 1998-07-07 | 2000-10-13 | Rue Cartes Et Systemes De | Procede de fabrication d'une carte a microcircuit permettant de limiter les contraintes mecaniques transmises a celui-ci et carte ainsi obtenue |
JP3180086B2 (ja) | 1998-08-31 | 2001-06-25 | 株式会社シーメディア | 携帯通信装置、情報伝達システム及び方法、携帯通信装置で利用可能な非接触icメディア |
FR2782822A1 (fr) * | 1998-09-02 | 2000-03-03 | Hitachi Maxell | Module a semi-conducteur et procede de production |
DE19932960C2 (de) * | 1998-10-08 | 2002-09-12 | Pav Card Gmbh | Verfahren zur Herstellung eines Chipkartenmoduls, Positioniervorrichtung zur Durchführung eines derartigen Verfahrens und Positionierverfahren |
WO2000043952A1 (en) * | 1999-01-22 | 2000-07-27 | Intermec Ip Corp. | Rfid transponder |
DE10014620A1 (de) * | 2000-03-24 | 2001-09-27 | Andreas Plettner | Verfahren zur Herstellung eines Trägerbandes mit einer Vielzahl von elektrischen Einheiten, jeweils aufweisend einen Chip und Kontaktelemente |
DE60108793T2 (de) * | 2001-10-31 | 2006-01-19 | Sokymat S.A. | Integrierter schaltkreis mit optimierten abmessungen für transponder |
JP2005309520A (ja) * | 2004-04-16 | 2005-11-04 | Dainippon Printing Co Ltd | インターポーザー付シート、その巻体およびその検査方法 |
US9064198B2 (en) | 2006-04-26 | 2015-06-23 | Murata Manufacturing Co., Ltd. | Electromagnetic-coupling-module-attached article |
DE112007001912T5 (de) * | 2006-08-24 | 2009-07-30 | Murata Mfg. Co., Ltd., Nagaokakyo-shi | Testsystem für Hochfrequenz-IC-Vorrichtungen und Verfahren zum Herstellen von Hochfrequenz-IC-Vorrichtungen unter Verwendung desselben |
JP4466795B2 (ja) | 2007-07-09 | 2010-05-26 | 株式会社村田製作所 | 無線icデバイス |
CN102915462B (zh) | 2007-07-18 | 2017-03-01 | 株式会社村田制作所 | 无线ic器件 |
EP2717196B1 (en) | 2007-12-26 | 2020-05-13 | Murata Manufacturing Co., Ltd. | Antenna device and wireless IC device |
JP4609604B2 (ja) | 2008-05-21 | 2011-01-12 | 株式会社村田製作所 | 無線icデバイス |
WO2009145007A1 (ja) | 2008-05-26 | 2009-12-03 | 株式会社村田製作所 | 無線icデバイスシステム及び無線icデバイスの真贋判定方法 |
EP2306586B1 (en) | 2008-07-04 | 2014-04-02 | Murata Manufacturing Co. Ltd. | Wireless ic device |
EP2320519B1 (en) | 2008-08-19 | 2017-04-12 | Murata Manufacturing Co., Ltd. | Wireless ic device and method for manufacturing same |
JP5429182B2 (ja) | 2008-10-24 | 2014-02-26 | 株式会社村田製作所 | 無線icデバイス |
DE112009002384B4 (de) | 2008-11-17 | 2021-05-06 | Murata Manufacturing Co., Ltd. | Antenne und Drahtlose-IC-Bauelement |
JP5267578B2 (ja) | 2009-01-30 | 2013-08-21 | 株式会社村田製作所 | アンテナ及び無線icデバイス |
JP5510450B2 (ja) | 2009-04-14 | 2014-06-04 | 株式会社村田製作所 | 無線icデバイス |
EP2424041B1 (en) | 2009-04-21 | 2018-11-21 | Murata Manufacturing Co., Ltd. | Antenna apparatus and resonant frequency setting method of same |
WO2011001709A1 (ja) | 2009-07-03 | 2011-01-06 | 株式会社村田製作所 | アンテナおよびアンテナモジュール |
CN102577646B (zh) | 2009-09-30 | 2015-03-04 | 株式会社村田制作所 | 电路基板及其制造方法 |
JP5304580B2 (ja) | 2009-10-02 | 2013-10-02 | 株式会社村田製作所 | 無線icデバイス |
CN102576939B (zh) | 2009-10-16 | 2015-11-25 | 株式会社村田制作所 | 天线及无线ic器件 |
WO2011052310A1 (ja) | 2009-10-27 | 2011-05-05 | 株式会社村田製作所 | 送受信装置及び無線タグ読み取り装置 |
EP2498207B1 (en) | 2009-11-04 | 2014-12-31 | Murata Manufacturing Co., Ltd. | Wireless ic tag, reader/writer, and information processing system |
CN102549838B (zh) | 2009-11-04 | 2015-02-04 | 株式会社村田制作所 | 通信终端及信息处理系统 |
WO2011055701A1 (ja) | 2009-11-04 | 2011-05-12 | 株式会社村田製作所 | 通信端末及び情報処理システム |
JP5652470B2 (ja) | 2010-03-03 | 2015-01-14 | 株式会社村田製作所 | 無線通信モジュール及び無線通信デバイス |
GB2491447B (en) | 2010-03-24 | 2014-10-22 | Murata Manufacturing Co | RFID system |
WO2011122163A1 (ja) | 2010-03-31 | 2011-10-06 | 株式会社村田製作所 | アンテナ装置及び無線通信デバイス |
JP5299351B2 (ja) | 2010-05-14 | 2013-09-25 | 株式会社村田製作所 | 無線icデバイス |
JP5170156B2 (ja) | 2010-05-14 | 2013-03-27 | 株式会社村田製作所 | 無線icデバイス |
GB2537773A (en) | 2010-07-28 | 2016-10-26 | Murata Manufacturing Co | Antenna apparatus and communication terminal instrument |
WO2012020748A1 (ja) | 2010-08-10 | 2012-02-16 | 株式会社村田製作所 | プリント配線板及び無線通信システム |
CN103038939B (zh) | 2010-09-30 | 2015-11-25 | 株式会社村田制作所 | 无线ic器件 |
CN105226382B (zh) | 2010-10-12 | 2019-06-11 | 株式会社村田制作所 | 天线装置及终端装置 |
WO2012053412A1 (ja) | 2010-10-21 | 2012-04-26 | 株式会社村田製作所 | 通信端末装置 |
JP5510560B2 (ja) | 2011-01-05 | 2014-06-04 | 株式会社村田製作所 | 無線通信デバイス |
CN103299325B (zh) | 2011-01-14 | 2016-03-02 | 株式会社村田制作所 | Rfid芯片封装以及rfid标签 |
US20130277818A1 (en) * | 2011-01-20 | 2013-10-24 | Chi Hock Goh | Chip carrier support systems |
CN104899639B (zh) | 2011-02-28 | 2018-08-07 | 株式会社村田制作所 | 无线通信器件 |
CN103081221B (zh) | 2011-04-05 | 2016-06-08 | 株式会社村田制作所 | 无线通信器件 |
JP5569648B2 (ja) | 2011-05-16 | 2014-08-13 | 株式会社村田製作所 | 無線icデバイス |
JP5488767B2 (ja) | 2011-07-14 | 2014-05-14 | 株式会社村田製作所 | 無線通信デバイス |
CN203553354U (zh) | 2011-09-09 | 2014-04-16 | 株式会社村田制作所 | 天线装置及无线器件 |
CN103380432B (zh) | 2011-12-01 | 2016-10-19 | 株式会社村田制作所 | 无线ic器件及其制造方法 |
WO2013125610A1 (ja) | 2012-02-24 | 2013-08-29 | 株式会社村田製作所 | アンテナ装置および無線通信装置 |
WO2013153697A1 (ja) | 2012-04-13 | 2013-10-17 | 株式会社村田製作所 | Rfidタグの検査方法及び検査装置 |
KR102251694B1 (ko) * | 2015-06-23 | 2021-05-13 | 랑셍 홀딩 | 정보의 무접촉 전송을 위한 적어도 하나의 인터페이스를 가진 스마트 카드 블랭크 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4996411A (en) * | 1986-07-24 | 1991-02-26 | Schlumberger Industries | Method of manufacturing a card having electronic memory and a card obtained by performing said method |
EP0379592A4 (en) * | 1988-06-29 | 1991-06-19 | Matsushita Electric Industrial Co. Ltd. | Ic memory card |
US4931991A (en) * | 1988-12-22 | 1990-06-05 | Amp Incorporated | Machine readable memory card with capacitive interconnect |
FR2641102B1 (ko) * | 1988-12-27 | 1991-02-22 | Ebauchesfabrik Eta Ag | |
DE4115065A1 (de) * | 1991-05-08 | 1992-11-12 | Angewandte Digital Elektronik | Stromfluss kontroll-schaltung |
DE4345610B4 (de) * | 1992-06-17 | 2013-01-03 | Micron Technology Inc. | Verfahren zur Herstellung einer Hochfrequenz-Identifikationseinrichtung (HFID) |
JP2672924B2 (ja) * | 1992-07-30 | 1997-11-05 | 三菱電機株式会社 | 非接触icカードとその製造方法及びテスト方法 |
GB9222460D0 (en) * | 1992-10-26 | 1992-12-09 | Hughes Microelectronics Europa | Radio frequency baggage tag |
-
1994
- 1994-09-06 DE DE4431754A patent/DE4431754C1/de not_active Expired - Fee Related
-
1995
- 1995-09-05 WO PCT/DE1995/001200 patent/WO1996007983A1/de active IP Right Grant
- 1995-09-05 JP JP8509118A patent/JP2785232B2/ja not_active Expired - Fee Related
- 1995-09-05 RU RU97105188A patent/RU2124756C1/ru not_active IP Right Cessation
- 1995-09-05 AT AT95929752T patent/ATE173552T1/de not_active IP Right Cessation
- 1995-09-05 KR KR1019970701474A patent/KR100358786B1/ko not_active IP Right Cessation
- 1995-09-05 EP EP95929752A patent/EP0780005B1/de not_active Expired - Lifetime
- 1995-09-05 DE DE59504284T patent/DE59504284D1/de not_active Expired - Fee Related
- 1995-09-05 ES ES95929752T patent/ES2125649T3/es not_active Expired - Lifetime
- 1995-09-05 CN CN95195673A patent/CN1110771C/zh not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
ES2125649T3 (es) | 1999-03-01 |
ATE173552T1 (de) | 1998-12-15 |
RU2124756C1 (ru) | 1999-01-10 |
EP0780005B1 (de) | 1998-11-18 |
WO1996007983A1 (de) | 1996-03-14 |
JP2785232B2 (ja) | 1998-08-13 |
DE59504284D1 (de) | 1998-12-24 |
KR970705804A (ko) | 1997-10-09 |
CN1110771C (zh) | 2003-06-04 |
CN1160449A (zh) | 1997-09-24 |
JPH09512367A (ja) | 1997-12-09 |
DE4431754C1 (de) | 1995-11-23 |
EP0780005A1 (de) | 1997-06-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100358786B1 (ko) | 캐리어엘리먼트 | |
KR100344887B1 (ko) | 칩카드모듈및그것에접속된코일을가지는회로장치 | |
US5946198A (en) | Contactless electronic module with self-supporting metal coil | |
KR100358785B1 (ko) | 무접촉스마트카드용스마트카드모듈을제조하기위한방법 | |
JP3795099B2 (ja) | 集積回路を備えたデータ媒体 | |
US5057805A (en) | Microwave semiconductor device | |
RU2172083C2 (ru) | Блок управления, в частности, для транспортного средства | |
US5545920A (en) | Leadframe-over-chip having off-chip conducting leads for increased bond pad connectivity | |
US4459607A (en) | Tape automated wire bonded integrated circuit chip assembly | |
KR20000049028A (ko) | 칩카드 제조방법과 칩카드제조용 접속장치 | |
JPH08506708A (ja) | 成形された密閉パッケージを有する無線周波数トランスポンダの製造方法 | |
KR20000075577A (ko) | 권선형 안테나를 구비한 비접촉형 카드의 제조 방법 | |
KR100627591B1 (ko) | 전기 단자를 포함하는 소자를 전기 회로와 접점 접속하기 위한 장치 | |
EP0741254A3 (en) | Electromagnetic coil assembly for electromagnetic apparatus | |
CA2301323A1 (en) | On-glass antenna system | |
US4547759A (en) | Coil form | |
KR100724179B1 (ko) | 데이터 캐리어 및 이를 구비한 장치 | |
US4912448A (en) | Coil device with coil and lead terminals | |
EP1001364A4 (en) | CHIP CARD AND FLAT COIL FOR THIS | |
KR100381780B1 (ko) | Ic카드용 ic 모듈과 이를 사용하는 ic카드 | |
CN219642616U (zh) | 脉冲线模块和脉冲线模块组件 | |
JP3470667B2 (ja) | 電子機器およびそれに用いられるコネクタ | |
EP3833167B1 (en) | Electronic control device | |
JP2786047B2 (ja) | 樹脂封止型半導体装置 | |
KR100270071B1 (ko) | 비가역 소자 및 그 제조방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
LAPS | Lapse due to unpaid annual fee |