CN1415104A - 具有用倒装片技术固定的集成电路的卡元件 - Google Patents

具有用倒装片技术固定的集成电路的卡元件 Download PDF

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CN1415104A
CN1415104A CN00817891A CN00817891A CN1415104A CN 1415104 A CN1415104 A CN 1415104A CN 00817891 A CN00817891 A CN 00817891A CN 00817891 A CN00817891 A CN 00817891A CN 1415104 A CN1415104 A CN 1415104A
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integrated circuit
card element
dish
enhancing dish
enhancing
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CN1171178C (zh
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索菲·吉拉德
斯蒂芬·普罗沃斯特
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Axalto SA
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Schlumberger SA
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Credit Cards Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Wire Bonding (AREA)

Abstract

本发明涉及一种集成电路的卡元件，该卡元件包括：一个上面制造有一个电路(2)的支持片、一个与该电路(2)相连并有一个倒装片固定的有源侧(7)的集成电路(5)，所述的集成电路(5)通过密封生成物(6)固定在该支持片上，所述密封生成物安排在集成电路与支持片之间。本发明的卡元件包括一个增强部分(8)，所述增强部分(8)固定在与有源侧(7)相反侧的集成电的无源侧上。

Description

具有用倒装片技术固定的 集成电路的卡元件
                        技术领域
本发明涉及一种具有用倒装片技术固定的集成电路的卡元件。
                        背景技术
由于采用集成电路的应用的开发正在日益增加，而需要更多地生产包括集成电路的卡元件。为了满足这个需要，而需要一种把一个集成电路很快地贴在卡元件上的方法。为此用倒装片技术，在该技术中，把带有集成电路的连接端子的集成电路的有源侧直接贴在预先生产的电子电路的端子上。另外通过涂敷在集成电路的有源侧与支承片之间的密封树脂把集成电路粘接在支承片上。
在传统的制造技术中，当要把一些卡元件特别是要把该卡元件构成为一用在电子终端中的卡的一部分，不管是接触式卡或非接触卡，集成电路的支持片通常是薄而具有柔性，在卡元件受到机械应力例如弯曲和扭应力等机械应力时，使集成电路有产生损坏的危险。在制造过程中对集成电路的各种处理和各种控制操作和在卡上的定位会在与有源侧相反的集成电路的无源侧产生初始断裂、这些断裂降低了集成电路的抗弯曲强度。
                        发明内容
为了克服这个缺点，本发明建议一种具有集成电路的卡元件，该卡元件包括一个在上面制造一个电路的支持片，该电路与一个具有用倒装片技术固定的有源侧的集成电路相连接，通过在涂敷在集成电路的有源侧与支持片侧之间的密封生成物将集成电路粘接在支持片上，借此把一个增强盘粘接到一个与有源侧相反的集成电路的无源侧上。
因此，该增强盘不仅使集成电路的无源侧的机械强度增加，而且更重要的是它使卡元件的天然纤维向该增强盘移动，以便使集成电路的无源侧在卡元件弯曲时受到一个比较低的拉伸或压缩的应力，从而使集成电路的断裂危险双倍地减少。
按照本发明的一个优选的方式，该密封生产物包围集成电路，而且最好与增强盘的一个边缘接触，因此该密封生成物包围该集成电路和增强盘。
按照本发明的另一个优选的方式，该密封生成物包围增强盘，因此使集成电路和增强盘埋入在密封生成物中。
本发明的其它特征和优点，在阅读下面的说明后将变得更加清楚，在说明书中将参照附图说明三个具体的但非限定按照本发明的具有集成电路的卡元件的实施方式。
                        附图说明
图1是表示本发明的第一实施方式的非接触式卡元件的局部剖面图。
图2是表示类似于本发明第一实施方式的图1的非接触式卡元件的局部剖面图。
图3是表示类似于本发明第一实施例方式的非接触式卡元件的局部剖视图。
                        具体实施方式
参照图1，按照本发明的具有集成电路的卡元件包括以公知方式制作的一个支持片1，例如一个上面已经制成一个电路2的热塑性材料片，在这种情况下，图中只示出用两匝的天线电路。该电路2包括端子3，这些端子3与通过涂敷在集成电路的有源侧7与支持片1相反的部分之间的密封树脂粘接在支持片1上的集成电路5的触点4连接。
按照本发明，一个增强盘8贴在集成电路的无源侧9上。增强盘8可以由任适合的提供一个适合于集成电路类型和该元件应用的增强件的材料制成。具体地说，增强盘可以由作为举例的复合材料，塑料材料或金属制成。其结构可以是均匀的也可以是不均匀的。在本实施方式中，该增强盘通过把一个增强片放置在集成电路的晶片上定位，然后同时切割该晶片和增强片，以使增强盘8的边缘10在集成电路5的侧面13的正上方。
把增强盘粘接到集成电路的无源侧所用的方法可以与把集成电路密封在支持片上的方法相同。具体地说，可以把粘接剂或树脂11热或冷涂敷在增强盘和/或集成电路上，并可以任选使用热或冷激活的粘接剂。
增强盘的厚度和类型以及把盘8粘接在集成电路5上的粘接剂或树脂的厚度和类型应根据当卡元件弯曲时能获得约束天然纤维的适合的位移的涂敷来选择。
在图2所示的第二实施方式中，集成电路利用前面相同的方法固定，但增强盘12比集成电路6的上侧大，并在把集成电路5固定在支持片1上后将其粘上。为了粘接增强盘12，将一滴树脂14例如放在集成电路的上侧，然后涂敷在增强盘12上，使树脂14涂布在增强盘12与集成电路5之间并在其两侧溢出，以便与密封树脂6结合。因为集成电路的侧面13在增强盘12的下面，并被树脂14包围，以使增强盘12的粘接强度比用第一实施方式的粘接强度强。
在图3所示的第三实施方式中，密封树脂6包围增强盘8，以使集成电路5和增强盘8埋入在密封树脂中。在本实施方式中，密封树脂可以这样涂敷：使其简单地包围集成电路，但不覆盖，同时与增强盘的周边缘10接触，从而使集成电路5和增强盘8埋入在密封树脂6中。
具体地说，虽然增强盘已经呈现出一个表面在集成电路侧面的正上方或超过集成电路侧面突出的状态，但可以设计增强盘，使它的边缘10处在集成电路5的横向侧的后面，或使其形状不与集成电路的形状相同。
随着本发明的具有集成电路的卡元件的应用不同，而可以制成各种不同的增强板的厚度、制成盘的材料或在集成电路无源侧与增强盘之间的粘接剂的类型。
虽然上面是就非接触式卡元件描述了本发明，但本发明也可以在一个集成在接触式卡上的卡元件上实现。
虽然是就在把密封树脂放置在支持片上后把密封树脂涂敷在集成电路周围描述的本发明，但本发明也可以用另一密封生成物例如一种材料的薄膜实现，该材料可以包含再活化的导电的颗粒，所述的导电颗粒使薄膜各向异性导电，并且使密封生成物在集成电路的端子正上方导电。在把集成电路放置在有源侧之前，乃至切割上面制造有集成电路的硅晶片之前，把密封生成物涂到集成电路有源侧。

Claims (5)

1.一种具有用倒装片技术固定的集成电路的卡元件，该集成电路包括一个带一个电路(2)的支持片(1)，所述的电路(2)与一集成电路(5)相连，集成电路(5)有一个用倒装片技术固定的有源侧(7)，通过涂敷在集成电路的有源侧与支持片之间的密封生成物(6)把集成电路粘接在支持片上，其特征在于：该卡元件包括一个粘接在与有源侧(7)相反的集成电路的无源侧(9)上的增强盘(8、12)。
2.如权利要求1所述的具有用倒装片技术固定的集成电路的卡元件，其特征在于：密封生成物(6)包围集成电路(5)。
3.如权利要求2所述的具有用倒装片技术固定的集成电路的卡元件，其特征在于：密封生成物与增强盘(8)的一个边缘(10)接触。
4.如权利要求3所述的用具有倒装片技术固定的集成电路的卡元件，其特征在于：密封生成物(6)覆盖增强盘(8)。
5.如权利要求1所述的具有用倒装片技术固定的集成电路的卡元件，其特征在于：集成电路(5)具有一个在增强盘(12)下面的横向侧(13)，通过涂布在增强盘与集成电路(5)的无源侧(9)之间和溢出到横向侧(13)的树脂(14)粘接增强盘(12)。
CNB008178917A 1999-12-30 2000-12-13 具有用倒装片技术固定的集成电路的卡元件 Expired - Fee Related CN1171178C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR99/16736 1999-12-30
FR9916736A FR2803413A1 (fr) 1999-12-30 1999-12-30 Element de carte a circuit integre monte en flip-chip

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CN1415104A true CN1415104A (zh) 2003-04-30
CN1171178C CN1171178C (zh) 2004-10-13

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US (1) US7026720B2 (zh)
EP (1) EP1242971B1 (zh)
JP (1) JP2003519847A (zh)
CN (1) CN1171178C (zh)
AT (1) ATE251783T1 (zh)
DE (1) DE60005858T2 (zh)
ES (1) ES2208451T3 (zh)
FR (1) FR2803413A1 (zh)
WO (1) WO2001050415A2 (zh)

Cited By (1)

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CN103608828A (zh) * 2011-06-10 2014-02-26 欧贝特科技公司 微电路模块和包括微电路模块的智能卡

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JP2005101356A (ja) * 2003-09-25 2005-04-14 Toshiba Corp 無線カード
DE102005007643A1 (de) * 2005-02-19 2006-08-31 Assa Abloy Identification Technology Group Ab Verfahren und Anordnung zum Kontaktieren von Halbleiterchips auf einem metallischen Substrat
JP4714026B2 (ja) 2006-01-10 2011-06-29 株式会社東芝 電子部品実装装置、電子部品実装方法及び電子部品装置
JP5266723B2 (ja) 2007-11-07 2013-08-21 富士通株式会社 Ｒｆｉｄタグ製造方法
US11446116B2 (en) 2020-07-06 2022-09-20 Perfect Fit Crowns, Llc Method and apparatus for dental crown restorations using prefabricated sleeve-crown pairs

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US5581445A (en) * 1994-02-14 1996-12-03 Us3, Inc. Plastic integrated circuit card with reinforcement structure for protecting integrated circuit module
US5528222A (en) * 1994-09-09 1996-06-18 International Business Machines Corporation Radio frequency circuit and memory in thin flexible package
US5662296A (en) * 1996-02-05 1997-09-02 Sports World Enterprise Co., Ltd. Controlling means of a golf bag stand
FR2756955B1 (fr) * 1996-12-11 1999-01-08 Schlumberger Ind Sa Procede de realisation d'un circuit electronique pour une carte a memoire sans contact
FR2769441A1 (fr) * 1997-10-07 1999-04-09 Philips Electronics Nv Carte electronique sans contact et son procede de fabrication

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103608828A (zh) * 2011-06-10 2014-02-26 欧贝特科技公司 微电路模块和包括微电路模块的智能卡
CN103608828B (zh) * 2011-06-10 2016-12-28 欧贝特科技公司 微电路模块和包括微电路模块的智能卡

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EP1242971B1 (fr) 2003-10-08
CN1171178C (zh) 2004-10-13
DE60005858D1 (de) 2003-11-13
DE60005858T2 (de) 2004-09-09
US7026720B2 (en) 2006-04-11
EP1242971A2 (fr) 2002-09-25
WO2001050415A3 (fr) 2002-01-31
US20040036178A1 (en) 2004-02-26
WO2001050415A2 (fr) 2001-07-12
ES2208451T3 (es) 2004-06-16
FR2803413A1 (fr) 2001-07-06
ATE251783T1 (de) 2003-10-15
JP2003519847A (ja) 2003-06-24

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