CN1047474C - 电连接结构 - Google Patents

电连接结构 Download PDF

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CN1047474C
CN1047474C CN95103064A CN95103064A CN1047474C CN 1047474 C CN1047474 C CN 1047474C CN 95103064 A CN95103064 A CN 95103064A CN 95103064 A CN95103064 A CN 95103064A CN 1047474 C CN1047474 C CN 1047474C
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conductive particles
electrically conductive
splicing ear
connection structure
electric connection
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CN1112297A (zh
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佐藤稔
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Casio Computer Co Ltd
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Casio Computer Co Ltd
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Abstract

一种包含第一导电微粒和第二导电微粒的各向异性导电胶粘剂被置于形成在第一电子部件上的第一连接端子和形成于第二导电部件上的第二连接端子之间。当第一和第二电子部件在热和压力下连接在一起时，包覆于第一导电微粒上的一绝缘层的与第一、第二端子接触的部分破裂掉，使得第一导微粒与第一和第二连接端子相接触，且第二导电微粒直接与第一和第二连接端子接触。这样第一和第二连接端子通过所述第一和第二导电微粒彼此电连接。

Description

电连接结构
本发明涉及一种用于以一种各向异性的导电胶粘剂将一个端子连至另一端子的电连接装置，所说的端子彼此相对地设置。
一般地，一液晶显示装置包括一液晶显示面板、用于驱动该液晶显示面板的半导体芯片(电子部分)以及用于控制半导体芯片的电路板。
图4是显示上述传统的液晶显示装置的一个例子的视图。该液晶显示装置包括一液晶显示面板1、两个半导体芯片2和2a、一挠性引线板3以及控制半导体芯片2和2a的一电路板(未示)。该液晶显示面板包括一上透明板4和一下透明板5(该二透明板为矩形且相对设置)以及一设于上透明板4和下透明板5之间的液晶材料(未示)。该下透明板5的尺寸大于上透明板4。当上透明板4被以一种使其两相邻边与下透明板5的两相应相邻边对齐的覆盖方式放于该下透明板5之上时，则当从顶部下看时该透明板5的未被上透明板4覆盖的部分可被看到，如图4所示。在下透明板5的该未被上透明板4覆盖的部分(一伸出部分)上形成有输出连接端子(输出引线)6、输入连接端子(输入引线)7以及用于连接电源的电源连接端子(电源引线)8。一半导体芯片2形成在下透明板5的该伸出部分上。在此例中，如图5所示，输入连接块11、用于连接电源的电源连接块12以及输出连接块(未示)形成在半导体芯片2的下表面上。该形成在半导体芯片2的下表面上的输入连接块11分别与形成在下透明板5上的输入连接端子7电连接。形成在半导体芯片2下的表面上的一组电源连接块12与形成在下透明板5上的电源连接端子8之一连接，而另一组电源连接块12(12a)则与另一电源连接端子8(8a)连接。形成在半导体芯片2的下表面上的该输出连接块则分别与形成在下透明板5上的输出连接端子6连接。
另一半导体芯片2a以同样的方式安置在下透明板5的该伸出部分上。挠性引线板3在其一侧连接到下透明板5的该伸出部分上，以使形成在该挠性引线板3上的引线(未示)电连接至下透明板的输入连接端子7和电源连接端子8上，而该挠性引线板3的另一侧则连接至控制半导体芯片2和2a的电路板上。
图6是显示用于连接下透明板5的连接端子7和8至半导体芯片2的连接块11和12上的电连接结构的剖视图。在图6中，下透明板5的输入连接端子7通过一各向异性的导电胶粘剂13电连接至半导体芯片2的输入连接块11上。该各向异性的导电胶粘剂由包含大量导电微粒15的绝缘胶粘剂16制成，且形成为一带状件。该导电微粒15被覆着一绝缘层14且以适当的比例与绝缘胶粘剂16混合。首先，该各向异性的导电胶粘剂13被设置在下透明板5的一部分(其上形成有输入连接端子7)和半导体芯片2的一部分(其上形成有输入连接块11)之间，使得绝缘胶粘剂16的下表面对着输入连接端子7和下透明板5，而绝缘胶粘剂16的上表面则对着半导体芯片2的输入连接块11。
然后，下透明板5的其上形成有输入连接端子7的那个部分和半导体芯片2的其上形成有输入连接块11的部分在加热和加压下被以各向异性的导电胶粘剂13连接在一起，在该连接过程中，置于输入连接端子7和导电微粒15之间以及输入连接块11和导电微粒15之间的部分绝缘胶粘剂16在施于下透明板5和半导体芯片2上的压力之下从其间逸出以使它们连接在一起。之后，在导电微粒15上的绝缘层14的部分(与输入连接端子7和输入连接块11接触的部分)相继破裂。因此，导电微粒15得以与输入连接端子7和输入连接块11接触。此时，绝缘层14的其它部分未破裂且仍保留在导电微粒15上。因此导电微粒15与输入连接端子7和输入连接块11接触。其结果，输入连接端子7和输入连接块11通过各向异性导电胶粘剂13的导电微粒15相互电连接。之后，绝缘胶粘剂16和绝缘层14被硬化以使下透明板的该部分(其上形成有导电端子7)坚固地附着在半导体芯片2的该部分(其上形成有输入连接块11)上。在此例中，如果导电微粒15彼此连接，由于仍残留在导电微粒15上的绝缘层，导电微粒15之间的绝缘仍充分保持着。
然而，在这种传统的各向异性导电胶粘剂16中，当该各向异性导电胶粘剂16被加热和加压以使部分与输入连接端子7和输入连接块11接触的绝缘层14破裂，该绝缘层14的薄膜依然残留在导电微粒15的部分表面上，这些部分根据环境对着输入连接端子7和输入连接块11。因此，当半导体芯片的连接块11和12的一块的线度为约60微米时，很难使大约10毫安的电流从下透明板5的输入连接端子7通过各向异性导电胶粘剂13流入半导体芯片2的输入连接块11。另外，在驱动液晶显示面板1的某些条件下，需要允许大约200-300毫安的电流从下透明板5的电源连接端子8a流入半导体芯片2的电源连接块12a。在这种连接电源连接端子8a至电源连接块12a的情形中，需要提供至少20-30个电源连接端子12a于半导体芯片2上，因此使得半导体芯片2变大和变贵。
本发明即是针对上述现有技术的缺点而做出的，其一个目的在于提供一种用于以一种各向异性胶粘剂连接一端子和另一个与其相对的端子的电连接结构，该结构能减小上述二端子之间的电阻。
根据本发明，提供了一种电连接结构，包括：
一具有一第一连接端子的第一电子部分；
一具有一与所述第一电子部分的第一连接端子相对设置的第二连接端子的第二电子部分，以及
设置在所述第一连接端子和所述第二连接端子之间的各向异性导电胶粘剂，所述各向异性胶粘剂包含一绝缘胶粘剂，多数的被覆有一绝缘层的第一导电微粒，以及多数的不被覆任何材料的第二导电微粒，在施于所述第一连接端子和所述第二连接端子的力的作用下，所述覆盖第一导电微粒的绝缘层的部分与所述第一连接端子和第二连接端子相接触并破裂掉，使得所述第一导电微粒得以与所述第一连接端子和第二连接端子接触，且在压力下所述第二导电微粒与所述第一连接端子和第二连接端子相接触，其中所述第一连接端子和第二连接端子通过所述第一导电微粒和所述第二导电微粒彼此电连接。
本发明的其它目的和优点将在以下说明中给出，且部分将通过该说明明了或通过实践本发明而得到。这些目的和优点可通过所附权利要求中特别指出的装置和组合而实现和得到。
结合以下附图，将能更全面地理解本发明的其它目的和结构，附图中：
图1是显示本发明的电连接结构的主要部分的放大的平面视图，图1中，一液晶显示面板和一半导体芯片通过一种各向异性导电胶粘剂彼此连接起来。
图2是显示图1的电连接结构的一部分的剖视图；
图3是显示用于本发明的电连接结构的一个实施例中的导电微粒的一个例子的放大剖视图；
图4是显示一个使用本发明的电连接结构的液晶显示装置的平面图；
图5是显示图4装置中的传统电连接结构的主要部分的放大平面视图；
图6是显示图5的电连接结构的一部分的剖视图。
下面将参考附图详细说明本发明的电连接结构的较佳实施例。
图1是显示本发明的电连接结构的一主要部分的放大平面视图，其中一液晶显示面板与一半导体芯片(电子部分)是通过一种各向异性的导电胶粘剂相连接的。图2是显示图1的电连接结构的一部分的剖视图。
各向异性导电胶粘剂13是由包含大量被覆有绝缘层14的导电微粒15以及大量无被覆层的导电微粒15a的绝缘胶粘剂16制成的，该各向异性的导电胶粘剂13被形成为一带状件。该有被覆导电微粒15和无被覆导电微粒15a以适当的比例与绝缘胶粘剂16混合。在此例中，有被覆导电微粒15和无被覆导电微粒15a以诸如金、银、铜、铁、镍及铝等金属制成并具有大约5微米的直径。绝缘层14由诸如热塑性树脂等树脂制成。绝缘胶粘剂16由诸如热塑性树脂或热固性树脂等的树脂制成。
在图1中，有被覆导电微粒15以点表示而无被覆导电微粒15a以圆表示。形成在下透明板5的上表面上的输入连接端子7和电源连接端子8和8a与形成在半导体芯片2下表面上的输入连接块11和电源块12和12a通过各向异性导电胶粘剂13分别电连接。下面将说明上述电连接结构的形成过程。
首先，各向异性的导电胶粘剂13被设置在半导体芯片2的下表面上。之后，该半导体芯片被置于下透明板5上以使连接端子7、8和8a与连接块11、12和12a通过各向异性导电胶粘剂13彼此相对地设置。这样，各向异性导电胶粘剂13被设置在下透明板的形成有连接端子7、8和8a的一部分与半导体芯片2的形成有连接块11、12和12a的一部分之间，使得绝缘胶粘剂16的下表面对着连接端子7、8、8a及下透明板5，而其上表面则对着连接块11、12、12a及半导体芯片2。然后，下透明板5的该形成有连接端子7、8、8a的部分与半导体芯片2的该形成有连接块11、12和12a的部分在加热和加压条件下被该各向异性导电胶粘剂13连接在一起。在该加热和加压下的连接过程中，开始置于连接端子7、8、8a和导电微粒15、15a之间及连接块11、12、12a和导电微粒15、15a之间的绝缘胶粘剂16的部分在加于下透明板5和半导体芯片2上的压力下从其间逸出以使它们连接在一起。然后，包围在有被覆导电微粒15上的绝缘层14的部分(与连接端子7、8、8和连接块11、12、12a接触的部分)以与已有技术相同的方式相继破裂。因此有被覆导电微粒15得以与连接端子7、8、8a和连接块11、12、12a相接触。另外，无被覆导电微粒15a的表面的部分(对着连接端子7、8、8a和连接块11、12、12a的部分)也与连接端子7、8、8a和连接块11、12、12a相接触。此时，绝缘层14的其它部分未破裂且仍然残存在有被覆微粒15上。
其结果，连接端子7、8、8a通过包含于各向异性的导电胶粘剂13中的有被覆导电微粒15及无被覆导电微粒15a分别与连接块11、12、12a电连接。在此例中，由于无被覆导电微粒15a未被以绝缘层14围覆，它们与连接端子7、8、8a和连接块11、12、12a直接接触。因此，流过无被覆导电微粒15a的电流可十倍于流过有被覆导电微粒15的电流。相应地，在通过有被覆导电微粒15和无被覆导电微粒15a连接的连接端子7、8、8a和连接块11、12、12a之间的电阻即小于已有技术中仅通过有被覆导电微粒15连接的连接端子7、8、8a和连接块11、12、12a之间的电阻。当在驱动液晶显示板1的某些条件下需要使200-300毫安的电源电流从电源连接端子8a流入到电源连接块12a时，有可能减少电源连接块12a的数目。由于可使用较少数目的电源连接块12a，半导体芯片2可被做得更小。由于仍残存于导电微粒15上的绝缘层14，导电微粒15和15a之间的绝缘仍保持足够。
图3是显示用于本发明电连接结构中的导电微粒15和15a的一个例子的放大剖视图。在图3中，导电微粒15或15a包括一绝缘树脂微粒17和一导电层18，该导电层18由诸如金、银、铜、铁、镍及铝等金属制成并包覆着绝缘树脂微粒17。在此例中，由于在连接过程中的压力作用使导电微粒15或15a变形，导电微粒15或15a的与连接端子7、8、8a和连接块11、12、12a相接触的表面区域变大，使得连接连接端子7、8、8a和连接块11、12、12a之间的电阻降低。
最好是绝缘胶粘剂16的有被覆导电微粒15的数目与无被覆导电微粒15a的数目基本相同。然而，有被覆导电微粒15的数目也可以大于无被覆导电微粒15a的数目。
在以上实施例中，金属微粒或包覆有导电层18的树脂微粒17被包含于导电微粒15或15a中。然而，也可以是金属微粒被包含于有被覆导电微粒15中而包覆有金属层18的树脂微粒17被包含于无被覆导电微粒15a中或相反。电子部分2不一定是半导体芯片2。其也可以是其它的包括有类似于连接块11、12、12a的连接块的电子部件。
以上详细说明了本发明的几个实施例，但这些实施例仅是示意性的而非限制性的。本发明可以以各种方式修改。本发明的所有修改或应用都将属于本发明的范围或要诣。本发明的范围应仅由所附权利要求或其等价物确定。

Claims (12)

1、一种电连接结构，包括：
第一连接端子；
第二连接端子，该第二连接端子与所述第一连接端子相对地设置；以及
设置于所述第一连接端子和所述第二连接端子之间绝缘胶粘剂，该绝缘胶粘剂包含多个导电微粒；
其特征在于，
所述多个导电微粒包括多个第一导电微粒和多个第二导电微粒；
所述多个第一导电微粒设置在所述第一连接端子和所述第二连接端子之间，所述第一导电微粒被覆有一绝缘层，在施加于所述第一连接端子和第二连接端子上的力的作用之下，与所述第一连接端子和第二连接端子相接触的所述绝缘层的部分破裂掉，使得所述第一导电微粒得以与所述第一连接端子和所述第二连接端子相接触；
所述多个第二导电微粒设置在所述第一连接端子和所述第二连接端子之间，所述第二导电微粒未被覆有任何材料，与所述第一连接端子和所述第二连接端子相接触；以及
所述第一连接端子和所述第二连接端子通过所述第一导电微粒和第二导电微粒被彼此电连接。
2、如权利要求1的电连接结构，其中，包覆所述第一导电微粒的所述绝缘层的其它部分，即在加于所述第一连接端子和第二连接端子上的力之下未破裂的部分，仍保留在所述第一导电微粒上。
3、如权利要求2的电连接结构，其中，至少所述第一导电微粒和所述第二导电微粒之一是由金属制成的，且包覆所述第一导电微粒的所述绝缘层是由热塑性树脂制成的。
4、如权利要求3的电连接结构，其中，所述绝缘胶粘剂是由热塑性树脂或热固性树脂制成的。
5、如权利要求2的电连接结构，其中，至少所述第一导电微粒和第二导电微粒之一是包覆有一导电层的树脂微粒且包覆所述第一导电微粒的所述绝缘层是由热塑性树脂制成的。
6、如权利要求5的电连接结构，其中，所述绝缘胶粘剂是由热塑性树脂或热固性树脂制成的。
7、如权利要求1的电连接结构，其中，至少所述第一导电微粒和所述第二导电微粒之一是由金属制成的而包覆所述第一导电微粒的所述绝缘层是由热塑性树脂制成的。
8、如权利要求7的电连接结构，其中，所述第一导电微粒的数目基本上与所述第二导电微粒的数目是相同的。
9、如权利要求1的电连接结构，其中，至少所述第一导电微粒和所述第二导电微粒之一是包覆有一导电层的树脂微粒，而包覆所述第一导电微粒的绝缘层是由热塑性树脂制成的。
10、如权利要求9的电连接结构，其中，所述第一导电微粒的数目基本上与所述第二导电微粒的数目相同。
11、如权利要求1的电连接结构，其中所述第一连接端子形成在一半导体芯片上而所述第二连接端子形成在一液晶显示面板上。
12、如权利要求1的电连接结构，其中所述第一导电微粒、第二导电微粒和所述绝缘胶粘剂构成各向异性导电胶粘剂，该各向异性导电胶粘剂设置于所述第一连接端子和所述第二连接端子之间。
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Publication number Publication date
JPH07247467A (ja) 1995-09-26
US5586892A (en) 1996-12-24
MY112280A (en) 2001-05-31
CN1112297A (zh) 1995-11-22
KR0132356B1 (ko) 1998-04-14
KR960034343A (ko) 1996-10-22
JP2737647B2 (ja) 1998-04-08

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