GB2151834A - Liquid crystal display device - Google Patents
Liquid crystal display device Download PDFInfo
- Publication number
- GB2151834A GB2151834A GB08431867A GB8431867A GB2151834A GB 2151834 A GB2151834 A GB 2151834A GB 08431867 A GB08431867 A GB 08431867A GB 8431867 A GB8431867 A GB 8431867A GB 2151834 A GB2151834 A GB 2151834A
- Authority
- GB
- United Kingdom
- Prior art keywords
- connecting lines
- group
- chip
- driving connecting
- liquid crystal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13454—Drivers integrated on the active matrix substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Liquid Crystal (AREA)
- Wire Bonding (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
A liquid crystal display device has driving connecting lines (126,127) formed on a transparent insulating substrate 102 and electrically connected to the transparent electrodes of display 106, and IC chip 104 for driving the display is mounted on the insulating substrate and connected to the driving connecting lines (126,127). The driving connecting lines (126,127) are divided into first and second groups. The driving connecting lines of the second group extends beyond the end of the driving connecting lines of the first group. The IC chip (104) is disposed in an insulating member over the extension of the driving connecting lines of the second group and connected electrically to the ends of the driving connecting lines of the first and second groups. The IC chip is attached adhesively to the substrate using a mixture of beads or glass fibres and an epoxy resin adhesive. The connecting pads of the I.C. chip and the connecting lines are bonded together. <IMAGE>
Description
SPECIFICATION
Liquid crystal display device
The present invention relates to a liquid crystal display device having integrated circuit chips mounted on a display panel.
A recent liquid crystal display device uses an increased number of integrated circuit (IC) chips to drive a large number of pixels. As a result, highdensity connection of each IC chip and the electrodes of the display panel are required.
Mounting multi-pad IC chips on display substrate, a plurality of connecting terminals are arranged around the IC chip. The corresponding connecting terminals and the pads of the ICs are bonded to each other by wire bonding, solder bonding or conductive paste bonding. When bonded in such a bonding process, wires cluster around the IC chip, and hence the IC chip mounting density is restricted.
Figures iAand and 1B show the construction of a conventional liquid crystal display device: indicated at 16 is an adhesive, at 2 is a bottom glass plate, at 6 is a top glass plate, at 24 and 22 are transparent electrodes formed in mosaic patterns and at 20 is a liquid crystal material. The transparent patterned electrodes are formed over the respective opposing surfaces of the bottom glass plate 2 and the top glass plate 6.Also in Figure lisa liquid crystal driving IC chip 4, having chip bonding wires 8 and 14 which are made of gold or aluminum wires and extend from bonding pads disposed on opposite sides of the IC chip 4, at 11 is a bonding pad placed on the substrate, at 12 are connecting points, at 10 and 26 are patterned conductive lead formed of glasschronium-aluminum, glass-transparent conductive film (Sn203, In203 or the like)-chromium-aluminum orthose including gold instead of aluminum over the display panel, and at 70 is a potting material. The wiring 8 is clustered at a high density around the IC chip 4, which requires sufficient wiring area.
The present invention seeks to provide a more compact liquid crystal display device.
According to the invention there is provided a liquid crystal display device comprising: a transparent insulating substrate with electrodes formed thereon; a liquid crystal material disposed between the transparent electrodes; an IC chip for display driving mount on the substrate and connected by driving connecting lines to the transparent electrodes, which connecting lines are divided at least into a first group and a second group; the driving connecting lines of the second group extending beyond the ends of those of the first group; and the
IC chip being mounted on the substrate with an insulating member over the extensions of the driving connecting lines of the second group and between the ends of the driving connecting lines of the first group and the ends of the driving connecting lines of the second group.
As will be apparent in the present invention, an IC chip is disposed on or over the connecting wiring to increase the wiring density for the IC, and hence compactness of the display device. This eliminates the crowded patterned leads around the IC chip over a wide area and enables high-density IC chip mounting.
Since the IC chip is conductive, the IC chip is placed on and attached adhesively to the substrate of a display with a mixture of a solid insulating material, such as beads or glass fibres and a two-element mixing or thermosetting soft adhesive such as an epoxy resin adhesive. Then, the connecting pads of the IC chip and the connecting lead terminals are bonded together with a wire bonder.
The invention can be employed with the face down bonding method, for example, the flip chip bonding method, where a surface of an IC having connecting pads with soldering metal balls and the surface of the patterned substrate of a display are attached face to face with each other with insulating spacers therebetween and are connected simultaneously, mechanically and electrically by fusion or the hardening of a conductive paste. It is also possible to connect the pads of an IC chip and the surface of the patterned state mechanically by bonding them with an insulating adhesive after completing the electrical connection of the connecting pads and the connecting terminal (11 in Figure 1A).
In such a process, the solder ball defines a fixed distance between the IC chip and the substrate and the insulating adhesive hardens to function as a spacer and an insulator.
It is desirable that the spacer is in contact with the
IC chip over a wide contact area so that pressure distribution is uniform. Therefore, the insulator needs to harden over the entire surface of the IC chip. Filling a non-light-transmissive insulating potting material in the space between the IC chip and the patterned substrate may also be necessary, and a suitable potting material can prevent the permeation of corrosive substances, such as moisture and ammonia gas, into the interior of the IC chip.
Preferred embodiments of the invention will now be described with reference to the accompanying drawings wherein:
Figure 1A is a plan view of a conventional liquid crystal display device showing the wiring configuration;
Figure 1B is a schematic sectional view of the device of Figure 1A;
Figure 2A is a plan view of a liquid crystal display device of a first embodiment of the present invention showing the wiring configuration;
Figure 2B is a sectional view of the device of
Figure 2A; and
Figure 3 is a sectional view of part of a liquid crystal display device according to a second embodiment of the present invention.
Figures 2A and 2B show an embodiment of an IC mounting system according to the present invention. In Figures 2A and 2B, indicated at 102 is a bottom glass plate, at 106 is a top glass plate, at 104 is an IC chip, at 108 and 114 are metal wires for wire bonding, at 116 and 124 are transparent conductive patterned electrodes, at 120 is a liquid crystal material, at 126,127 and 110 are wiring conductors formed by covering In203 or Sun203 films with a metal suited for bonding, such as aluminum or gold, over the substrate and at 160 is an insulating piece such as a glass bead piece, a fibre glass piece, a plastic bead piece or a coarse plastic fabric.
In the liquid crystal display device shown in
Figures 2A and 2B, the conductive patterned lead lines 127 are formed under the IC chip 104, which reduces the area necessary for wiring around the IC chip. As shown by the arrangement of wiring lines 126 and 127 when connecting the panel and IC, the wiring lines are divided into two groups and arranged alternately: one or two lines of one group and one or two lines of the other group. The IC chip is placed over the wiring lines of one of the groups with an insulating material therebetween. For example, the IC chip and the glass substrate are fixed together temporarily with glass beads or glass fibres interposed therebetween, and then potted by a potting material to provide the assembly of the IC chip and the substrate with moisture resistance.
It has been a usual procedure to mount an IC chip on a substrate first to fixedly and adhesively attach the back-side of an IC chip to a substrate with a conductive adhesive, then to connect the pads of IC chip and the terminals of a patterned substrate by wire bonding, and then to mould the assembly of the
IC chip and the substrate. In such a case, the substrate is provided with a conductive metallic body and the substrate potential of the IC chip is applied through the conductive metallic body.
According to the described embodiment of the present invention, where an IC chip can be mounted and wired in a small area without using any multilayer substrate, which is greatly effective in practical applications. The structure according to the present invention is effectively applicable, not only to mounting an IC chip on a display panel, but also to mounting an IC chip on a flexible sheet or on a printed circuit board.
In order to form an insulating layer between an IC chip and wiring lines, it is also possible to fix the IC chip temporarily at a fixed distance from the substrate by means of a jig, and then to fill up the clearance between the IC chip and the substrate and to coat the side surfaces and the upper surface of the assembly of the IC chip and the substrate with a potting material for moisture resistant potting.
The provision of a metallic shielding plate between the IC chip and the substrate is effective to suppress noises generated between the IC chip and the wiring lines. Figure 3 shows an example of such a structure having a metallic shielding plate. In
Figure 3, indicated at 202 is an insulating substrate, at 206 is a wiring, at 204 is an IC chip and at 208 is a moisture resistant potting material. A gold sheet, a copper sheet or a galvanized iron sheet can be used as the shielding plate 206.
The IC chip can be mounted by the flip chip bonding method in which an IC chip is disposed with its bonding pads facing the wiring surface and the iC chip and the wiring lines are bonded together by fusing solder balls. A conductive paste can effectively be used instead of solder balls. Atwo-component epoxy resin adhesive is advantageous as the potting material in respect of fixing performance and stability and a black pigment can be mixed into the potting material to enhance the light resistance of the display device.
Claims (8)
1. A liquid crystal display device comprising: a transparent insulating substrate with electrodes formed thereon; a liquid crystal material disposed between the transparent electrodes; an IC chip for display driving mounted on the substrate and connected by driving connecting lines to the transparent electrodes, which connecting lines are divided at least into a first group and a second group; the driving connecting lines of the second group extending beyond the ends of those of the first group; and the IC chip being mounted on the substrate with an insulating member over the extensions of the driving connecting lines of the second group and between the ends of the driving connecting lines of the first group and the ends of the driving connecting lines of the second group.
2. A liquid crystal display device according to claim 1, wherein the insulating member is a mixture of fine particles of a solid insulating substance and an adhesive.
3. A liquid crystal display device according to claim 1 or 2, wherein the insulating material includes an adhesive which is a two-component epoxy resin adhesive.
4. A liquid crystal display device according to claim 1, 2 or 3, wherein the bonding pads of the IC chip are bonded to the surface of the substrate with a conductive adhesive paste.
5. A liquid crystal display device as claimed in any preceeding claim wherein the IC chip is at least partly covered by a non-light-transmissive material.
6. A liquid crystal display device as claimed in any preceding claim wherein the substrate is flexible.
7. A liquid crystal display device substantially as herein described with reference to the accompanying drawings.
8. A liquid crystal display device comprising:
(a) a transparent insulating substrate;
(b) electrodes formed on the transparent insulating substrate;
(c) an IC chip for display driving mounted on the substrate and connected by driving connecting lines to the transparent electrodes,
(d) a liquid crystal material disposed between the transparent electrodes;
(e) said driving connecting lines being divided at least into a first group and a second group;
(f) the driving connecting lines of the second group being extended over the respective ends of the driving connecting lines ofthe first group, so that the respective ends of the driving connecting lines of the second group are located beyond the ends of the driving connecting lines of the first group; and
(g) said IC chip being mounted on the substrate with an insulating member over the extensions of the driving connecting lines of the second group and between the ends of the driving connecting lines of the first group and the ends of the driving connecting lines of the second group.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58239545A JPS60130721A (en) | 1983-12-19 | 1983-12-19 | Liquid-crystal display device |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB8431867D0 GB8431867D0 (en) | 1985-01-30 |
| GB2151834A true GB2151834A (en) | 1985-07-24 |
| GB2151834B GB2151834B (en) | 1987-01-21 |
Family
ID=17046400
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB08431867A Expired GB2151834B (en) | 1983-12-19 | 1984-12-18 | Liquid crystal display device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS60130721A (en) |
| GB (1) | GB2151834B (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2611294A1 (en) * | 1987-02-23 | 1988-08-26 | Lohja Ab Oy | PLANAR DISPLAY DEVICE, PARTICULARLY ELECTROLUMINESCENT DISPLAY DEVICE |
| EP0337775A2 (en) * | 1988-04-12 | 1989-10-18 | Sharp Kabushiki Kaisha | Electronic apparatus |
| EP0344367A1 (en) * | 1988-05-03 | 1989-12-06 | Copytele Inc. | Monolithic flat panel display apparatus |
| EP0391024A1 (en) * | 1989-04-05 | 1990-10-10 | Licentia Patent-Verwaltungs-GmbH | Circuit for display device |
| EP0849603A2 (en) * | 1996-12-19 | 1998-06-24 | Shin-Etsu Polymer Co., Ltd. | Connector for display inspection of a liquid crystal display panel and method for the preparation thereof |
| WO2001043190A1 (en) * | 1999-12-10 | 2001-06-14 | Telefonaktiebolaget L M Ericsson (Publ) | Interposer device |
| DE102004028911A1 (en) * | 2004-06-15 | 2006-01-12 | Optrex Europe Gmbh | Liquid crystal display panel receives signals from an integrated circuit control chip via a ribbon cable |
| CN104470210A (en) * | 2014-12-31 | 2015-03-25 | 京东方科技集团股份有限公司 | Circuit board, manufacturing method of circuit board and display device of circuit board |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6294825A (en) * | 1985-10-21 | 1987-05-01 | Nitto Electric Ind Co Ltd | Module for liquid crystal display |
| JPH0640247B2 (en) * | 1985-12-27 | 1994-05-25 | 三菱電機株式会社 | Display device |
| JPH0618385Y2 (en) * | 1986-06-23 | 1994-05-11 | 株式会社カンセイ | Display device |
| JPS6455927U (en) * | 1987-10-05 | 1989-04-06 | ||
| JPH0310224A (en) * | 1989-06-07 | 1991-01-17 | Sharp Corp | Display device |
| JPH04233514A (en) * | 1990-12-28 | 1992-08-21 | Sharp Corp | Active matrix substrate |
| JP2595484B2 (en) * | 1995-07-13 | 1997-04-02 | セイコープレシジョン株式会社 | Connection structure between liquid crystal panel and integrated circuit for driving it |
| TWI457671B (en) * | 2008-11-10 | 2014-10-21 | Au Optronics Corp | Glass substrate of a flat panel display and integrated circuit chip for display |
-
1983
- 1983-12-19 JP JP58239545A patent/JPS60130721A/en active Granted
-
1984
- 1984-12-18 GB GB08431867A patent/GB2151834B/en not_active Expired
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2611294A1 (en) * | 1987-02-23 | 1988-08-26 | Lohja Ab Oy | PLANAR DISPLAY DEVICE, PARTICULARLY ELECTROLUMINESCENT DISPLAY DEVICE |
| US5016986A (en) * | 1988-04-12 | 1991-05-21 | Sharp Kabushiki Kaisha | Display device having an improvement in insulating between conductors connected to electronic components |
| EP0337775A2 (en) * | 1988-04-12 | 1989-10-18 | Sharp Kabushiki Kaisha | Electronic apparatus |
| EP0337775A3 (en) * | 1988-04-12 | 1990-09-19 | Sharp Kabushiki Kaisha | Electronic apparatus |
| EP0344367A1 (en) * | 1988-05-03 | 1989-12-06 | Copytele Inc. | Monolithic flat panel display apparatus |
| US5117300A (en) * | 1989-04-05 | 1992-05-26 | Licentia Patent-Verwaltungs-Gmbh | Electrical circuit device with different types of conductor paths |
| EP0391024A1 (en) * | 1989-04-05 | 1990-10-10 | Licentia Patent-Verwaltungs-GmbH | Circuit for display device |
| EP0849603A2 (en) * | 1996-12-19 | 1998-06-24 | Shin-Etsu Polymer Co., Ltd. | Connector for display inspection of a liquid crystal display panel and method for the preparation thereof |
| EP0849603A3 (en) * | 1996-12-19 | 1999-07-21 | Shin-Etsu Polymer Co., Ltd. | Connector for display inspection of a liquid crystal display panel and method for the preparation thereof |
| WO2001043190A1 (en) * | 1999-12-10 | 2001-06-14 | Telefonaktiebolaget L M Ericsson (Publ) | Interposer device |
| US6493056B2 (en) | 1999-12-10 | 2002-12-10 | Telefonaktiebolaget Lm Ericsson (Publ) | Interposer device |
| DE102004028911A1 (en) * | 2004-06-15 | 2006-01-12 | Optrex Europe Gmbh | Liquid crystal display panel receives signals from an integrated circuit control chip via a ribbon cable |
| CN104470210A (en) * | 2014-12-31 | 2015-03-25 | 京东方科技集团股份有限公司 | Circuit board, manufacturing method of circuit board and display device of circuit board |
| US20160286651A1 (en) * | 2014-12-31 | 2016-09-29 | Boe Technology Group Co., Ltd. | Circuit board, manufacturing method thereof, and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60130721A (en) | 1985-07-12 |
| GB8431867D0 (en) | 1985-01-30 |
| JPH0546930B2 (en) | 1993-07-15 |
| GB2151834B (en) | 1987-01-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 19941218 |