JPH0640247B2 - Display device - Google Patents
Display deviceInfo
- Publication number
- JPH0640247B2 JPH0640247B2 JP60296254A JP29625485A JPH0640247B2 JP H0640247 B2 JPH0640247 B2 JP H0640247B2 JP 60296254 A JP60296254 A JP 60296254A JP 29625485 A JP29625485 A JP 29625485A JP H0640247 B2 JPH0640247 B2 JP H0640247B2
- Authority
- JP
- Japan
- Prior art keywords
- flexible film
- film substrate
- substrate
- display device
- driving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は表示装置、特にパネル型のデイプレイに関す
るものである。TECHNICAL FIELD The present invention relates to a display device, and more particularly to a panel type display.
第９図は例えば特開昭５７−１１９３２５号公報に示さ
れた従来の表示装置の実装方法を示す断面図であり、こ
の方法により実装された表示装置は例えば特開昭５７−
４２０７３号公報に示された第１０図のような形態にな
る。第９図において、１ａは下ガラス基板、１ｂは上ガ
ラス基板、２はＩＴＯ（Indium Tin Oxide）などよりな
る下ガラス基板１ａ上の導線、６はエポキシなどの材料
よりなるシール材、７は液晶層、８は導線２上に形成さ
れたニツケルなどの材料よりなる金属層、３は可撓性フ
イルム基板、５ｂは銅箔などから成る可撓性フイルム基
板３上の導体、９ははんだ層で、導線２と導体５ｂは金
属層８を介してはんだ層９によつて電気的，機械的に接
続される。又、第１０図において、１は表示パネル基
板、２は表示パネル基板１上の導線、３は表示パネル基
板１と接続して設けられた可撓性フイルム基板、４は可
撓性フイルム基板３上に実装された駆動用ＩＣ、５ａ，
５ｂは可撓性フイルム基板３上の導体であり、導体５ａ
は一端が駆動用ＩＣ４の入力端子と接続され、導体５ｂ
は一端が駆動用ＩＣ４の出力端子と接続されるとともに
他端がはんだ層９および金属層８を介して導線２と接続
される。表示パネル基板１と可撓性フイルム基板３との
接続は、導線２および導体５ａ，５ｂの配線後、導線２
上の所定部分にニツケルなどの材料よりなるはんだぬれ
性を有する金属層８およびはんだ層９を形成し、導線２
と導体５ｂを位置合せした後、はんだ層９を加熱、溶融
させることによつて遂行される。FIG. 9 is a sectional view showing a mounting method of a conventional display device disclosed in, for example, JP-A-57-119325, and a display device mounted by this method is, for example, JP-A-57-57.
The form is as shown in FIG. 10 shown in Japanese Patent No. 42073. In FIG. 9, 1a is a lower glass substrate, 1b is an upper glass substrate, 2 is a conducting wire on the lower glass substrate 1a made of ITO (Indium Tin Oxide), 6 is a sealing material made of a material such as epoxy, and 7 is a liquid crystal. Layer 8 is a metal layer made of nickel or the like formed on the conductor 2, 3 is a flexible film substrate, 5b is a conductor on the flexible film substrate 3 made of copper foil, and 9 is a solder layer. The conductor 2 and the conductor 5b are electrically and mechanically connected to each other by the solder layer 9 via the metal layer 8. Further, in FIG. 10, 1 is a display panel substrate, 2 is a conducting wire on the display panel substrate 1, 3 is a flexible film substrate provided in connection with the display panel substrate 1, and 4 is a flexible film substrate 3. The driving IC mounted on the top, 5a,
5b is a conductor on the flexible film substrate 3, and the conductor 5a
Has one end connected to the input terminal of the driving IC 4, and the conductor 5b
Has one end connected to the output terminal of the driving IC 4 and the other end connected to the conductor 2 via the solder layer 9 and the metal layer 8. The display panel substrate 1 and the flexible film substrate 3 are connected to each other after the conductor wire 2 and the conductors 5a and 5b are wired.
A metal layer 8 and a solder layer 9 made of a material such as nickel and having solder wettability are formed on a predetermined portion of the upper portion of the conductor 2
And the conductor 5b are aligned, and then the solder layer 9 is heated and melted.
次に、上記構成の動作について説明する。導体５ａによ
つて駆動用ＩＣ４に電源、制御信号が入力され、駆動用
ＩＣ４は表示パネル基板１上に画像を表示するための出
力信号を出力する。この出力信号は導体５ｂおよび導線
２を介して表示パネル基板１に伝達され、表示パネル基
板１は画像を表示する。Next, the operation of the above configuration will be described. A power supply and a control signal are input to the driving IC 4 through the conductor 5a, and the driving IC 4 outputs an output signal for displaying an image on the display panel substrate 1. This output signal is transmitted to the display panel substrate 1 via the conductor 5b and the conductor 2, and the display panel substrate 1 displays an image.
従来の表示装置は以上のように構成されているので、可
撓性フイルム基板３が比較的大きくなり、その熱等によ
る伸縮のために表示パネル基板１上の導線２と可撓性フ
イルム基板３上の導体５ｂとの間の接続ずれが大きくな
る可能性が高い。また、可撓性フイルム基板３上の導体
５ａを駆動用ＩＣ４に接続するときに互いの接触を避け
るために複雑な二層配線を施すかあるいはジヤンパー線
を設ける必要がある。さらに、表示パネル基板１，１ａ
上の導線２と可撓性フイルム基板３上の導体５ｂとの接
続ははんだ接合によつて行われるので、表示パネル基板
１が熱履歴による損傷を受け、駆動用ＩＣ４または可撓
性フイルム基板３の損傷，不良，接触ずれなどによつて
可撓性フイルム基板３を交換することが困難であり、熱
履歴による表示パネル基板１の損傷が助長される。又、
金属層８およびはんだ層９を形成する工程が必要である
などの問題点があつた。このため、表示装置の小形化，
高密度化が妨げられるばかりでなく、歩留りが低下し、
生産コストが高くなつた。Since the conventional display device is configured as described above, the flexible film substrate 3 becomes relatively large, and the conductors 2 on the display panel substrate 1 and the flexible film substrate 3 expand and contract due to heat or the like. There is a high possibility that the connection deviation with the upper conductor 5b becomes large. Further, when connecting the conductor 5a on the flexible film substrate 3 to the driving IC 4, it is necessary to provide a complicated two-layer wiring or provide a jumper wire in order to avoid mutual contact. Further, the display panel substrates 1, 1a
Since the connection between the upper conductive wire 2 and the conductor 5b on the flexible film substrate 3 is made by soldering, the display panel substrate 1 is damaged by thermal history, and the driving IC 4 or the flexible film substrate 3 is damaged. It is difficult to replace the flexible film substrate 3 due to damage, defects, contact displacement, etc., and damage to the display panel substrate 1 due to thermal history is promoted. or,
There is a problem that a step of forming the metal layer 8 and the solder layer 9 is necessary. Therefore, downsizing of the display device,
Not only is densification hindered, yields are reduced,
The production cost is high.
この発明は上記のような問題点を解決するために成され
たもので、可撓性フイルム基板上の導体を駆動用ＩＣに
接続するときに二層配線を施したりジヤンパー線を設け
たりする必要がなく、また表示パネル基板上の導線と可
撓性フイルム基板上の導体との間の接続ずれが小さく、
熱履歴による表示パネル基板の損傷がなく、かつ駆動用
ＩＣを含む可撓性フイルム基板の取り換え、交換が容易
な小形，高密度で高歩留り，低コストの表示装置を得る
ことを目的とする。The present invention has been made to solve the above problems, and it is necessary to provide a two-layer wiring or a jumper wire when connecting a conductor on a flexible film substrate to a driving IC. , And the connection deviation between the conductor on the display panel substrate and the conductor on the flexible film substrate is small,
An object of the present invention is to obtain a small-sized, high-density, high-yield, low-cost display device in which a display panel substrate is not damaged by heat history and a flexible film substrate including a driving IC can be easily replaced or exchanged.
この発明に係る表示装置は、可撓性フイルム基板を介し
て表示パネル基板上に駆動用ＩＣを設けるとともに、互
いに並行にかつ可撓性フイルム基板と表示パネル基板と
の間を通つて表示パネル基板の上に配設された複数の第
１の導線と、可撓性フイルム基板の上に互いに並行に配
設され、一端が第１の導線と接続され他端が駆動用ＩＣ
の入力端子と接続された複数の第２の導線と、可撓性フ
イルム基板の上に互いに並行に配設されると共に、一端
が駆動用ＩＣの出力端子と接続され他端が可撓性フイル
ム基板の端部と接続された複数の第３の導線と、一端が
可撓性フイルム基板の端部において第３の導線と接続さ
れ他端が表示パネル基板の複数の画素に接続された第４
の導線を備え、可撓性フイルム基板上の第２および第３
の導線と表示パネル基板上の第１および第４の導線との
接続を異方性電膜を介して行うようにしたものである。In the display device according to the present invention, a driving IC is provided on a display panel substrate via a flexible film substrate, and the display panel substrate is provided in parallel with each other and through the space between the flexible film substrate and the display panel substrate. A plurality of first conducting wires disposed on the flexible film substrate and one side of the flexible film substrate in parallel, one end of which is connected to the first conducting wire and the other end of which is a driving IC.
A plurality of second conductive wires connected to the input terminals of the flexible film substrate and the second conductive wires arranged in parallel with each other on the flexible film substrate, one end of which is connected to the output terminal of the driving IC and the other end of the flexible film. A plurality of third conductors connected to the end of the substrate, and a fourth conductor having one end connected to the third conductor at the end of the flexible film substrate and the other end connected to a plurality of pixels of the display panel substrate.
Second and third conductors on a flexible film substrate with
And the first and fourth conductive wires on the display panel substrate are connected via an anisotropic electroconductive film.
この発明においては、可撓性フイルム基板が従来よりも
小形化するので、その熱等による伸縮が小さくなる。
又、第１の導線が可撓性フイルム基板と表示パネル基板
との間を通つて表示パネル基板の上に配設されており、
第２の導線が可撓性フイルム基板の上に配設されて第１
の導線と接続されているので、第１および第２の導線が
不必要な接触を生じることがない。さらに、第２の導線
と第１の導線の接続および第３の導線と第４の導線の接
続に異方性導電膜を用いているので、表示パネル基板へ
の可撓性フイルム基板の接続および取り外しの際に表示
パネル基板が熱履歴による損傷を受けることがなく、ま
たはんだぬれ性を有する金属層およびはんだ層が不要で
ある。In the present invention, the flexible film substrate is made smaller than the conventional one, so that its expansion and contraction due to heat or the like becomes small.
Further, the first conductive wire is provided on the display panel substrate through between the flexible film substrate and the display panel substrate.
A second conductor is disposed on the flexible film substrate to
Connected to the first conductor wire, the first and second conductor wires do not make unnecessary contact. Further, since the anisotropic conductive film is used for connecting the second conducting wire and the first conducting wire and for connecting the third conducting wire and the fourth conducting wire, it is possible to connect the flexible film substrate to the display panel substrate and The display panel substrate is not damaged by thermal history when it is removed, or a wettable metal layer and a solder layer are unnecessary.
以下、この発明の実施例を図面とともに説明する。第１
図において、１１は複数の画素により構成された画像表
示部を有する液晶パネル即ち表示パネル基板、１２は銅
より成り、互いに並行にかつ可撓性フイルム基板１３と
表示パネル基板１１との間を通つて表示パネル基板１１
の上に配設された複数の第１の導線で、可撓性フイルム
基板13は例えばポリイミドから形成される。１４は可撓
性フイルム基板１３上に実装された駆動用ＩＣで入力端
子と出力端子を有する。１５は一端がワイヤボンデイン
グにより駆動用ＩＣ１４の入力端子と接続された他端が
第１の導線１２と接続された銅よりなる複数の第２の導
線で、互いに並行にかつ可撓性フイルム基板１３上に配
設されている。16は一端がワイヤボンデイングにより駆
動用ＩＣ14の出力端子と接続され、他端が可撓性フイル
ム基板１３の端部に配設された銅よりなる複数の第３の
導線で、互いに並行にかつ可撓性フイルム基板１３上に
配設されている。１７は一端が可撓性フイルム基板１３
の端部で第３の導線１６と接続され、他端が表示パネル
基板１１の複数の画素に接続された銅よりなる複数の第
４の導線で、互いに並行に可撓性フイルム基板１３の下
を通つて配設されている。２１は例えば日立化成工業
(株)製アニソレムＡＣ−1052、ソニーケミカル(株)製Ｃ
Ｐ2024などの異方性導電膜で、第２の導線１５と第１の
導線１２、および第３の導線１６と第４の導線17を各々
電気的，機械的に接続している。Embodiments of the present invention will be described below with reference to the drawings. First
In the figure, 11 is a liquid crystal panel or a display panel substrate having an image display portion composed of a plurality of pixels, 12 is copper, and is provided between the flexible film substrate 13 and the display panel substrate 11 in parallel with each other. Display panel substrate 11
The flexible film substrate 13 is formed of, for example, polyimide with a plurality of first conductive wires disposed on the upper surface of the flexible film substrate 13. A driving IC 14 mounted on the flexible film substrate 13 has an input terminal and an output terminal. Reference numeral 15 is a plurality of second conductive wires made of copper, one end of which is connected to the input terminal of the driving IC 14 by wire bonding and the other end of which is connected to the first conductive wire 12. The flexible conductive film substrate 13 is parallel to each other. It is located above. Reference numeral 16 denotes a plurality of third conductive wires made of copper arranged at one end of the flexible film substrate 13 at one end thereof and connected to the output terminal of the driving IC 14 by wire bonding. It is disposed on the flexible film substrate 13. 17 is a flexible film substrate 13 at one end
A plurality of fourth conductors made of copper, which are connected to the third conductor 16 at one end and whose other end is connected to a plurality of pixels of the display panel substrate 11 in parallel with each other under the flexible film substrate 13. It is arranged through. 21 is, for example, Hitachi Chemical
Anisorem AC-1052 manufactured by Sony Corporation, C manufactured by Sony Chemicals Corporation
An anisotropic conductive film such as P2024 electrically connects the second conducting wire 15 and the first conducting wire 12, and the third conducting wire 16 and the fourth conducting wire 17 electrically and mechanically.
第２図は駆動用ＩＣ１４を実装する前の可撓性フイルム
基板１３を示し、１８は駆動用ＩＣ１４の下部にあたる
可撓性フイルム基板１３上に設けられたダイボンド用パ
ツドであり、第２の導線15のいずれかと接続されてい
る。１９は駆動用ＩＣ１４の下部にあたる第２の導線１
５の上部を被覆するカバーコートで、エポキシやポリイ
ミドなどの絶縁性の材料から成つている。FIG. 2 shows the flexible film substrate 13 before the driving IC 14 is mounted, and 18 is a die bonding pad provided on the flexible film substrate 13 below the driving IC 14, which is the second conductive wire. Connected with any of the fifteen. Reference numeral 19 denotes a second conductor 1 which is a lower portion of the driving IC 14.
5 is a cover coat that covers the upper portion of the cover 5, and is made of an insulating material such as epoxy or polyimide.
第３図は駆動用ＩＣ１４を実装した可撓性フイルム基板
１３を示し、駆動用ＩＣ１４は下面全面にAgペーストな
どの材料よりなる導電性ダイボンド材を塗布されて可撓
性フイルム基板１３に接着されている。駆動用ＩＣ１４
の下面は導電性ダイボンド材によりダイボンド用パツド
１８と同電位に保たれ、かつカバーコート１９によつて
第２の導線１５と絶縁される。又、第２の導線１５と駆
動用ＩＣ１４の入力端子とはAu線などでワイヤボンド接
続される、同様に、第３の導線１６と駆動用ＩＣ１４の
出力端子も接続される。その後、駆動用ＩＣ１４への樹
脂モールドおよび可撓性フイルム基板１３の外形加工
（切断）が施される。FIG. 3 shows the flexible film substrate 13 on which the driving IC 14 is mounted. The driving IC 14 is adhered to the flexible film substrate 13 by applying a conductive die bonding material made of a material such as Ag paste on the entire lower surface. ing. Driving IC 14
The lower surface of is kept at the same potential as the die-bonding pad 18 by the conductive die-bonding material, and is insulated from the second conducting wire 15 by the cover coat 19. The second conductor 15 and the input terminal of the driving IC 14 are wire-bonded to each other by an Au wire or the like. Similarly, the third conductor 16 and the output terminal of the driving IC 14 are also connected. After that, the driving IC 14 is resin-molded and the flexible film substrate 13 is subjected to outer shape processing (cutting).
第３図に示す駆動用ＩＣ１４実装後の可撓性フイルム基
板１３は、第４図に示すように第１の導線１２および第
４の導線１７を配設した表示パネル基板１１に異方性導
電膜２１を仮付けした後、第２の導線１５と第１の導線
１２、および第３の導線１６と第４の導線１７が夫々対
応するように位置合せされ、第２の導線１５と第３の導
線１６を加圧すると同時に１５０℃前後に加熱すること
によつて接続される。接続部の断面を第５図に示す。The flexible film substrate 13 after mounting the driving IC 14 shown in FIG. 3 is anisotropically conductive to the display panel substrate 11 in which the first conducting wire 12 and the fourth conducting wire 17 are arranged as shown in FIG. After the temporary attachment of the membrane 21, the second conductor 15 and the first conductor 12, and the third conductor 16 and the fourth conductor 17 are aligned so as to correspond to each other, and the second conductor 15 and the third conductor 15 are aligned. It is connected by pressurizing the conductor wire 16 of No. 1 and heating it to about 150 ° C. at the same time. A cross section of the connecting portion is shown in FIG.
第６図は上記のように構成された表示装置を示し、２０
は表示パネル基板１１の画像表示部である。この構成の
表示装置においては、第１の導線１２および第２の導線
１５により駆動用ＩＣ１４に電源，制御信号が入力さ
れ、駆動用ＩＣ１４は表示パネル基板１１に画像を表示
するための出力信号を出力する。この出力信号は第３の
導線１６および第４の導線１７により表示パネル基板１
１の各画素に伝達され、表示パネル基板１１に画像が表
示される。FIG. 6 shows a display device constructed as described above.
Is an image display portion of the display panel substrate 11. In the display device having this configuration, power and control signals are input to the driving IC 14 through the first conducting wire 12 and the second conducting wire 15, and the driving IC 14 outputs an output signal for displaying an image on the display panel substrate 11. Output. This output signal is sent to the display panel substrate 1 by the third conductor 16 and the fourth conductor 17.
1 is transmitted to each pixel, and an image is displayed on the display panel substrate 11.
ここで、駆動用ＩＣ１４の損傷などのために可撓性フイ
ルム基板１３を取り換え、変換する場合、該当する接続
部の異方性導電膜２１にトリクロルエチレン，アセトン
などの有機溶剤を塗布し、異方性導電膜２１を膨潤させ
ることによつて、可撓性フイルム基板１３を容易に取り
外すことができる。Here, when the flexible film substrate 13 is replaced and converted due to damage to the driving IC 14, etc., the anisotropic conductive film 21 of the corresponding connection portion is coated with an organic solvent such as trichloroethylene or acetone to change the film. The flexible film substrate 13 can be easily removed by swelling the anisotropic conductive film 21.
又、この表示装置では可撓性フイルム基板１３が従来よ
りも小形化するので、その伸縮が小さく、表示パネル基
板１１上の第１の導線１２と可撓性フイルム基板１３上
の第２の導線１５との間の接続ずれが小さくなる。又、
第１の導線１２が可撓性フイルム基板１３と表示パネル
基板１１との間を通つて表示パネル基板１１上に配設さ
れており、第２の導線１５が可撓性フイルム基板１３の
上に配設されて第１の導線１２と接続されている。よつ
て、二重配線を施したり、ジャンパー線を設ける必要が
ない。Further, in this display device, since the flexible film substrate 13 is made smaller than the conventional one, its expansion and contraction is small, and the first conductive wire 12 on the display panel substrate 11 and the second conductive wire on the flexible film substrate 13 are small. The deviation of the connection with 15 becomes small. or,
The first conducting wire 12 is disposed on the display panel substrate 11 so as to pass between the flexible film substrate 13 and the display panel substrate 11, and the second conducting wire 15 is disposed on the flexible film substrate 13. It is arranged and connected to the first conducting wire 12. Therefore, it is not necessary to provide double wiring or to provide a jumper wire.
さらに、第２の導線１５と第１の導線１２、および第３
の導線１６と第４の導線１７の接続に異方性導電膜２１
を用いたので、はんだ接続の場合のように表示パネル基
板１１が熱履歴による損傷を受けることがなく、また可
撓性フイルム基板13の取り換えも容易である。さらに、
可撓性フイルム基板１３上の第２の導線１５と第３の導
線１６につながるパツドを可撓性フイルム基板１３のさ
らに外側の張り出し部分に設けた場合、外形加工（切
断）前にこのパツドにプローバーを当てるなどの方法で
駆動用ＩＣ１４のバーン・インなどの試験を行うことに
より、不良の駆動用ＩＣ１４を除去することが可能とな
り、歩留りをさらに向上させることもできる。Further, the second conductor 15, the first conductor 12, and the third conductor
An anisotropic conductive film 21 is used to connect the conducting wire 16 and the fourth conducting wire 17 of
Since the display panel substrate 11 is not damaged by thermal history as in the case of solder connection, the flexible film substrate 13 can be easily replaced. further,
When a pad connected to the second conductive wire 15 and the third conductive wire 16 on the flexible film substrate 13 is provided on the projecting portion further outside of the flexible film substrate 13, this pad is formed before the outer shape processing (cutting). By conducting a test such as burn-in of the driving IC 14 by applying a prober or the like, the defective driving IC 14 can be removed, and the yield can be further improved.
第７図および第８図はこの発明の他の実施例を示し、複
数の第４の導線１７は銅あるいはニツケルにより形成さ
れており、互いに並行にかつ可撓性フイルム基板１３の
外側に設けられ、可撓性フイルム基板１３の下部を通過
していない。他の構成は前記実施例と同様であり、前記
実施例と同様な効果を有する。ただし、第４の導線１７
の引き回し面積が前記実施例に比較して大きくなるた
め、表示装置の小形化，高実装密度化の上では前記実施
例の方が望ましい。7 and 8 show another embodiment of the present invention, in which the plurality of fourth conductive wires 17 are made of copper or nickel and are provided in parallel with each other and outside the flexible film substrate 13. , Does not pass under the flexible film substrate 13. The other structure is the same as that of the above-mentioned embodiment and has the same effect as that of the above-mentioned embodiment. However, the fourth conductor 17
Since the wiring area is larger than that of the above-mentioned embodiment, the above-mentioned embodiment is preferable in terms of downsizing and high packing density of the display device.
又、上記各実施例において、第２の導線１５と第１の導
線１２の接続部、および第３の導線１６と第４の導線１
７の接続部を樹脂体で覆つても良く、この場合接続の信
頼性が非常に高くなる。ここで、接続部の第２の導線１
５および第３の導線１６を機械的に固定する効果を奏す
るためには、樹脂体のＪＩＳ(A)硬度は１０以上が必要
であり、また表示パネル基板１１、第２の導線１５およ
び第３の導線１６などとの熱膨張係数の差に起因する応
力を緩和するためには樹脂体のＪＩＳ(A)硬度は１５０
以下であることが必要である。又、各導線間のリークを
防止し駆動用ＩＣ１４を正常に動作させるためには、樹
脂体の体積抵抗率（25℃）は１０″Ωcm以上であること
が必要である。さらに、第１の導線１２と第４の導線１
７は銅あるいはニツケルであつたが、ＩＴＯなどであつ
ても良い。Further, in each of the above-described embodiments, the connecting portion between the second conducting wire 15 and the first conducting wire 12, and the third conducting wire 16 and the fourth conducting wire 1 are connected.
The connection portion of 7 may be covered with a resin body, in which case the reliability of the connection is very high. Here, the second conductor 1 of the connecting portion
In order to exert the effect of mechanically fixing the fifth and third conductive wires 16, the JIS (A) hardness of the resin body must be 10 or more, and the display panel substrate 11, the second conductive wire 15, and the third conductive wire 15 In order to relieve the stress caused by the difference in the coefficient of thermal expansion from the conductor 16 of the resin, the JIS (A) hardness of the resin body is 150
It must be: Further, in order to prevent leakage between the conductors and operate the driving IC 14 normally, the volume resistivity (25 ° C.) of the resin body must be 10 ″ Ωcm or more. Conductor 12 and fourth conductor 1
Although 7 is copper or nickel, ITO or the like may be used.
又、上記各実施例では画像表示領域２０の外側双方向に
可撓性フイルム基板１３を実装したものを示したが、こ
れは２方向または３方向でもよいことは言うまでもな
い。また、可撓性フイルム基板１３上に駆動用ＩＣ１４
を１個実装したものを示したが、１枚の可撓性フイルム
基板１３上に複数個の駆動用ＩＣ１４を実装することも
可能である。さらに、可撓性フイルム基板１３はフイル
ムキヤリア方式によるフイルムキヤリア基板であつても
良いが、なくても良い。又、駆動用ＩＣ１４としては、
入力・出力端子として通常アルミニウム薄膜などの平面
的なパツドを有するものを用いるが、ＴＡＢ（Tape Aut
omated Bonding）用の金バンプ，銀バンプなどの突起状
のバンプを有するものでもよく、高価なＴＡＢボンダー
を用いなくてもＴＡＢ用ＩＣの実装が可能である。さら
に、上記各実施例では表示パネル基板１として液晶パネ
ル１１を用いたが、エレクトロクロミツク（ＥＣ）パネ
ルやＬＥＤパネルであつても良い。Although the flexible film substrate 13 is mounted bidirectionally outside the image display area 20 in each of the above embodiments, it goes without saying that the flexible film substrate 13 may be mounted in two or three directions. Further, the driving IC 14 is mounted on the flexible film substrate 13.
1 is mounted, it is also possible to mount a plurality of driving ICs 14 on one flexible film substrate 13. Further, the flexible film substrate 13 may or may not be a film carrier substrate of a film carrier system. Further, as the driving IC 14,
As the input / output terminals, usually those having a planar pad such as an aluminum thin film are used.
A bump-shaped bump such as a gold bump or a silver bump for omated bonding may be used, and the TAB IC can be mounted without using an expensive TAB bonder. Further, although the liquid crystal panel 11 is used as the display panel substrate 1 in each of the above-described embodiments, it may be an electrochromic (EC) panel or an LED panel.
以上のようにこの発明によれば、可撓性フイルム基板を
介して表示パネル基板上に駆動用ＩＣを設けるととも
に、互いに並行にかつ可撓性フイルム基板と表示パネル
基板との間を通つて表示パネル基板の上に配設された複
数の第１の導線，可撓性フイルム基板の上に互に並行に
配設され、一端が異方性導電膜を介して第１の導線と接
続され他端が駆動用ＩＣの入力端子と接続された複数の
第２の導線、可撓性フイルム基板の上に互いに並行に配
設されると共に、一端が駆動用ＩＣの出力端子と接続さ
れ他端が可撓性フイルム基板の端部に配設された複数の
第３の導線、一端が可撓性フイルム基板の端部において
異方性導電膜を介して第３の導線と接続され他端が表示
パネル基板の複数の画素に接続された第４の導線を備え
ており、表示パネル基板上の第１の導線と可撓性フイル
ム基板上の第２の導線とを接続するときに二層配線を施
したり、ジヤンパー線を設ける必要がなく、また表示パ
ネル基板上の導線と可撓性フイルム基板上の導線との間
の接続ずれが小さい。又、導線間の接続が異方性導電膜
を介して行われているので、可撓性フイルム基板の取
付，取外しが容易となり、表示パネル基板が熱履歴によ
る損傷を受けることがなく、従来の金属層やはんだ層も
不要となつて構成簡単で製作も容易となる。As described above, according to the present invention, the driving IC is provided on the display panel substrate through the flexible film substrate, and the display is provided in parallel with each other and through the space between the flexible film substrate and the display panel substrate. A plurality of first conducting wires arranged on the panel substrate and arranged on the flexible film substrate in parallel with each other, one end of which is connected to the first conducting wire via an anisotropic conductive film, and the like. The plurality of second conductive wires whose ends are connected to the input terminals of the driving IC and the flexible film substrate are arranged in parallel with each other, and one end is connected to the output terminal of the driving IC and the other end is A plurality of third conductors arranged at the end of the flexible film substrate, one end of which is connected to the third conductor through an anisotropic conductive film at the end of the flexible film substrate and the other end of which is displayed. A display panel having a fourth conducting wire connected to a plurality of pixels of the panel substrate, When connecting the first conductor on the plate and the second conductor on the flexible film substrate, it is not necessary to provide two-layer wiring or a jumper wire, and the conductor on the display panel substrate is flexible. Deviation between the conductors on the flexible film substrate is small. In addition, since the conductive wires are connected through the anisotropic conductive film, the flexible film substrate can be easily attached and detached, and the display panel substrate is not damaged by thermal history. Since no metal layer or solder layer is required, the structure is simple and the manufacture is easy.
第１図〜第６図は夫々この発明の第１の実施例に係る表
示装置を示し、第１図は駆動用ＩＣ実装部分の斜視図、
第２図は可撓性フイルム基板の斜視図、第３図は駆動用
ＩＣを実装した可撓性フイルム基板の斜視図、第４図は
表示パネル基板の部分斜視図、第５図は導線接続部の断
面図、第６図は全体平面図、第７図および第８図は夫々
この発明の第２の実施例に係る表示装置の駆動用ＩＣ実
装部分の斜視図および表示パネル基板の部分斜視図、第
９図および第１０図は夫々従来の表示装置の要部断面図
および全体平面図である。 １１……表示パネル基板、１２……第１の導線、13……
可撓性フイルム基板、１４……駆動用ＩＣ、１５……第
２の導線、１６……第３の導線、１７……第４の導線、
１８……ダイボンド用パツド、１９……カバーコート、
２０……画像表示部、２１……異方性導電膜。 尚、図中同一符号は同一又は相当部分を示す。1 to 6 show a display device according to a first embodiment of the present invention, and FIG. 1 is a perspective view of a drive IC mounting portion,
2 is a perspective view of a flexible film substrate, FIG. 3 is a perspective view of a flexible film substrate on which a driving IC is mounted, FIG. 4 is a partial perspective view of a display panel substrate, and FIG. FIG. 6 is an overall plan view, FIGS. 7 and 8 are perspective views of a driving IC mounting portion of a display device according to a second embodiment of the present invention and a partial perspective view of a display panel substrate, respectively. FIG. 9, FIG. 9 and FIG. 10 are a cross-sectional view and a plan view of an essential part of a conventional display device, respectively. 11 ... Display panel substrate, 12 ... First conducting wire, 13 ...
Flexible film substrate, 14 ... Driving IC, 15 ... Second conducting wire, 16 ... Third conducting wire, 17 ... Fourth conducting wire,
18 ... Pad for die bond, 19 ... Cover coat,
20 ... Image display part, 21 ... Anisotropic conductive film. The same reference numerals in the drawings indicate the same or corresponding parts.
Claims (12)
有する表示パネル基板、この表示パネル基板の上に設置
された可撓性フイルム基板、この可撓性フイルム基板を
介して表示パネル基板の上に設けられ、制御信号を入力
する入力端子と画像表示部の画像を表示するための出力
信号を出力する出力端子とを有する駆動用ＩＣ、互いに
並行にかつ可撓性フイルム基板と表示パネル基板との間
を通つて表示パネル基板の上に配設された複数の第１の
導線、可撓性フイルム基板の上に互いに並行に配設さ
れ、一端が異方性導電膜を介して第１の導線と接続され
他端が上記入力端子と接続された複数の第２の導線、可
撓性フイルム基板の上に互いに並行に配設されると共
に、一端が上記出力端子と接続され他端が可撓性フイル
ム基板の端部に配設された複数の第３の導線、一端が可
撓性フイルム基板の端部において異方性導電膜を介して
第３の導線と接続され他端が複数の上記画素に接続され
た第４の導線を備えたことを特徴とする表示装置。1. A display panel substrate having an image display unit composed of a plurality of pixels, a flexible film substrate installed on the display panel substrate, and a display panel substrate via the flexible film substrate. A driving IC having an input terminal for inputting a control signal and an output terminal for outputting an output signal for displaying an image on the image display unit, the flexible film substrate and the display panel substrate being parallel to each other. And a plurality of first conductive wires that are disposed on the display panel substrate through the space between the first conductive line and the flexible film substrate, and the first conductive lines are disposed in parallel on the flexible film substrate. A plurality of second conductors connected to the conductors and the other ends of which are connected to the input terminals, and the second conductors are arranged in parallel on the flexible film substrate, one end of which is connected to the output terminal and the other end of which is disposed. Located on the edge of the flexible film substrate A plurality of third conductive wires, one end of which is connected to the third conductive wire through an anisotropic conductive film at the end of the flexible film substrate and the other end of which is connected to the plurality of pixels. A display device characterized by being provided.
特徴とする特許請求の範囲第１項記載の表示装置。2. The display device according to claim 1, wherein the display panel substrate is a liquid crystal panel.
ネルであることを特徴とする特許請求の範囲第１項記載
の表示装置。3. The display device according to claim 1, wherein the display panel substrate is an electrochromic panel.
を特徴とする特許請求の範囲第１項記載の表示装置。4. The display device according to claim 1, wherein the display panel substrate is an LED panel.
ことを特徴とする特許請求の範囲第１項記載の表示装
置。5. The display device according to claim 1, wherein the flexible film substrate is made of polyimide.
ングにより接続されたことを特徴とする特許請求の範囲
第１項記載の表示装置。6. The display device according to claim 1, wherein the input terminal and the second conductive wire are connected by wire bonding.
ングにより接続されたことを特徴とする特許請求の範囲
第１項記載の表示装置。7. The display device according to claim 1, wherein the output terminal and the third conductive wire are connected by wire bonding.
つて配設されたことを特徴とする特許請求の範囲第１項
記載の表示装置。8. The display device according to claim 1, wherein the fourth conductive wire is arranged so as to pass under the flexible film substrate.
するとともに、駆動用ＩＣ下の可撓性フイルム基板上に
第２の導線のいずれかと接続されたダイボンド用パツド
を設け、駆動用ＩＣと可撓性フイルム基板とを導電性ダ
イボンド材が駆動用ＩＣの下面全面を覆うことにより接
着させたことを特徴とする特許請求の範囲第１項記載の
表示装置。9. A second bonding wire under the driving IC is covered with an insulator, and a die bonding pad connected to any one of the second conductive wires is provided on a flexible film substrate under the driving IC, 2. The display device according to claim 1, wherein the driving IC and the flexible film substrate are bonded to each other by covering the entire lower surface of the driving IC with a conductive die bonding material.
よび突起状バンプのいずれかであることを特徴とする特
許請求の範囲第１項記載の表示装置。10. The display device according to claim 1, wherein the input terminal and the output terminal are either a flat pad or a bump.
り、入力端子と第２の導線および出力端子と第３の導線
とはそれぞれワイヤボンデイングにより接続され、第４
の導線は可撓性フイルム基板の下を通つて配設され、駆
動用ＩＣ下の第２の導線を絶縁物で被覆するとともに、
駆動用ＩＣ下の可撓性フイルム基板上に第２の導線のい
ずれかと接続されたダイボンド用パツドを設け、駆動用
ＩＣと可撓性フイルム基板とを導電性ダイボンド材が駆
動用ＩＣの下面全面を覆うことにより接着させたことを
特徴とする特許請求の範囲第１項〜第４項のいずれかに
記載の表示装置。11. The flexible film substrate is made of polyimide, and the input terminal and the second conductive wire and the output terminal and the third conductive wire are connected by wire bonding, respectively.
Is arranged so as to pass under the flexible film substrate, and the second conductor under the driving IC is covered with an insulating material.
A die-bonding pad connected to one of the second conductors is provided on the flexible film substrate under the driving IC, and the driving IC and the flexible film substrate are electrically conductive die-bonding material on the entire lower surface of the driving IC. The display device according to any one of claims 1 to 4, wherein the display device is adhered by covering.
び第３の導線と第４の導線の接続部をＪＩＳ(A)硬度１
０〜１５０、２５℃での体積抵抗率１０″Ωcm以上の樹
脂体で覆つたことを特徴とする特許請求の範囲第１項〜
第４項のいずれかに記載の表示装置。12. The JIS (A) hardness 1 is used for connecting the connecting portion between the second conducting wire and the first conducting wire and the connecting portion between the third conducting wire and the fourth conducting wire.
A resin body having a volume resistivity of 10 ″ Ωcm or more at 0 to 150 ° C. and 25 ° C. is covered with the resin body.
The display device according to claim 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60296254A JPH0640247B2 (en) | 1985-12-27 | 1985-12-27 | Display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60296254A JPH0640247B2 (en) | 1985-12-27 | 1985-12-27 | Display device |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12475795A Division JPH0843842A (en) | 1995-05-24 | 1995-05-24 | Liquid crystal display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62153994A JPS62153994A (en) | 1987-07-08 |
| JPH0640247B2 true JPH0640247B2 (en) | 1994-05-25 |
Family
ID=17831188
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60296254A Expired - Lifetime JPH0640247B2 (en) | 1985-12-27 | 1985-12-27 | Display device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0640247B2 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS597393A (en) * | 1982-07-05 | 1984-01-14 | セイコーエプソン株式会社 | Display |
| JPS59129834A (en) * | 1983-01-17 | 1984-07-26 | Hitachi Ltd | Liquid crystal display element |
| JPS60130721A (en) * | 1983-12-19 | 1985-07-12 | Citizen Watch Co Ltd | Liquid-crystal display device |
| JPS61114226A (en) * | 1984-11-09 | 1986-05-31 | Hitachi Ltd | Liquid-crystal display element |
-
1985
- 1985-12-27 JP JP60296254A patent/JPH0640247B2/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS597393A (en) * | 1982-07-05 | 1984-01-14 | セイコーエプソン株式会社 | Display |
| JPS59129834A (en) * | 1983-01-17 | 1984-07-26 | Hitachi Ltd | Liquid crystal display element |
| JPS60130721A (en) * | 1983-12-19 | 1985-07-12 | Citizen Watch Co Ltd | Liquid-crystal display device |
| JPS61114226A (en) * | 1984-11-09 | 1986-05-31 | Hitachi Ltd | Liquid-crystal display element |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62153994A (en) | 1987-07-08 |
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