JPH0546930B2 - - Google Patents
Info
- Publication number
- JPH0546930B2 JPH0546930B2 JP58239545A JP23954583A JPH0546930B2 JP H0546930 B2 JPH0546930 B2 JP H0546930B2 JP 58239545 A JP58239545 A JP 58239545A JP 23954583 A JP23954583 A JP 23954583A JP H0546930 B2 JPH0546930 B2 JP H0546930B2
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- piece
- crystal display
- display device
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 27
- 239000004973 liquid crystal related substance Substances 0.000 claims description 22
- 239000012212 insulator Substances 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 2
- 239000010419 fine particle Substances 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 description 13
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000011324 bead Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13454—Drivers integrated on the active matrix substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Wire Bonding (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は液晶表示装置に関し、特に集積回路片
（以下IC片と呼ぶ）を液晶表示基板面上に実装し
た液晶表示装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a liquid crystal display device, and particularly to a liquid crystal display device in which an integrated circuit piece (hereinafter referred to as an IC piece) is mounted on a liquid crystal display substrate surface.
近年、液晶表示装置の表示画素数は次第に増大
しており、これに伴つて、表示基板上の配線電極
の本数、画素駆動IC片の個数、各IC片の出力ピ
ンの数が増しており、液晶表示基板の高密度実装
が重要になつてきている。
In recent years, the number of display pixels in liquid crystal display devices has gradually increased, and along with this, the number of wiring electrodes on the display substrate, the number of pixel drive IC pieces, and the number of output pins on each IC piece have increased. High-density packaging of liquid crystal display substrates is becoming important.
第２図は液晶表示基板面上にワイヤーボンデイ
ングタイプのIC片を実装した液晶表示装置の従
来の構成例を示したものである。下ガラス基板２
０２と上ガラス基板２０６の重なり部に表示部２
０７が形成されている。表示部２０７は、図示し
ていないが、両基板の対向面に形成されている透
明画素電極と両基板間に挟持されている液晶層に
より表示動作が行われる。 FIG. 2 shows a conventional configuration example of a liquid crystal display device in which a wire bonding type IC piece is mounted on the surface of a liquid crystal display substrate. Lower glass substrate 2
02 and the upper glass substrate 206 overlap with each other.
07 is formed. Although not shown, the display section 207 performs a display operation using transparent pixel electrodes formed on opposing surfaces of both substrates and a liquid crystal layer sandwiched between both substrates.
下ガラス基板２０２上には表示部２０７を駆動
するIC片２０４が固着されており、該IC片２０
４と表示部２０７の透明画素電極はリード電極２
２６を介して連結している。ここで、リード電極
２２６の配線パターンはIC片２０４の下には形
成されず、周囲に形成されている。これは、IC
片２０４が導電性であることの他に、IC片の下
に導電金属体を配置しておき、IC片の基板電位
をこの金属体から与えるようにすることである。 An IC piece 204 that drives the display section 207 is fixed on the lower glass substrate 202.
4 and the transparent pixel electrode of the display section 207 are lead electrodes 2
It is connected via 26. Here, the wiring pattern of the lead electrode 226 is not formed under the IC piece 204 but around it. This is an IC
In addition to the fact that the piece 204 is conductive, a conductive metal body is placed under the IC piece, and the substrate potential of the IC piece is applied from this metal body.
ガラス基板上に固定されたIC片のボンデイン
グパド２０９とガラス基板側ボンデイングパド２
１１の間はワイヤーボンデイング線２０８で接続
されており、表示部２０７側のパドも同様にボン
デイング線２２４で接続されている。更に、これ
らのボンデイング線とIC片はモールドされてい
る。 Bonding pad 209 of the IC piece fixed on the glass substrate and bonding pad 2 on the glass substrate side
11 are connected by a wire bonding line 208, and the pads on the display portion 207 side are similarly connected by a bonding line 224. Furthermore, these bonding lines and IC pieces are molded.
ところで、第２図の如きリード電極の配線パタ
ーンでは、表示画素数が増え、リード電極の本数
が増してくると、IC片の周囲に配線が密集して
くるため、ガラス面上の面積に限界が生じ、IC
片も高密度の実装ができなくなつてくる。 By the way, in the wiring pattern of lead electrodes as shown in Figure 2, as the number of display pixels increases and the number of lead electrodes increases, the wiring becomes denser around the IC piece, so there is a limit to the area on the glass surface. occurs, IC
It will become impossible to implement high-density packaging.
本発明はワイヤーボンデイングによりIC片が
実装される液晶表示基板における上記問題点を解
決した、IC片の実装密度の高い液晶表示装置を
提供することを目的とする。 SUMMARY OF THE INVENTION An object of the present invention is to provide a liquid crystal display device that solves the above-mentioned problems in liquid crystal display substrates on which IC pieces are mounted by wire bonding, and in which the IC pieces are mounted at a high density.
上記目的を達成するために、本発明は、対向配
置された、透明電極を有する基板間の液晶材料
を、電気的に駆動する集積回路片が、該基板に固
着され、リード電極を介して該透明電極と接続さ
れている液晶表示装置において、該リード電極を
群に分け、第１のリード電極群の第１の終端群の
更に先方まで、第２のリード電極群を延長して第
２の終端群を用意し、該集積回路片を該第１及び
第２の終端群の間の、該第２のリード電極群が形
成された上に絶縁物を介在させて基板に固着し、
該第１および第２の終端群と該集積回路片とを電
気的に接続する事を特徴としている。
In order to achieve the above object, the present invention provides an integrated circuit piece that electrically drives a liquid crystal material between substrates having transparent electrodes, which are arranged opposite to each other, is fixed to the substrate, and is connected to the liquid crystal material through lead electrodes. In a liquid crystal display device connected to transparent electrodes, the lead electrodes are divided into groups, and a second lead electrode group is extended beyond the first end group of the first lead electrode group to form a second lead electrode group. preparing a terminal group, fixing the integrated circuit piece to the substrate between the first and second terminal groups on which the second lead electrode group is formed, with an insulator interposed;
It is characterized in that the first and second terminal groups and the integrated circuit piece are electrically connected.
第１図は本発明の液晶表示装置の構成に示した
ものである。本実施例も第２図の従来例と同じよ
うにIC片１０４が搭載された下ガラス基板１０
２と上ガラス基板１０６の重なり部に表示部１０
７が形成された液晶表示装置である。ここで、リ
ード電極１２６はIC片１０４の下を通つており、
第２図に示す、従来のリード電極２２６のように
IC片１０４の周囲に形成する場合に比べると、
実装面積は大幅に減少している。
FIG. 1 shows the structure of a liquid crystal display device according to the present invention. In this embodiment, the lower glass substrate 10 on which the IC piece 104 is mounted is similar to the conventional example shown in FIG.
2 and the upper glass substrate 106 overlap with each other.
This is a liquid crystal display device in which 7 is formed. Here, the lead electrode 126 passes under the IC piece 104,
Like the conventional lead electrode 226 shown in FIG.
Compared to the case where it is formed around the IC piece 104,
The mounting area has been significantly reduced.
リード電極１２６は酸化インジウム、酸化スズ
の上に金、アルミ等のボンデイングに向いた金属
を形成したものである。 The lead electrode 126 is formed by forming a metal suitable for bonding, such as gold or aluminum, on indium oxide or tin oxide.
IC片１０４の接着は２種混合タイプのエポキ
シ系樹脂に、ガラスビーズ、フアイバーガラス、
プラスチツクビーズ、プラスチツク粗布等の固体
の絶縁性小片を混合した接着剤を用いて行つた。
IC片１０４とリード電極１２６は絶遠性小片に
より十分な絶縁が保たれる。 The IC piece 104 is bonded using a mixed type of epoxy resin, glass beads, fiber glass, etc.
This was done using an adhesive mixed with solid insulating pieces such as plastic beads and plastic sack cloth.
The IC piece 104 and the lead electrode 126 are kept sufficiently insulated by the small piece of insulation.
IC片固着後は、IC片のボンデイングパド１０
９とガラス基板とのボンデイングパド１１１をボ
ンデイングワイヤ１０８により接続する。表示部
１０７側もボンデイング線１１４で接続する。ボ
ンデイング後、これらのボンデイング線とIC片
をおおうようにしてモールド剤でモールドした。 After the IC piece is fixed, use the bonding pad 10 of the IC piece.
A bonding pad 111 between the substrate 9 and the glass substrate is connected by a bonding wire 108. The display section 107 side is also connected by a bonding wire 114. After bonding, these bonding wires and the IC piece were covered and molded with a molding agent.
ここで、IC片の固着は、まず絶遠性小片をリ
ード電極とIC片の間に介在させて、IC片を仮固
定しておき、次に接着剤をすき間に注入して固着
した後、モールド材によつて耐湿性を付与するよ
うにしてもよい。 Here, the fixing of the IC piece is done by first interposing an infinitesimal piece between the lead electrode and the IC piece to temporarily fix the IC piece, then injecting adhesive into the gap and fixing it. Moisture resistance may be imparted using a molding material.
又、治具を用いて、リード電極が配線された基
板の上にIC片を一定の距離をおいて仮固定し、
モールドの時すき間をおおいつくすようにして、
耐湿モールドをするようにしてもよい。 Also, using a jig, temporarily fix the IC piece on the board on which the lead electrodes are wired at a certain distance.
Make sure to cover all the gaps when molding,
A moisture-resistant mold may be used.
本発明の液晶表示装置は、IC片が固着される
表示基板上にリード電極の配線パターンを、IC
片の下になる領域をも用いて、狭い範囲で形成す
るようにしたので、画素数の多い液晶表示装置も
IC片の実装密度があがり、表示基板の面積が小
さく押えられる。
The liquid crystal display device of the present invention has a lead electrode wiring pattern on the display substrate to which the IC piece is fixed.
By using the area under the piece, we formed it in a narrow area, so it can be used even for liquid crystal display devices with a large number of pixels.
The mounting density of IC chips increases, and the area of the display board can be kept small.
第１図は本発明の一実施例の構成図、第２図は
従来の液晶表示装置の構成図である。
１０２……下ガラス基板、１０４……IC片、
１０６……上ガラス基板、１０８，１１４……ボ
ンデイング線、１０９……IC片側ボンデイング
パド、１１１……ガラス基板側ボンデイングパ
ド、１２６……リード電極。
FIG. 1 is a block diagram of an embodiment of the present invention, and FIG. 2 is a block diagram of a conventional liquid crystal display device. 102...Lower glass substrate, 104...IC piece,
106... Upper glass substrate, 108, 114... Bonding wire, 109... IC one side bonding pad, 111... Glass substrate side bonding pad, 126... Lead electrode.
Claims (1)
液晶材料を、電気的に駆動する集積回路片が、該
基板に固着され、リード電極を介して該透明電極
と接続されている液晶表示装置において、該リー
ド電極を群に分け、第１のリード電極群の第１の
終端群の更に先方まで、第２のリード電極群を延
長して第２の終端群を用意し、該集積回路片を該
第１及び第２の終端群の間の、該第２のリード電
極群が形成された上に絶縁物を介在させて基板に
固着し、該第１および第２の終端群と該集積回路
片とを電気的に接続する事を特徴とする液晶表示
装置。 ２ 絶縁物は、固体絶縁体微粒子と接着材の混合
物である事を特徴とする特許請求の範囲第１項に
記載の液晶表示装置。[Claims] 1. An integrated circuit piece for electrically driving a liquid crystal material between substrates having transparent electrodes arranged opposite to each other is fixed to the substrate and connected to the transparent electrode via a lead electrode. In the liquid crystal display device, the lead electrodes are divided into groups, and a second terminal group is prepared by extending a second terminal group further beyond the first terminal terminal group of the first terminal terminal group. , the integrated circuit piece is fixed to a substrate between the first and second terminal groups on which the second lead electrode group is formed, with an insulator interposed therebetween; A liquid crystal display device characterized in that a termination group and the integrated circuit piece are electrically connected. 2. The liquid crystal display device according to claim 1, wherein the insulator is a mixture of solid insulator fine particles and an adhesive.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58239545A JPS60130721A (en) | 1983-12-19 | 1983-12-19 | Liquid-crystal display device |
| GB08431867A GB2151834B (en) | 1983-12-19 | 1984-12-18 | Liquid crystal display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58239545A JPS60130721A (en) | 1983-12-19 | 1983-12-19 | Liquid-crystal display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60130721A JPS60130721A (en) | 1985-07-12 |
| JPH0546930B2 true JPH0546930B2 (en) | 1993-07-15 |
Family
ID=17046400
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58239545A Granted JPS60130721A (en) | 1983-12-19 | 1983-12-19 | Liquid-crystal display device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS60130721A (en) |
| GB (1) | GB2151834B (en) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6294825A (en) * | 1985-10-21 | 1987-05-01 | Nitto Electric Ind Co Ltd | Module for liquid crystal display |
| JPH0640247B2 (en) * | 1985-12-27 | 1994-05-25 | 三菱電機株式会社 | Display device |
| JPH0618385Y2 (en) * | 1986-06-23 | 1994-05-11 | 株式会社カンセイ | Display device |
| EP0344367B1 (en) * | 1988-05-03 | 1994-08-24 | Copytele Inc. | Monolithic flat panel display apparatus |
| FI80821C (en) * | 1987-02-23 | 1990-07-10 | Lohja Ab Oy | SKIVFORMIG DISPLAYKONSTRUKTION, I SYNNERHET ELEKTROLUMINENSDISPLAYKONSTRUKTION. |
| JPS6455927U (en) * | 1987-10-05 | 1989-04-06 | ||
| EP0337775B1 (en) * | 1988-04-12 | 1996-06-19 | Sharp Kabushiki Kaisha | Electronic apparatus |
| DE3910963A1 (en) * | 1989-04-05 | 1990-10-11 | Licentia Gmbh | CIRCUIT ARRANGEMENT |
| JPH0310224A (en) * | 1989-06-07 | 1991-01-17 | Sharp Corp | Display device |
| JPH04233514A (en) * | 1990-12-28 | 1992-08-21 | Sharp Corp | Active matrix substrate |
| JP2595484B2 (en) * | 1995-07-13 | 1997-04-02 | セイコープレシジョン株式会社 | Connection structure between liquid crystal panel and integrated circuit for driving it |
| JPH10186393A (en) * | 1996-12-19 | 1998-07-14 | Shin Etsu Polymer Co Ltd | Connector for display inspection of liquid crystal display panel, and production therefor |
| SE516936C2 (en) * | 1999-12-10 | 2002-03-26 | Ericsson Telefon Ab L M | Liquid crystal display, LCD |
| DE102004028911A1 (en) * | 2004-06-15 | 2006-01-12 | Optrex Europe Gmbh | Liquid crystal display panel receives signals from an integrated circuit control chip via a ribbon cable |
| TWI457671B (en) | 2008-11-10 | 2014-10-21 | Au Optronics Corp | Glass substrate of a flat panel display and integrated circuit chip for display |
| CN104470210A (en) * | 2014-12-31 | 2015-03-25 | 京东方科技集团股份有限公司 | Circuit board, manufacturing method of circuit board and display device of circuit board |
-
1983
- 1983-12-19 JP JP58239545A patent/JPS60130721A/en active Granted
-
1984
- 1984-12-18 GB GB08431867A patent/GB2151834B/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| GB2151834A (en) | 1985-07-24 |
| GB2151834B (en) | 1987-01-21 |
| JPS60130721A (en) | 1985-07-12 |
| GB8431867D0 (en) | 1985-01-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |