JPH0383449A - Mounting structure for sensor and signal processing circuit for the same - Google Patents
Mounting structure for sensor and signal processing circuit for the sameInfo
- Publication number
- JPH0383449A JPH0383449A JP1219930A JP21993089A JPH0383449A JP H0383449 A JPH0383449 A JP H0383449A JP 1219930 A JP1219930 A JP 1219930A JP 21993089 A JP21993089 A JP 21993089A JP H0383449 A JPH0383449 A JP H0383449A
- Authority
- JP
- Japan
- Prior art keywords
- sensor
- substrate
- chips
- signal processing
- processing circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 abstract description 22
- 238000000034 method Methods 0.000 abstract description 5
- 238000001816 cooling Methods 0.000 description 8
- 239000007788 liquid Substances 0.000 description 6
- 239000003507 refrigerant Substances 0.000 description 5
- 238000007654 immersion Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Facsimile Heads (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、センサおよびその信号処理回路の基板への実
装構造に関する。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a mounting structure for a sensor and its signal processing circuit on a substrate.
〈従来の技術〉
センサおよびその信号処理回路の実装構造としては、第
４図に示すように、基板４１の片面にセンサチップ４２
および信号処理回路用のＩＣチップ４３をフリップチッ
プ法等により実装した構造のものが一般的である。そし
て、医療用Ｘ線撮像装置等においては、このような実装
モジュールをセンサチップ４２の幅分シフトして階段状
に積み重ねて、全体として大規模の面センサユニットを
樋底している。<Prior art> As shown in FIG. 4, a sensor chip 42 is mounted on one side of a substrate 41 as a mounting structure for a sensor and its signal processing circuit.
It is common to have a structure in which an IC chip 43 for a signal processing circuit is mounted by a flip-chip method or the like. In medical X-ray imaging apparatuses and the like, such mounted modules are shifted by the width of the sensor chip 42 and stacked in a stepwise manner to form a large-scale surface sensor unit as a whole.
〈発明が解決しようとする課題〉
ところで、第４図に示す面センサユニットによると、各
センサチップ４２・・・４２間にどうしても段差ができ
るため、最上段と最下段とのセンサでは、線源あるいは
光源からの距離が大きく異なり、これにより、画質が低
下するという問題がある。<Problems to be Solved by the Invention> By the way, according to the surface sensor unit shown in FIG. Alternatively, there is a problem that the distance from the light source differs greatly, which deteriorates the image quality.
また、この画質の低下を軽減するために、従来、各基板
４１それぞれの間隔を可能な限り狭くしており、このた
め、ＩＣチップ４３の冷却効率が非常に悪くなるという
問題がある。Furthermore, in order to reduce this deterioration in image quality, conventionally, the distance between the respective substrates 41 has been made as narrow as possible, which causes the problem that the cooling efficiency of the IC chip 43 is extremely poor.
さらに、ＩＣチップ４３の冷却に液体浸漬法を採用する
場合には、第４図に示すにように、ＩＣチップ４３実装
部分のみを冷媒容器４７により覆い、かつ、各基板４１
と冷媒容器４７との隙間を樹脂封止してセンサチップ４
２が冷媒液に浸されないように必要がある。このため、
冷媒容器４７の形状が複雑になるばかりでなく、樹脂に
よる封止作業が煩雑となり、その作業に多くの時間を要
していた。Furthermore, when a liquid immersion method is adopted for cooling the IC chip 43, as shown in FIG.
The gap between the refrigerant container 47 and the sensor chip 4 is sealed with resin.
2 must not be immersed in the refrigerant liquid. For this reason,
Not only does the shape of the refrigerant container 47 become complicated, but also the sealing work with resin becomes complicated, and the work requires a lot of time.
〈課題を解決するための手段〉
本発明は、上記の諸問題点を一挙に解決するためになさ
れたもので、その構成を実施例に対応する第１図を参照
しつつ説明すると、本発明は、基板１の片面にセンサチ
ップ２を配設し、かつ、その基板１のセンサ配設面の裏
面側に信号処理回路用チップ３ａ・・・３ａ、３ｂ・・
・３ｂを配設したことによって特徴づけられる。<Means for Solving the Problems> The present invention has been made in order to solve the above-mentioned problems all at once.The structure of the present invention will be explained with reference to FIG. 1 corresponding to an embodiment. The sensor chip 2 is disposed on one side of the substrate 1, and the signal processing circuit chips 3a...3a, 3b... are disposed on the back side of the sensor disposed surface of the substrate 1.
・It is characterized by the arrangement of 3b.
く作用〉
複数個のセンサチップ２・・・２を、−枚の基板１に実
装でき、各センサチップ２を同一の平面上に並べること
が可能となる。さらに、各信号処理回路用チップ３ａ・
・・３ａ、３ｂ・・・３ｂの周辺スペースを広くするこ
とができる。Effects> A plurality of sensor chips 2...2 can be mounted on the - number of substrates 1, and each sensor chip 2 can be arranged on the same plane. Furthermore, each signal processing circuit chip 3a.
... 3a, 3b... The surrounding space of 3b can be widened.
〈実施例〉 本発明の実施例を、以下、図面に基づいて説明する。<Example> Embodiments of the present invention will be described below based on the drawings.
第１図は本発明実施例の構造を示す側面図で、第２図は
第１図のＡ部詳細図である。FIG. 1 is a side view showing the structure of an embodiment of the present invention, and FIG. 2 is a detailed view of section A in FIG.
第１の基板１の上面に、複数個のセンサチップ２・・・
２が互いに隣接して実装されている。このセンサチップ
２・・・２の基板１への実装は、各センサチップ２の信
号取り出し電極（図示せず）にハンダバンプ２ａ・・・
２ａを形成しておき、各センサチップをハンダバンプを
上方に向けて面状に配列し、次いで、上方からセラミッ
ク配線基板１を、その接続パターン（図示せず）をそれ
ぞれ対応するハンダバンプ２ａ・・・２ａに位置決めし
た状態で、全てのハンダバンプ２ａ・・・２ａをリフロ
ーすることによって行う。On the upper surface of the first substrate 1, a plurality of sensor chips 2...
2 are mounted adjacent to each other. The sensor chips 2...2 are mounted on the substrate 1 using solder bumps 2a...2 on the signal extraction electrodes (not shown) of each sensor chip 2.
2a, the respective sensor chips are arranged in a plane with the solder bumps facing upward, and then the ceramic wiring board 1 is attached from above, and the connection patterns (not shown) are connected to the corresponding solder bumps 2a... This is done by reflowing all the solder bumps 2a...2a in a state where they are positioned at 2a.
第１の基板１の下面には、各センサチップ２・・・２に
対応して、１個ないし２個のプリアンプチップ３ａ・・
・３ａが、フリップチップ法等により実装されている。On the lower surface of the first substrate 1, one or two preamplifier chips 3a...corresponding to each sensor chip 2...2 are provided.
・3a is mounted by flip-chip method or the like.
この各プリアンプチップ３ａの信号入力端は、基板１の
スルーホール（図示せず）を通じてセンサチップ２の信
号取り出し電極に電気的に接続されており、また出力側
は、異方導電フィルムを熱圧着した接続パッド４・・・
４に、基板１表面の導体パターン（図示せず）を介して
接続されている。The signal input end of each preamplifier chip 3a is electrically connected to the signal take-out electrode of the sensor chip 2 through a through hole (not shown) in the substrate 1, and the output side is bonded with an anisotropic conductive film by thermocompression. Connection pad 4...
4 through a conductor pattern (not shown) on the surface of the substrate 1.
各接続パッド４・・・４部には、それぞれ１字型プリン
ト配線板５が実装されており、その各端部に、第１の基
板１に対して略垂直方向に伸びる第２の基板６がそれぞ
れ接続されている。この各基板６には、各センサチップ
２の信号処理回路用のＩＣチップ３ｂが、フリップチッ
プ法により実装されており、そのＩＣチップ３ｂの信号
入力端子は、基板６およびプリント配線板５に形成され
た配線パターン（ともに図示せず）を介して、接続パッ
ド４・・・４に接続されている。なお、プリント配線板
５と基板６との接続は、異方導電フィルムの熱圧着等に
よって行われる。A single-shaped printed wiring board 5 is mounted on each of the connection pads 4 . are connected to each other. On each board 6, an IC chip 3b for the signal processing circuit of each sensor chip 2 is mounted by the flip-chip method, and the signal input terminal of the IC chip 3b is formed on the board 6 and the printed wiring board 5. The connection pads 4 are connected to the connection pads 4 through a wiring pattern (both not shown). Note that the connection between the printed wiring board 5 and the substrate 6 is performed by thermocompression bonding of an anisotropic conductive film or the like.
以上の本発明実施例によると、センサチップ２の出力信
号が、最短距離でプリアンプチップ３ａに導かれるので
、ノイズ等による影響を軽減できる。また、センサチッ
プ２とその信号処理回路用のチップ３ａ、３ｂが基板１
を挾んで配設されているので、本発明実施例を、例えば
医療用Ｘ線撮像装置等に適用する場合、Ｘ線による回路
チップ３ａ、３ｂの損傷を軽減できる。According to the embodiment of the present invention described above, the output signal of the sensor chip 2 is guided to the preamplifier chip 3a through the shortest distance, so that the influence of noise etc. can be reduced. Further, the sensor chip 2 and its signal processing circuit chips 3a and 3b are mounted on the substrate 1.
Therefore, when the embodiment of the present invention is applied to, for example, a medical X-ray imaging device, damage to the circuit chips 3a and 3b caused by X-rays can be reduced.
また、本発明実施例においては、第３図に示すように、
第１の基Ｆｉ、ｉ下面に簡単な構造の冷媒容器７を、単
に接着材等により固着するだけで、液体冷媒（例えばパ
ーフロロカーボン系）の流路りを形成できる。従って、
冷却効率の高い液体浸漬冷却法を容易に実施することが
できる。In addition, in the embodiment of the present invention, as shown in FIG.
A flow path for a liquid refrigerant (perfluorocarbon type, for example) can be formed by simply fixing a refrigerant container 7 with a simple structure to the lower surface of the first group Fi, i using an adhesive or the like. Therefore,
A liquid immersion cooling method with high cooling efficiency can be easily implemented.
なお、以上の本発明実施例では、プリアンプのみを第１
の基板１の裏面に実装しいるが、１個のセンサチップ２
の画素数が少なく、かつ、そのピッチも大きい場合には
、プリアンプおよびアナログ信号処理回路をｌチップ内
に集積し、そのチップを基板１裏面に実装することも可
能である。Note that in the above embodiments of the present invention, only the preamplifier is
One sensor chip 2 is mounted on the back side of the substrate 1.
When the number of pixels is small and the pitch thereof is large, it is also possible to integrate the preamplifier and analog signal processing circuit into an l chip and mount that chip on the back surface of the substrate 1.
〈発明の効果〉
以上説明したように、本発明によれば、基板の片面にセ
ンサを配設し、かつ、その基板のセンサ配設面の裏面側
に信号処理回路を配設したから、段差のない完全な面セ
ンサを構築できる。これにより、本発明を例えば医療用
Ｘ線撮像装置等に適用するにあたり、画像ムラ等のない
鮮明な画像を得ることが可能となる。また、各信号処理
回路の周辺スペースを広くすることができ、各信号処理
回路の冷却効率が従来に比して向上する。さらに、冷却
効率の高い液体浸漬冷却法を容易に実施できる。<Effects of the Invention> As explained above, according to the present invention, the sensor is disposed on one side of the substrate, and the signal processing circuit is disposed on the back side of the surface on which the sensor is disposed. It is possible to construct a complete surface sensor without As a result, when the present invention is applied to, for example, a medical X-ray imaging device, it is possible to obtain clear images without image unevenness. Further, the peripheral space of each signal processing circuit can be increased, and the cooling efficiency of each signal processing circuit is improved compared to the conventional method. Furthermore, a liquid immersion cooling method with high cooling efficiency can be easily implemented.
第１図は本発明実施例の構造を示す側面図で、第２図は
第１図のＡ部詳細図である。
第３図は、本発明実施例に液体浸漬冷却法を適用した場
合の構造例を示す断面図である。
第４図は、従来の面センサユニットの構造例を示す側面
図である。
１・・・基板
２・・・センサチップ
３ａ・・・プリアンプチップFIG. 1 is a side view showing the structure of an embodiment of the present invention, and FIG. 2 is a detailed view of section A in FIG. FIG. 3 is a cross-sectional view showing an example of the structure when the liquid immersion cooling method is applied to the embodiment of the present invention. FIG. 4 is a side view showing a structural example of a conventional surface sensor unit. 1... Board 2... Sensor chip 3a... Preamplifier chip
Claims (1)
って、基板の片面にセンサを配設し、かつ、その基板の
上記センサ配設面の裏面側に信号処理回路を配設したこ
とを特徴とする、センサおよびその信号処理回路の実装
構造。A structure for mounting a sensor and its signal processing circuit on a board, characterized in that the sensor is arranged on one side of the board, and the signal processing circuit is arranged on the back side of the sensor arrangement side of the board. The mounting structure of the sensor and its signal processing circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP01219930A JP3118805B2 (en) | 1989-08-25 | 1989-08-25 | Mounting structure of sensor and its signal processing circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP01219930A JP3118805B2 (en) | 1989-08-25 | 1989-08-25 | Mounting structure of sensor and its signal processing circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0383449A true JPH0383449A (en) | 1991-04-09 |
| JP3118805B2 JP3118805B2 (en) | 2000-12-18 |
Family
ID=16743249
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP01219930A Expired - Fee Related JP3118805B2 (en) | 1989-08-25 | 1989-08-25 | Mounting structure of sensor and its signal processing circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3118805B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2349504A (en) * | 1999-04-26 | 2000-11-01 | Simage Oy | Imaging device assembly |
-
1989
- 1989-08-25 JP JP01219930A patent/JP3118805B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2349504A (en) * | 1999-04-26 | 2000-11-01 | Simage Oy | Imaging device assembly |
| GB2349504B (en) * | 1999-04-26 | 2002-10-02 | Simage Oy | Imaging device assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3118805B2 (en) | 2000-12-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |