GB2349504B - Imaging device assembly - Google Patents

Imaging device assembly

Info

Publication number
GB2349504B
GB2349504B GB9916793A GB9916793A GB2349504B GB 2349504 B GB2349504 B GB 2349504B GB 9916793 A GB9916793 A GB 9916793A GB 9916793 A GB9916793 A GB 9916793A GB 2349504 B GB2349504 B GB 2349504B
Authority
GB
United Kingdom
Prior art keywords
imaging device
device assembly
assembly
imaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9916793A
Other versions
GB9916793D0 (en
GB2349504A (en
Inventor
Markku Tapio Eraluoto
Stefan Jurthe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Simage Oy
Original Assignee
Simage Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Simage Oy filed Critical Simage Oy
Publication of GB9916793D0 publication Critical patent/GB9916793D0/en
Priority to US09/958,923 priority Critical patent/US6703617B1/en
Priority to PCT/IB2000/000697 priority patent/WO2000065376A1/en
Priority to AU46032/00A priority patent/AU4603200A/en
Publication of GB2349504A publication Critical patent/GB2349504A/en
Application granted granted Critical
Publication of GB2349504B publication Critical patent/GB2349504B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14665—Imagers using a photoconductor layer
    • H01L27/14676—X-ray, gamma-ray or corpuscular radiation imagers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/30—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from X-rays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14634—Assemblies, i.e. Hybrid structures

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Measurement Of Radiation (AREA)
GB9916793A 1999-04-26 1999-07-16 Imaging device assembly Expired - Fee Related GB2349504B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US09/958,923 US6703617B1 (en) 1999-04-26 2000-04-26 Device for imaging radiation
PCT/IB2000/000697 WO2000065376A1 (en) 1999-04-26 2000-04-26 Device for imaging radiation
AU46032/00A AU4603200A (en) 1999-04-26 2000-04-26 Device for imaging radiation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB9909574.7A GB9909574D0 (en) 1999-04-26 1999-04-26 X-ray imaging system

Publications (3)

Publication Number Publication Date
GB9916793D0 GB9916793D0 (en) 1999-09-22
GB2349504A GB2349504A (en) 2000-11-01
GB2349504B true GB2349504B (en) 2002-10-02

Family

ID=10852281

Family Applications (2)

Application Number Title Priority Date Filing Date
GBGB9909574.7A Ceased GB9909574D0 (en) 1999-04-26 1999-04-26 X-ray imaging system
GB9916793A Expired - Fee Related GB2349504B (en) 1999-04-26 1999-07-16 Imaging device assembly

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GBGB9909574.7A Ceased GB9909574D0 (en) 1999-04-26 1999-04-26 X-ray imaging system

Country Status (1)

Country Link
GB (2) GB9909574D0 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6521881B2 (en) * 2001-04-16 2003-02-18 Kingpak Technology Inc. Stacked structure of an image sensor and method for manufacturing the same
JP4884964B2 (en) * 2004-05-11 2012-02-29 浜松ホトニクス株式会社 Radiation imaging device
GB0611619D0 (en) * 2006-06-12 2006-07-19 Radiation Watch Ltd Lead iodide deposition method
GB201215920D0 (en) 2012-09-06 2012-10-24 Johnson Matthey Plc Radiation detector

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0383449A (en) * 1989-08-25 1991-04-09 Shimadzu Corp Mounting structure for sensor and signal processing circuit for the same
EP0807976A2 (en) * 1996-05-17 1997-11-19 Sony Corporation Solid-state imaging apparatus and camera using the same
JPH10242486A (en) * 1997-02-27 1998-09-11 Canon Inc Mounting method for photoelectric converter
JPH11220656A (en) * 1998-01-30 1999-08-10 Canon Inc Mounting structure for two-dimensional image pickup device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0383449A (en) * 1989-08-25 1991-04-09 Shimadzu Corp Mounting structure for sensor and signal processing circuit for the same
EP0807976A2 (en) * 1996-05-17 1997-11-19 Sony Corporation Solid-state imaging apparatus and camera using the same
JPH10242486A (en) * 1997-02-27 1998-09-11 Canon Inc Mounting method for photoelectric converter
JPH11220656A (en) * 1998-01-30 1999-08-10 Canon Inc Mounting structure for two-dimensional image pickup device

Also Published As

Publication number Publication date
GB9916793D0 (en) 1999-09-22
GB9909574D0 (en) 1999-06-23
GB2349504A (en) 2000-11-01

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20030716