JPH0682706B2 - Connection - Google Patents

Connection

Info

Publication number
JPH0682706B2
JPH0682706B2 JP12393186A JP12393186A JPH0682706B2 JP H0682706 B2 JPH0682706 B2 JP H0682706B2 JP 12393186 A JP12393186 A JP 12393186A JP 12393186 A JP12393186 A JP 12393186A JP H0682706 B2 JPH0682706 B2 JP H0682706B2
Authority
JP
Japan
Prior art keywords
display panel
circuit board
electrode
insulating resin
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP12393186A
Other languages
Japanese (ja)
Other versions
JPS62281340A (en
Inventor
賢造 畑田
博昭 藤本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP12393186A priority Critical patent/JPH0682706B2/en
Publication of JPS62281340A publication Critical patent/JPS62281340A/en
Publication of JPH0682706B2 publication Critical patent/JPH0682706B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Landscapes

  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、ELディスプレイパネルや液晶ディスプレイパ
ネルと、これを駆動する半導体素子から延在した金属リ
ードとの接続の構造に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure for connecting an EL display panel or a liquid crystal display panel and a metal lead extending from a semiconductor element that drives the EL display panel or the liquid crystal display panel.

従来の技術 近年、液晶ディスプレイパネルやELディスプレイパネル
を用いて、画像表示や文字表示する機器が増加してい
る。これらディスプレイパネルは肉厚を薄くできる特徴
はあるものの、鮮明な画像や高精細度のキャラクターを
表示する場合、前記ディスプレイパネルに形成されてい
る走査線の数を増やさなければならない。この事は、液
晶ディスプレイやELディスプレイがよりCRTの表示性能
に接近し、附加価値を高めるうえでも不可欠の事であ
る。ところが、前記走査線の数を増やしてしまうと、デ
ィスプレイパネルの電極数も比例して増大する。電極数
の増大は、これを駆動するための駆動用のLSIの数も増
大する結果となるものである。2. Description of the Related Art In recent years, devices for displaying images and characters using liquid crystal display panels and EL display panels have been increasing. Although these display panels have the feature that they can be made thin, the number of scanning lines formed on the display panel must be increased in order to display a clear image and high-definition characters. This is essential for liquid crystal displays and EL displays to come closer to the display performance of CRTs and to increase added value. However, if the number of scanning lines is increased, the number of electrodes of the display panel also increases in proportion. The increase in the number of electrodes results in an increase in the number of driving LSIs for driving the electrodes.

したがって、液晶ディスプレイパネルやELディスプレイ
パネルの性能向上を計ろうとすれば、必然的に、前記駆
動用LSIとディスプレイパネルの電極との接続点数が増
え、信頼性を低下さす原因となるばかりか、実装コスト
が著じるしく増大し、実用化をはばむ原因となってい
る。Therefore, when trying to improve the performance of a liquid crystal display panel or an EL display panel, inevitably the number of connection points between the driving LSI and the electrodes of the display panel increases, which not only causes a decrease in reliability but also mounting The cost has increased remarkably, and it has been a factor that prevents practical use.

第２図で従来の構成を説明する。第２図ａで半導体素子
の電極が接続された可撓性を有する回路基板10は、ポリ
イミド，エポキシ等の絶縁性フィルム11上にディスプレ
イパネル４の外線に形成した電極群５のピッチと同一に
形成されたCu箔の配線パターン12が設けられている。The conventional configuration will be described with reference to FIG. In FIG. 2A, the flexible circuit board 10 to which the electrodes of the semiconductor element are connected has the same pitch as the electrode group 5 formed on the outer line of the display panel 4 on the insulating film 11 such as polyimide or epoxy. The formed wiring pattern 12 of Cu foil is provided.

一方、ディスプレイパネル４は、例えばガラス基板上に
電極５がITO等の材料で構成されているものである。前
記ITO等の電極５上には半田づけ可能な材料を被着せし
め、配線パターン12と半田14にて半田づけし固定するも
のである。On the other hand, in the display panel 4, for example, the electrodes 5 are made of a material such as ITO on a glass substrate. The electrode 5 such as ITO is coated with a solderable material and fixed by soldering with the wiring pattern 12 and the solder 14.

発明が解決しようとする問題点 この様な構成にあっては、ディスプレイパネル４の電極
５上あるいは、回路基板10の配線パターン12に半田づけ
のための処理が必要となり、実装コストを高くするばか
りか、接続時に半田の融点まで、ディスプレイパネルの
温度が上昇し、このためディスプレイパネルの特性を損
なうことがあった。Problems to be Solved by the Invention In such a configuration, a process for soldering is required on the electrodes 5 of the display panel 4 or on the wiring pattern 12 of the circuit board 10, which simply increases the mounting cost. In addition, the temperature of the display panel rises up to the melting point of the solder during connection, which may impair the characteristics of the display panel.

また、第２図ｂの如くディスプレイパネル４の電極５と
可撓性の回路基板２に開孔部７を有するリード群１とを
絶縁性樹脂6,6′を介して接続する方法もあるが、この
方法においては、開孔部７の領域外にディスプレイパネ
ル４の端部が位置している。すなわち、寸法Ｂだけ、デ
ィスプレイパネルの端部が開孔部外に飛び出した構成と
なる。この様な構成においては、可撓性の回路基板２の
応力が直接リード群１に作用し、リード群１とディスプ
レイパネル４の電極５の接合を破壊してしまい、信頼性
の低下を招くとともに、Ｂの部分ではリード群と電極と
の圧接時に圧力が加わりにくく、十分なる接続が得られ
ない不都合があった。There is also a method of connecting the electrode 5 of the display panel 4 and the lead group 1 having the opening 7 to the flexible circuit board 2 through the insulating resins 6 and 6'as shown in FIG. 2b. In this method, the end of the display panel 4 is located outside the area of the opening 7. That is, the end portion of the display panel is protruded outside the opening by the dimension B. In such a configuration, the stress of the flexible circuit board 2 directly acts on the lead group 1 and destroys the joint between the lead group 1 and the electrode 5 of the display panel 4, resulting in lower reliability. , B, it is difficult to apply pressure during pressure contact between the lead group and the electrode, and there is a disadvantage that sufficient connection cannot be obtained.

本発明はこのような従来の問題に鑑み、ディスプレイパ
ネルと回路基板の配線パターンであるリード群との接続
をより簡便かつ信頼性良く行うことを目的とする。The present invention has been made in view of such conventional problems, and an object thereof is to connect a display panel and a lead group, which is a wiring pattern of a circuit board, more easily and reliably.

問題点を解決するための手段 本発明は、可撓性を有する回路基板に開孔部を設け、前
記開孔部内の配線パターンであるリード群とディスプレ
イパネルの電極とを絶縁性樹脂で電気的に接続するとと
もに、開孔部領域内に回路基板の端面に位置させ、実装
コストの安価な信頼性の高い接続体を実現可能とするも
のである。Means for Solving the Problems According to the present invention, an opening is provided in a flexible circuit board, and a lead group, which is a wiring pattern in the opening, and an electrode of a display panel are electrically insulated with an insulating resin. It is possible to realize a highly reliable connection body at low mounting cost by connecting to, and locating it on the end face of the circuit board in the opening area.

作用 本発明によれば開孔部にフィルム等がないため、リード
群に歪が加わらず、リード群と電極との接合面全体が直
接圧接でき、信頼性の高い接合を得ることが可能とな
る。Effect According to the present invention, since there is no film or the like in the opening, no distortion is applied to the lead group, and the entire joint surface between the lead group and the electrode can be directly pressure-contacted, so that a highly reliable joint can be obtained. .

実施例 第１図で本発明の接続体の一実施例を説明する。Embodiment An embodiment of the connecting body of the present invention will be described with reference to FIG.

ポリイミド，エポキシ等の絶縁フィルム２の所定の位置
に開孔部７が設けられ、前記絶縁フィルム２に貼り合わ
されたCu箔からなる配線パターンであるリード群１は、
開孔部７にも延在し、ディスプレイパネル４上のITOか
らなる電極５の領域に前記開孔部７が位置し、かつ、開
孔部７の領域内にディスプレイパネル４の端面を配設せ
しめ、距離Ａを設け、開孔部内のリード群１と電極５と
が接する。リード群１と電極５間の凹凸部３の凹部と隣
接するリード群間には絶縁樹脂６が介在している。An opening 7 is provided at a predetermined position of an insulating film 2 made of polyimide, epoxy or the like, and the lead group 1 which is a wiring pattern made of a Cu foil attached to the insulating film 2 is
The opening 7 extends to the opening 7, the opening 7 is located in the area of the electrode 5 made of ITO on the display panel 4, and the end surface of the display panel 4 is arranged in the area of the opening 7. At least, the distance A is provided, and the lead group 1 and the electrode 5 in the opening are in contact with each other. Insulating resin 6 is interposed between the lead group adjacent to the concave portion of the uneven portion 3 between the lead group 1 and the electrode 5.

次に、第１図の構造を得るための方法について説明す
る。Next, a method for obtaining the structure shown in FIG. 1 will be described.

先ず、ディスプレイパネル４の電極５上もしくはリード
群１上に光硬化型の絶縁樹脂６を塗布しておき、前記電
極５とリード群１とを位置合せし、お互いに圧接した状
態で光を照射すれば、光硬化型の絶縁樹脂６は硬化する
から、硬化が終れば圧接を取去れば良い。First, a photo-curable insulating resin 6 is applied on the electrodes 5 or the lead group 1 of the display panel 4, the electrodes 5 and the lead group 1 are aligned with each other, and light is emitted while they are pressed against each other. Then, the photo-curable insulating resin 6 is cured, and thus the pressure contact may be removed when the curing is completed.

リード群１の表面に凹凸部を形成しておくと、圧接した
時にリード群１と電極５間の絶縁樹脂６は流動し、凹部
内のみに絶縁樹脂が残留し、これが硬化し、圧接状態を
保持する。凸部は電極と接し電気的な接続に寄与する事
になる。また、圧接時に流動した絶縁樹脂６は第３図に
示す様にリード群１間に存在する様にするものである。
これにより、リード群１と電極５との保持効果が増加
し、信頼性を向上させることができる。また、ディスプ
レイパネルの電極５の端部と回路基板10′のリード群１
の接する領域に絶縁樹脂６′を形成すれば、更に、接続
の保持効果は高まるものである。If an uneven portion is formed on the surface of the lead group 1, the insulating resin 6 between the lead group 1 and the electrode 5 will flow when pressure-welded, and the insulating resin will remain only in the recesses, and this will harden so that the pressure-contact state is maintained. Hold. The protrusion contacts the electrode and contributes to electrical connection. Further, the insulating resin 6 that has flowed during the pressure contact exists between the lead groups 1 as shown in FIG.
As a result, the holding effect between the lead group 1 and the electrode 5 is increased, and the reliability can be improved. In addition, the ends of the electrodes 5 of the display panel and the lead group 1 of the circuit board 10 '.
If the insulating resin 6'is formed in the area in which the contact points are formed, the effect of holding the connection is further enhanced.

絶縁樹脂6,6′は光硬化型あるいは光硬化型と熱硬化型
との併用、光硬化型と自然硬化型との併用の硬化性を用
いることができ、これにより硬化の度合を更に促進でき
るものである。The insulating resin 6,6 'can use the photo-curing type or the combination of the photo-curing type and the thermosetting type and the curability of the photo-curing type and the natural curing type, which can further accelerate the degree of curing. It is a thing.

また、絶縁性樹脂6,6′はアクリル系，エポキシ系ある
いはシリコーン系を用いることができる。The insulating resin 6, 6'can be acrylic, epoxy or silicone type.

発明の効果 可撓性回路基板の開孔部のリード群とディスプレイパ
ネルの電極とを接続するから、温度や機械的歪によって
可撓性回路基板を構成する絶縁フィルムに変形が生じて
も、接続領域には絶縁フィルムがないから、接続してい
るリード群に歪が加わらない。このため接続部の信頼性
が高くなる。EFFECTS OF THE INVENTION Since the leads of the openings of the flexible circuit board and the electrodes of the display panel are connected, even if the insulating film forming the flexible circuit board is deformed due to temperature or mechanical strain, the connection is made. Since there is no insulating film in the area, no strain is applied to the connected lead groups. Therefore, the reliability of the connecting portion is increased.

リード群とディスプレイパネルの電極とを圧接する時
に圧接領域において絶縁フィルムがないからリード群と
直線電極面に圧接できるため、正常な圧力が均一に加わ
る。仮に従来のごとく絶縁フィルムが存在すると、リー
ド群を貼りつける接着樹脂も介在するから、これらが緩
衝材として働き、所定の圧力が加わらない。When the lead group and the electrode of the display panel are pressure-contacted, since there is no insulating film in the pressure-contact region, the lead group and the linear electrode surface can be pressure-contacted, so that normal pressure is uniformly applied. If there is an insulating film as in the conventional case, since an adhesive resin for bonding the lead group is also present, these act as a cushioning material and a predetermined pressure is not applied.

接続が単に塗布した絶縁樹脂のみで行なえ、圧接して
光照射するのみで良いから、工程が著じるしく簡単であ
るばかりか、材料費も著じるしく安い。これにより実装
コストも安価になるものである。The connection can be made only with the applied insulating resin, and it is only necessary to press-contact and irradiate with light. Therefore, not only the process is remarkably simple, but also the material cost is remarkably low. This also reduces the mounting cost.

【図面の簡単な説明】 第１図，第３図は本発明の実施例の実装体の構成を示す
断面図、第２図は従来例の実装体の構造断面図である。 １……リード群、２……絶縁フィルム、４……回路基
板、５……電極、6,6′……絶縁樹脂。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 and FIG. 3 are sectional views showing the structure of a mounting body of an embodiment of the present invention, and FIG. 2 is a structural sectional view of a mounting body of a conventional example. 1 ... Lead group, 2 ... Insulating film, 4 ... Circuit board, 5 ... Electrode, 6,6 '... Insulating resin.

Claims (3)

【特許請求の範囲】[Claims] 【請求項１】開孔部を有する絶縁フイルム上に形成され
た金属リードの前記開孔部領域内に電極を有する回路基
板の端面を配設し、前記開孔部内の金属リードが絶縁樹
脂を介して回路基板の電極と電気的に接続され、前記回
路基板の電極と接する開孔部の金属リード間および前記
金属リードと接する回路基板の端部領域に絶縁樹脂が存
在することを特徴とする接続体。1. An end face of a circuit board having an electrode is arranged in the opening area of a metal lead formed on an insulating film having an opening, and the metal lead in the opening is made of an insulating resin. Insulating resin is electrically connected to the electrodes of the circuit board via the insulating resin and is present between the metal leads of the openings that are in contact with the electrodes of the circuit board and in the end region of the circuit board that is in contact with the metal leads. Connection. 【請求項２】回路基板の電極と接する金属リードの表面
に凹凸が形成された事を特徴とする特許請求の範囲第１
項記載の接続体。2. A ruggedness is formed on a surface of a metal lead which is in contact with an electrode of a circuit board.
The connection body according to the item. 【請求項３】絶縁時樹脂が、光硬化性樹脂あるいは光硬
化性と他の硬化性を併用した樹脂である事を特徴とする
特許請求の範囲第１項記載の接続体。3. The connector according to claim 1, wherein the insulating resin is a photo-curing resin or a resin in which a photo-curing property and other curability are used in combination.
JP12393186A 1986-05-29 1986-05-29 Connection Expired - Lifetime JPH0682706B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12393186A JPH0682706B2 (en) 1986-05-29 1986-05-29 Connection

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12393186A JPH0682706B2 (en) 1986-05-29 1986-05-29 Connection

Publications (2)

Publication Number Publication Date
JPS62281340A JPS62281340A (en) 1987-12-07
JPH0682706B2 true JPH0682706B2 (en) 1994-10-19

Family

ID=14872891

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12393186A Expired - Lifetime JPH0682706B2 (en) 1986-05-29 1986-05-29 Connection

Country Status (1)

Country Link
JP (1) JPH0682706B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2937705B2 (en) * 1993-08-31 1999-08-23 アルプス電気株式会社 Connection method of printed wiring board
JP3025256B1 (en) 1999-02-24 2000-03-27 松下電器産業株式会社 Mounting method of TCP film on display panel
WO2005045919A1 (en) * 2003-11-11 2005-05-19 Toray Engineering Co.,Ltd. Non-contact id card and manufacturing method thereof

Also Published As

Publication number Publication date
JPS62281340A (en) 1987-12-07

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