JP2001051618A - Display panel and liquid crystal display device and image display instrument using the display panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce irregular color in the periphery of each part of a display panel mounted with a semiconductor device. SOLUTION: An anisotropic electrically conductive adhesive 13 is stuck to surfaces of locations loaded with semiconductor devices 11 and a warpage suppressing chip 12 which is an insulator such as glass on a glass substrate 14 of a display panel 10. A Au projecting electrode 15 of each of the semiconductor devices 11 and A1 wiring electrodes 16 of the display panel 10 are aligned and connected by hot pressing with a pressing tool. The warpage suppressing chip 12 is disposed on the anisotropic electrically conductive adhesive 13 of the substrate 14 between the semiconductor devices 11 in such a way that they are arranged on a nearly straight line and the warpage suppressing chip 12 is bonded by the hot pressing with the pressing tool.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a display panel in which an anisotropic conductive adhesive and a plurality of semiconductor elements are arranged on electric wiring formed on one main surface of a glass substrate.

[0002]

2. Description of the Related Art In recent years, the mounting form of semiconductor elements of a display panel has been increasing in density, quality, and thickness.

[0003] For example, a method of mounting a liquid crystal driving LSI in a liquid crystal display device is described in Tape Automated.
From the Bonding method (hereinafter referred to as TAB method),
Flip chip method (flip chip bondi)
NG method (synonymous with NG method) (hereinafter referred to as COG method). COG
In the method, a protruding electrode (synonymous with a bump) of a semiconductor element is directly connected to an electric wiring on a glass substrate of a display panel for a liquid crystal display device.

With reference to FIG. 6, a method and a structure for mounting a semiconductor element on a display panel for a conventional liquid crystal display device in the COG system will be described. In the conventional method of mounting a semiconductor element on a display panel, first, an anisotropic conductive adhesive 7 is applied to a portion of the electrical wiring 5 formed on one main surface of the glass substrate 4 of the display panel 3 on which the semiconductor element 6 is mounted. Attach. After that, the semiconductor element 6 is aligned and arranged on the anisotropic conductive adhesive 7. Thereafter, the surface of the glass substrate 4 on which the electric wiring 5 is not formed is pressed by the pressure bonding stage 1 and the anisotropic conductive adhesive 7 is heated while the semiconductor element 6 is pressed by the pressure bonding tool 2.

[0005] As shown in FIG. 5, the conductive particles 8 in the anisotropic conductive adhesive 7 are sandwiched between the Au projection electrodes 9 of the semiconductor element 6 and the electric wiring 5 by pressurization. The electrodes 9 are electrically connected by the electric wiring 5. Further, the anisotropic conductive adhesive 7 is cured by heating, and the semiconductor element 6 is fixed by being bonded to the glass substrate 4. Thus, the semiconductor element 6 is connected to the electric wiring 5
And a display panel for a liquid crystal display device as shown in FIG. 4 is obtained. Therefore, when a semiconductor element is mounted on a substrate using an anisotropic conductive adhesive, it is essential to pressurize the semiconductor element and the substrate.

[0006]

In the above-described conventional semiconductor element mounting method, there is a problem that the glass substrate 4 and the semiconductor element 6 are warped when the semiconductor element 6 is mounted on the electric wiring 5.

FIG. 5 is a sectional view of a display panel when a semiconductor device is mounted using a conventional semiconductor device mounting apparatus.

The liquid crystal display panel 3 warps due to the warpage of the glass substrate 4, and a plurality of semiconductor elements 6 are mounted on one main surface of the glass substrate 4. Warpage occurs in a direction opposite to the surface on which the element 6 is mounted, and a wavy deformation occurs in the glass substrate 4. When the display panel 3 in which the glass substrate 4 has a wavy deformation on the mounting surface and the non-mounting surface of the semiconductor element 6 of the glass substrate 4 is used for a liquid crystal display device,
This may cause uneven color around the mounting part. As the amplitude and cycle of the wavy deformation generated on the glass substrate 4 increase, the shading of the color unevenness increases, and the range of the unevenness also increases.

In particular, in recent years, semiconductor devices have become longer due to the increase in the number of channels of the semiconductor devices. Therefore, in a conventional semiconductor device mounting apparatus and a conventional semiconductor device mounting structure, a wavy deformation of a glass substrate of a liquid crystal display panel. However, there is a problem that the amplitude and the cycle length thereof become larger.

The warpage of the glass substrate 4 and the semiconductor element 6 is caused when the semiconductor element 6 and the glass substrate 4 are pressed by the pressing stage 1 and the pressing tool 2 on the entire flat pressing surface 1a. This is considered to be due to the fact that the crimping stage 1 is slightly warped. In order to reduce the warpage, there are measures such as reinforcing the pressure bonding stage 1 more firmly, but there are limitations due to physical restrictions.

In order to solve the above-mentioned conventional problems, the present invention focuses on the structural surface of a liquid crystal display panel, and adopts a structure in which the amplitude and period of the wavy deformation generated on the glass substrate are made smaller, and the color unevenness is reduced. It is an object of the present invention to provide a display panel, a liquid crystal display device, and an image display device in which the number and the like are reduced.

[0012]

In order to achieve the above object, a display panel according to the present invention comprises a substantially rectangular glass substrate,
A plurality of substantially rectangular semiconductor elements, a warp suppressing piece of substantially the same shape as the semiconductor element and having a material equal to or more than the elastic coefficient of the glass substrate, and an anisotropic conductive adhesive for bonding the semiconductor element and the warp suppressing piece to the glass substrate The semiconductor element and the warp suppressing pieces are alternately arranged almost linearly in the long side direction on the entire side of the outer peripheral portion of the one main surface of the glass substrate, and the adjacent semiconductor elements and the warp suppressing pieces are The upper limit of the gap is one third of the long side of the semiconductor element, and the lower limit of the gap is one tenth of the long side of the semiconductor element.

Further, in the display panel of the present invention, the upper limit of the gap between the adjacent semiconductor element and the warp suppressing piece is 4 mm, and the lower limit of the gap is 2 mm.

In this manner, the semiconductor elements and the warp suppressing pieces are alternately arranged almost linearly in the long side direction on the entire outer peripheral portion of the one main surface of the glass substrate, and the adjacent semiconductor elements and the warp suppressing pieces are arranged. By limiting the gap between the pieces, the amplitude of the wavy deformation generated in the glass substrate can be made smaller and the period length thereof can be made shorter, and the color unevenness of the display panel can be further reduced.

The liquid crystal display of the present invention has the display panel of the present invention.

An image display device according to the present invention has the liquid crystal display device according to the present invention.

As described above, when the display panel of the present invention is used, color unevenness or the like can be reduced even in a liquid crystal display device or an image display device, and is particularly effective when the screen is enlarged.

[0018]

Embodiments of the present invention will be described below with reference to an example.

(Embodiment 1) An embodiment of the display panel of the present invention will be described. In this embodiment, as an example,
A case where a semiconductor element is mounted on electric wiring formed on one main surface of a glass substrate of a display panel for a liquid crystal display device will be described.

Referring to FIG. 1, a display panel 10 according to the present invention is shown.
In the semiconductor device 11, for example, a liquid crystal display driving LS
When mounting I on the display panel 10, the semiconductor element 11 and the warp suppressing piece 12 were prepared in advance. This warp suppressing piece 12
Is approximately the same size as the semiconductor element 11. The material of the warp suppressing piece 12 was glass.

When the semiconductor element 11 is mounted on the display panel 10, an anisotropic conductive adhesive 13 is previously attached to the surface of the glass substrate 14 of the display panel 10 where the semiconductor element 11 and the warp suppressing piece 12 are mounted. Au (gold) for element 11
The protruding electrodes 15 and the Al (aluminum) wiring electrodes 16 of the liquid crystal display panel 10 were aligned and connected by thermocompression bonding using a crimping tool.

As shown in FIG. 3, in the plurality of semiconductor elements 11 connected to each other, a warp suppressing piece 12 is provided between the respective semiconductor elements 11 on an anisotropic conductive adhesive 13 of a glass substrate 14. They are arranged on a substantially straight line, and each is thermocompression-bonded with a crimping tool.

As shown in FIGS. 1 and 5, the structures of the semiconductor element 11 and the display panel 10 after the completion of thermocompression bonding according to the present invention and the conventional method for mounting the semiconductor element 11 are compared.
The anisotropic conductive adhesive 13 has conductive particles 17.

As in the conventional display panel 3 shown in FIG.
If the warp suppressing pieces are not thermocompression-bonded between the respective semiconductor elements 6, the semiconductor element 6 and its mounting surface warp in the pressing direction of the crimping tool after completion of thermocompression bonding. The non-mounting surface between them warps in the opposite direction, and the amplitude of the wavy deformation of the glass substrate 4 increases.

As shown in FIG. 1, adjacent semiconductor elements 1
The upper limit value of the gap between the semiconductor element 11 and the warp suppressing piece 12
And the lower limit of the gap is set to 1/10 of the long side of the semiconductor element. By thermocompression-bonding the warp suppressing pieces 12 between the respective semiconductor elements 11 of the present invention, after completion of thermocompression bonding, the glass substrate is warped (in the direction opposite to the pressing direction of the crimping tool) on the surface on which the warp suppressing pieces are arranged. The amplitude of the 14 wavy deformation is smaller.

(Embodiment 2) A description will be given with reference to FIG. In the plurality of connected semiconductor elements 11, the warp suppressing pieces 12 are arranged substantially linearly on the anisotropic conductive adhesive 13 of the glass substrate 14 between each of the semiconductor elements 11. The material of the warp suppressing piece 12 was glass. The dimensions of the semiconductor element 11 are about 10 mm on the long side and about 2 m on the short side.
m. At this time, the lateral dimension a of the warp suppressing piece 12 is set to a ≦ (b−4) mm or less with respect to the dimension b between the adjacent semiconductor elements 11, and the adjacent semiconductor element 11 and the warp suppressing piece 12 Is 4 mm, and the lower limit of the gap is 2 mm.

The dimension between the adjacent semiconductor element 11 and the chip needs to be 2 mm or more due to mounting restrictions. In addition, in order to suppress color unevenness around the semiconductor element mounting portion of the liquid crystal display device, evaluation is performed from the viewpoint of the display quality of the liquid crystal display screen, and the adjacent semiconductor element 11 and the warp suppressing piece 1 are evaluated.
It is preferable that the dimension between them is 2 mm or less.

As described above, the warp suppressing pieces are thermocompression-bonded with a crimping tool, respectively, so that the temperature reached to the connecting portion of the adjacent semiconductor element 11 is reduced to 130 ° C. or lower, which is the Tg point of the anisotropic conductive adhesive 13. Therefore, the connection reliability can be satisfied.

The case where the display panel is used for a liquid crystal display device has been described. However, other display devices such as an EL panel have the same problem, and the use of the display panel of the present invention can solve the problem. I can. In addition, similar actions
Needless to say, an effect can be obtained.

[0030]

As described above, according to the liquid crystal display panel of the present invention, by disposing the warp suppressing pieces between each of the mounted semiconductor elements, the warpage ( Direction opposite to the pressing direction of the crimping tool)
The warp suppressing pieces can be almost suppressed, and the semiconductor elements and the warp suppressing pieces are alternately arranged almost linearly in the long side direction on the entire outer periphery of one main surface of the glass substrate, so that the adjacent semiconductor elements By limiting the gap between the glass substrate and the warp suppressing piece, the amplitude of the wavy deformation of the glass substrate can be made smaller and its period length can be made shorter, and the color unevenness of the liquid crystal display panel can be further reduced. Thus, a liquid crystal display device with less color unevenness around the semiconductor element mounting portion of the liquid crystal display panel can be obtained.

Further, a liquid crystal display device which satisfies the connection reliability of adjacent semiconductor elements when disposing the warp suppressing pieces and has less color unevenness around the semiconductor element mounting portion of the liquid crystal display panel can be obtained.

Further, when the liquid crystal panel of the present invention is used, color unevenness and the like can be reduced even in a liquid crystal display device or an image display device, and it is effective particularly when a large screen is provided, and has high industrial value.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of a display panel for a liquid crystal display device of the present invention.

FIG. 2 is a plan view showing an arrangement of insulators such as glass mounted between semiconductor elements of the present invention.

FIG. 3 is a structural sectional view of a display panel for a liquid crystal display device of the present invention.

FIG. 4 is a perspective view showing a display panel for a conventional liquid crystal display device.

FIG. 5 is a structural sectional view of a conventional display panel for a liquid crystal display device.

FIG. 6 is a perspective view showing a conventional semiconductor device mounting apparatus.

[Explanation of symbols]

 REFERENCE SIGNS LIST 10 display panel 11 semiconductor element (display driving LSI) 12 warp suppressing piece 13 anisotropic conductive adhesive 14 glass substrate 15 Au (gold) bump electrode of semiconductor element 16 Al (aluminum) wiring electrode 17 conductive particles

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2H089 HA40 JA10 QA04 QA11 QA13 TA03 2H092 GA48 GA49 GA51 GA55 GA57 GA60 HA19 HA26 MA32 MA35 MA37 NA15 NA18 NA25 NA27 NA29 PA06 5F044 KK00 KK04 KK06 LL09 5G435 AE27 BB33 EE27 BB33 GG42

Claims (4)

[Claims] A substantially rectangular glass substrate; a plurality of substantially rectangular semiconductor elements; a warp suppressing piece of substantially the same shape as the semiconductor element and equal to or more than an elastic coefficient of the glass substrate; To the semiconductor element and the anisotropic conductive adhesive for bonding the warp suppressing piece, the semiconductor element and the warp suppressing piece in the long side direction over the entire side of the outer peripheral portion of one main surface of the glass substrate The upper limit value of the gap between the adjacent semiconductor elements and the warp suppressing pieces is １ ／ of the long side of the semiconductor element, and the lower limit value of the gap is 1 of the long side of the semiconductor element
A display panel having a length of / 10. 2. The display panel according to claim 1, wherein an upper limit of a gap between the adjacent semiconductor element and the warp suppressing piece is 4 m.
m, wherein the lower limit of the gap is 2 mm. 3. A liquid crystal display device comprising the display panel according to claim 1. 4. An image display device comprising the liquid crystal display device according to claim 3.