JPH0459775B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to the manufacture of a connection structure between an electrode group having a large number of electrodes in a package such as an EL display panel or a liquid crystal display panel and a semiconductor element that drives the electrode group. It is about the method.

Conventional configurations and their problems In recent years, the number of devices that display images and characters using liquid crystal display panels and EL display panels has increased. Although these display panels have the ability to be made thinner, when displaying clear images or high-definition characters,
The number of scanning lines formed on the display panel must be increased. This is essential for liquid crystal displays and EL displays to approach the display performance of CRTs and increase added value. However, if the number of scanning lines is increased, the number of electrodes of the display panel will also increase proportionally. An increase in the number of electrodes results in an increase in the number of driving LSIs for driving the electrodes. Therefore, if we try to improve the performance of liquid crystal display panels and EL display panels, the number of connection points between the drive LSI and the electrodes of the display panel will inevitably increase, which will not only cause a decrease in reliability, but also The implementation cost increases significantly, which is a cause of hindering practical application.

A conventional configuration will be explained with reference to FIG. Semiconductor element 1
is die-bonded to a circuit board 2 made of a ceramic or resin substrate, and the electrodes of the semiconductor element 1 and the wiring patterns 3, 3' of the circuit board 2 are connected by extremely thin wires 4. Also, on the semiconductor element connected by wire 4, epoxy,
It is covered with a protective resin 5 such as silicone resin.
A plurality of semiconductor elements are mounted on the circuit board 2.

On the other hand, the display panel 10 has an electrode 12 made of a material such as iTO on a glass substrate 11, for example. The wiring pattern 3 of the circuit board 2 connected to the electrodes of the semiconductor element 1 and the electrodes of the display panel 10 are a Cu foil pattern 14 based on a polyimide film 13.
They are connected by a flexible substrate 15 having a. The connection on the circuit board side of the flexible substrate 15 is usually implemented by soldering, and the electrode 12 of the display panel on the opposite side is also made by applying a solderable material onto the iTO film and soldering it. be. Since solder does not adhere to iTO, it is necessary to form a solderable material on iTO.
Instead of the flexible substrate 15, a substrate made of carbon powder hardened with an adhesive can also be used, but this is extremely unsuitable for devices that apply high voltage and large current, such as EL displays.

The configuration shown in FIG. 1 has four connection points from the electrode of the semiconductor element 1 to the electrode of the display panel. That is, there are a total of four connection points: the electrode of the semiconductor element 1 and the wire 4, the wire 4 and the wiring pattern 3 of the circuit board 2, the wiring pattern 3 and the flexible substrate, and the flexible substrate and the electrode of the display panel.
This means that as the number of driving semiconductor elements increases, the number of connection points becomes four times the number of semiconductor elements, and these connection points significantly reduce the reliability of the connection. Furthermore, a circuit board, a flexible board, etc. are required for mounting the semiconductor element, resulting in an increase in mounting costs.

Furthermore, in the connection between the flexible substrate and the electrodes of the display panel, due to thermal expansion or mechanical distortion of the flexible substrate or the display panel, the connection becomes incomplete, resulting in a significant increase in contact resistance and a connection failure. The display quality of the display panel was impaired.

In addition, conventionally, the electrode 12 and the Cu pattern 14 are connected by solder or the like, so an electrical connector such as solder is required, and since solder cannot be used with electrode materials such as iTO, solder is applied onto the iTO as described above. It is necessary to form another material that can be attached. Furthermore, the substrate 15 and the flexible substrate are fixed by soldering, and the bonding strength is also limited.

Purpose of the Invention The present invention provides a mounting body that can easily connect and fix flexible films, leads, and electrodes of a board firmly and reliably without using solder or the like. The purpose is to provide a suitable method.

Structure of the Invention The method for manufacturing a mounting body of the present invention includes bonding one of a group of leads formed on a flexible film to an electrode of a semiconductor element via a protrusion, and cutting the film to form the extended lead. At the other end, a region in which the flexible film remains is formed at the opening without the flexible film and at the end of the lead, and the opening in the opening without the flexible film is formed. A photocurable resin is interposed between the lead group and the electrodes formed on the insulating substrate, and the leads and electrodes in the opening are brought into pressure contact with a tool, and the resin is cured by applying light irradiation. This is a method of fixing.

According to the present invention, there is provided a method that can easily realize a highly reliable and low-cost mounting body that has fewer connection points, can firmly and easily fix leads, electrodes, and flexible films. It is something.

DESCRIPTION OF EMBODIMENTS An example of a mounting body produced by the method of the present invention will be explained with reference to FIG. The substrate 19 is a flexible resin film 20 made of polyimide or glass-filled epoxy.
Sn-plated Cu foil patterns 21 and 21' are pasted on the substrate, and an opening 22 is formed in the region where the semiconductor element 1 is to be connected. The opening 22 is made of Cu
Leads 21 and 21' of the wiring pattern made of foil protrude and extend, and one end of the lead 21 is connected to an electrode of a semiconductor element 1, which will be described later, and the other end is connected continuously to an area of an electrode 12 of a display panel 10. However, the electrode 1 of the display panel 10
2, the flexible resin film 2
An opening 24 is formed in the opening 24, and only the lead 21 extends into the opening 24. At the final end of the lead 21, a part of the flexible resin film 20' is inserted into the lead 21.
This is the configuration that remained above.

For example, the electrode of the semiconductor element 1 has a height of 20 to 30μ.
A protrusion 16 made of Au of m is formed, and this protrusion is joined to leads 21 and 21' protruding into the opening 22 of the flexible resin film 20 by an alloy of Au and Sn. Further, a protective resin 23 is dripped onto the surface of the semiconductor element 1 through the opening 22, thereby further increasing the reliability of the semiconductor element. On the other hand, the connection between the electrode 12 of the display panel 10 and the extended lead 21 bonded to the semiconductor element 1 is achieved by interposing an organic adhesive material between the electrode 12 and the lead 21, and fixing the electrode 12 and the lead 21 by pressing and hardening. .
The film lead 21 and the opposing electrode 12 are connected by pressure contact, and there is no need to use solder or the like. Reference numeral 25 is a photo-cured resin used as an organic adhesive material and is installed in the opening 24 as shown in the figure, so that the lead 21 and the electrode 12 are firmly fixed.
The resin 25 protects the leads 21 in the bonding area and further increases the bonding strength.

The organic adhesive material may be applied and attached in advance to the electrode 12 side, the lead side 21 including the flexible resin film 20, or both sides, and the electrode 12 and the lead 21 may be pressed together and cured. . Curing is done by instantaneously irradiating ultraviolet rays or far ultraviolet rays through photocuring, and since there is no need to use a lot of heat, it is possible to prevent unnecessary temperature rises and improve the reliability of the package. .

According to the embodiment of the present invention, there are not only two connection points, but also one electrode of the display panel 11.
Since the flexible resin film 20 is not present on the lead 21 in contact with the lead 2, the substrate 19 and the glass plate 11 of the display panel 10 are deformed due to thermal expansion, etc.
Even if stress is applied, the bonding area with the electrode 12 of the display panel 10 is made of a flexible Cu foil material, and the leads 21 are separate and independent, so each lead 21 can absorb thermal expansion and stress. Since it absorbs, the joints will not be damaged.

The structure of another embodiment is shown in FIG. In the configuration shown in FIG. 3, a member 30 is fixed on a lead 21 that is connected to an electrode 12 of a display panel 10. After the member 30 connects the lead 21 to the electrode 12, the member 30 is bonded via the protective resin 25.
A plate made of ceramic, metal, glass, etc. is fixed onto the lead 21. With such a configuration, the lead 21 connected to the electrode 12 can be completely isolated from the outside air.

Next, a manufacturing method according to an embodiment of the present invention will be described with reference to FIG. The flexible resin film 20 of the flexible substrate 19 is made of polyimide or glass-filled epoxy, and has a length of several tens of meters and a width of 35 mm, and has sprocket holes for transporting the flexible resin film 20 at both ends of the width. In the region where the semiconductor element 1 is bonded, an opening 2 larger than at least the semiconductor element 1 is formed.
2, and leads 21, 21' made of Sn-plated Cu foil are formed in the openings.

On the other hand, as already explained in the semiconductor element 1, Au,
Protrusions 15 made of Cu, Ag, solder, etc. are formed in advance. The lead groups 21, 21' of the flexible resin film 20 and the protrusions 15 of the semiconductor element 1 are aligned and heated and pressed using the bonding tool 31 (FIG. 4a). The semiconductor element 1 is heated and pressurized with the bonding tool 31 to form a lead group 21,
21', electrical measurements are carried out in the state shown in FIG. 4a, and the flexible resin film 20 is cut into predetermined dimensions using a punching die 32 (FIG. 4b). When the punching die 32 is lowered, the flexible resin film 20 including the semiconductor element 1 is cut into the state shown in FIG. 4c.

Next, a photocurable resin material is applied or pasted between the electrode 12 of the display panel 10 and the lead group 21 of the flexible resin film 20, and is pressed into contact with the tool 33 in the opening 24, and light irradiation is applied. By curing the resin material, an embodiment as shown in FIGS. 2 and 3 can be manufactured.

That is, just by pressing the tool 33 and applying light, the lead group 21 and the electrode group 12 can be pressed and an electrical connection can be obtained, and the lead group 21, the electrode group 12, and the film can be connected in the opening 24. This makes it possible to achieve strong fixation. and,
In this case, in the present invention, there is no need for any connecting body such as solder, and since curing by light irradiation is used, unnecessary temperature rise can be prevented, and the resin can be hardened in the entire inside of the opening. It becomes possible to easily establish a reliable and strong connection and fixation.

Effects of the invention (1) Since the lead group to be connected to the electrode on the insulated substrate of the display panel etc. is directly connected through the opening where the flexible resin film is removed, the connection can be easily achieved without using solder etc. It becomes possible to do so. Further, there is no need to use solder or the like to join the electrodes and leads, and the process is simple.

(2) In addition, the reliability of the connection is extremely high because the number of connection points from the protrusion of the semiconductor element to the electrodes of the substrate can be reduced, and by reducing the number of connection points, the area (area) for connection that was previously required can be reduced. Since it is unnecessary, the mounting area becomes smaller, and the commercial value of miniaturization and thinning can be increased.

(3) Since the connection and fixation at the openings are made using photocurable resin, there is no unnecessary temperature rise, and leads, electrodes, and films can be easily fixed firmly by light irradiation, resulting in highly reliable mounting. The assembly can be manufactured easily and at low cost, and will greatly contribute to the industrial production of this type of assembly.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of the structure of a conventional mounting body, FIG. 2 is a sectional view of the structure of a mounting body according to the method of an embodiment of the present invention, and FIG. 3 is a sectional view of the structure of a mounting body of an embodiment of the present invention. , and FIGS. 4a to 4d are process cross-sectional views showing a method of manufacturing a package according to another embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Semiconductor element, 10... Display panel, 12... Display panel electrode, 15...
...Protrusion, 20...Flexible resin film, 21,2
1'... Lead group, lead, 24... Opening part, 2
5...Photocurable resin.

Claims (1)

[Claims] 1. One of the leads formed on a flexible film is joined to an electrode of a semiconductor element via a protrusion, and the film is cut so that the other end of the extended lead does not have the flexible film. A region in which the flexible film remains is formed in the opening and the final end of the lead, and light is formed between the lead in the opening without the flexible film and the electrode formed on the insulating substrate. Manufacturing a mounting body characterized by interposing a curable resin, pressing the leads and electrodes in the opening with a tool, curing the resin by irradiating light or applying heat, and fixing the leads and electrodes. Method.