JPH02237044A - Manufacture of mounting body - Google Patents

Abstract

PURPOSE:To make it possible to bond easily a group of leads to the electrodes of a semiconductor element without using a solder or the like by a method wherein the group of leads, which are bonded to electrodes on an insulating substrate, such as a display panel or the like, are directly bonded to the electrodes of the semiconductor element in an opening part, from which a flexible resin film is removed, of substrate. CONSTITUTION:In a substrate 19, Cu foil patterns 21 and 21' subjected to Sn plating treatment are adhered on a flexible resin film 20 consisting of a polyimide or the like and an opening part 22 is formed in a region, where a semiconductor element 1 is connected, of the film 20. The leads 21 and 21' of a wiring pattern consisting of a Cu foil are made to protrude in the opening part 22 and are extendedly provided, one end of the lead 21 is bonded to an electrode of the element 1 and the other end is extendedly provided continuously to the region of an electrode 12 of a display panel 10. An opening part 24 is formed in the film 20 at a region, where the lead 21 is bonded to the electrode 12, of the panel 10, the lead 21 only is extendedly provided to the part 24 and part of a flexible resin film 20' is remained on the lead 21 at the final end of the lead 21. Thereby, a group of the leads 21 can be easily connected to electrodes of the element 1 without using solder or the like.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to the manufacture of a connection structure between an electrode group having a large number of electrodes in a packaged body, such as an EL display panel or a liquid crystal display panel, and a semiconductor element that drives the electrode group. It is about the method.

2. Description of the Related Art Structures and Problems The number of devices that display images and characters using liquid crystal display panels and EL display panels has increased in recent years. Although these display panels have the feature that they can be made thinner, in order to display clear images or high-definition characters, it is necessary to increase the number of scanning lines formed on the display panel. This thing is
This is essential for liquid crystal displays and EL displays to approach the display performance of CRTs and increase added value. However, if the number of scanning lines is increased, the number of electrodes of the display panel will also increase proportionally. An increase in the number of electrodes results in an increase in the number of driving LSIs for driving the electrodes. Therefore, when trying to improve the performance of liquid crystal display panels and EL display panels, the number of connection points between the drive LSI and the electrodes of the display panel inevitably increases, which not only causes a decrease in reliability but also increases mounting costs. has increased significantly,
This is a cause that hinders practical application.

A conventional configuration will be explained with reference to FIG. The semiconductor element 1 is bonded to a circuit board 2 made of a ceramic substrate or a resin substrate, and the electrodes of the semiconductor element 1 and the circuit board 2 are bonded to each other.
It is connected to the wiring patterns 3 and 3' by an extremely thin wire 4. Further, the semiconductor elements connected by the wires 4 are covered with a protective resin 5 such as epoxy or silicone resin.

A plurality of semiconductor elements are mounted on the circuit board 2.

On the other hand, the display panel 10 includes, for example, a glass substrate 1
1, an electrode 12 is made of a material such as iTO. The wiring pattern 3 of the circuit board 2 connected to the electrode of the semiconductor element 1 and the electrode of the display panel 10 are connected by a flexible substrate 15 having a pattern 14 of Cu foil based on a polyimide film 13. Connections on the circuit board side of the flexible substrate 15 are usually mounted by soldering, and the electrodes 12 of the display panel on the opposite side are also made by coating a solderable material on the iTO film and soldering. be. Since solder does not adhere to iTO, it is necessary to form a solderable material on iTO. Instead of the flexible substrate 15, a substrate made of carbon powder hardened with an adhesive can also be used, but this is extremely unsuitable for applications where high voltage and large current are applied, such as EL displays.

The configuration shown in FIG. 1 has four connection points from the electrode of the semiconductor element 1 to the electrode of the display panel. That is, there are a total of four connection points: the electrode of the semiconductor element 1 and the wire 4, the wire 4 and the wiring pattern 3 of the circuit board 2, the wiring pattern 3 and the flexible substrate, and the flexible substrate and the electrode of the display panel. This means that as the number of driving semiconductor elements increases, the number of connection points becomes four times the number of semiconductor elements, and these connection points significantly reduce the reliability of the connection.

Furthermore, a circuit board, a flexible board, etc. are required for mounting the semiconductor element, resulting in an increase in mounting costs.

Furthermore, in the connection between the flexible substrate and the electrodes of the display panel, the connection becomes incomplete due to thermal expansion or mechanical distortion of the flexible substrate or the display panel, resulting in a significant increase in contact resistance and a connection failure. The display quality of the display panel was impaired.

In addition, conventionally, the electrode 12 and the Cu pattern 14 are connected by solder or the like, so an electrical connector such as solder is required, and since solder cannot be used with electrode materials such as iTO, as described above, It is necessary to form another material that can be soldered. Furthermore, the substrate 15 and the flexible substrate are fixed by soldering, and the fixing strength is also limited.

Purpose of the Invention The present invention makes it possible to easily obtain a connection without using solder or the like, and to obtain a mounting body in which flexible films, leads, and electrodes of a board can be easily connected and fixed with good reliability. The purpose is to provide a suitable method.

Structure of the Invention The method for manufacturing a package according to the present invention includes joining one of a group of leads formed on a flexible film to an electrode of a semiconductor element via a protrusion, and cutting the film to remove the extended lead. At the other end, an aperture without the flexible film and a region in which the flexible film remains at the extreme end of the lead are formed, and the aperture in the aperture without the flexible film is formed. interposing a photocurable resin between the lead group and the electrode formed on the insulating substrate, pressing the lead and electrode in the opening with a tool and applying light irradiation to harden the resin;
This is a method of fixing the lead and electrode.

According to the present invention, the number of connection points is small, and the leads, electrodes,
The present invention provides a method in which a flexible film can be firmly and easily fixed, and a highly reliable and low-cost mounting body can be easily realized.

DESCRIPTION OF EMBODIMENTS An example of a mounting body produced by the method of the present invention will be explained with reference to FIG. The substrate 19 has a Sn-plated Cu foil pattern 21, 21' pasted on a flexible resin film 20 such as polyimide or glass-filled epoxy, and an opening 22 is formed in the area where one semiconductor element 1 is connected. . The opening 22 is the lead 21 of the wiring pattern made of Cu foil.
．． 21' protrudes and extends, one end of the lead 21 is joined to an electrode of the semiconductor element 1, which will be described later, and the other end extends continuously to the area of the electrode 12 of the display panel 10. An opening 24 is formed in the flexible resin film 20 in the joint region with the electrode 12, and only the lead 21 extends into the opening 24, and at the final end of the lead 21, the flexible resin film 20 ′ remains partially on the lead 21.

On the electrode of the semiconductor element 1, a protrusion 16 made of Au with a height of 20 to 30 μm, for example, is formed.
．． 21' and an Au-Sn alloy. In addition, the protective resin 2 is passed through the opening 22 on the surface of the semiconductor element 1.
3 is added to further improve the reliability of the semiconductor device.

On the other hand, the connection between the electrode 12 of the display panel 10 and the extended lead 21 bonded to the semiconductor element 1 is made using the electrode 12.
An organic adhesive material is interposed between the lead 21 and the lead 21, and pressure bonding is performed.
It hardens and becomes fixed.

The film lead 2l and the opposing electrode 12 are connected by pressure contact, and there is no need to use solder or the like. 25
is a photocured resin used as an organic adhesive material, and is installed in the opening 24 as shown in the figure, and connects the lead 21 and the electrode 12.
is firmly fixed.

The resin 25- protects the leads 21 in the bonding area and further increases the bonding strength.

The organic adhesive material is applied in advance to the electrode 12 side, the lead side 21 including the flexible resin film 20, or both sides. Alternatively, the electrode 12 and the lead 21 may be pasted and then hardened by pressing the electrode 12 and the lead 21 into contact with each other. Curing is done by instantaneously irradiating ultraviolet rays or far ultraviolet rays through photocuring, and since there is no need to use a lot of heat, it is possible to prevent unnecessary temperature rises and improve the reliability of the package. .

According to the embodiment of the present invention, not only are there two connection points, but also the flexible resin film 20 is not present on the lead 21 in contact with the electrode 12 of the display panel 11. Even if the glass plate 11 is deformed due to thermal expansion or the like and stress is applied, the bonding area with the electrode 12 of the display panel 10 is made of flexible Cu.
Since it is a foil material and the leads 21 are separate and independent, each lead 21 absorbs thermal expansion and stress, so the joints are not damaged.

The structure of another embodiment is shown in FIG. In the configuration shown in FIG. 3, a member 30 is fixed on a lead 21 that is connected to an electrode 12 of a display panel 10. In the member 30, after the lead 21 is joined to the electrode 12, a plate made of ceramic, metal, glass, etc. is fixed on the lead 21 via a protective resin 25. With such a configuration, the lead 21 connected to the electrode 12 can be completely isolated from the outside air.

Next, a manufacturing method according to an embodiment of the present invention will be described with reference to FIG. The flexible resin film 20 of the flexible substrate 19 is made of polyimide or glass-covered epoxy, and has a length of several tens of meters and a width of 35 mm. In the area where the subrocket hole is formed and the semiconductor element 1 is to be bonded, an opening 22 that is at least thicker than the semiconductor element 1 is provided. 21' is formed (ψ).

On the other hand, as already explained, the semiconductor element 1 includes Au, Cu,
A protrusion 15 made of Ag, solder, etc. is formed in advance. The lead groups 21, 21' of the flexible resin film 20 and the protrusions 15 of the semiconductor element 1 are aligned and heated and pressurized with the pounding tool 31 (FIG. 4(a)). Semiconductor element 1 by heating and pressing No. 9 with bonding tool 31
is connected to the lead group 21.81', electrical measurements are made in the state shown in FIG. ))
. When the punching die 32 is lowered, the flexible resin film 20 including the semiconductor element 1 is cut into the state shown in FIG. 4 (Cl).

Next, a photocurable resin material is applied or pasted between the electrode 12 of the display panel 10 and the lead group 21 of the flexible resin film 20, and is pressed into contact with the tool 33 at the opening 24, and light irradiation is applied. By curing the resin material, an embodiment as shown in FIGS. 2 and 3 can be manufactured.

In other words, just by pressing with the tool 33 and irradiating with light,
An electrical connection can be obtained by pressing the lead group 21 and the electrode group 12 together, and it is also possible to firmly fix the lead group 21, the electrode group 12, and the film in the opening 24. In this case, the present invention does not include any
In addition to eliminating the need for connections such as solder, it uses light irradiation for curing, which prevents unnecessary temperature rises and allows the resin to harden throughout the opening, ensuring a highly reliable and strong connection. This can be done easily.

Effects of the invention (11) Since the lead group to be connected to the electrode on the insulating substrate of the display panel etc. is directly connected at the opening where the flexible resin film is removed, the connection can be easily achieved without using solder etc. Furthermore, there is no need to use solder or the like to join the electrodes and leads, and the process is simple.

(2) In addition, the reliability of the connection is extremely high because the number of connection points from the protrusion of the semiconductor element to the electrode of the substrate can be reduced, and by reducing the number of connection points, the area (area) for connection that was previously required can be reduced. Since it is unnecessary, the mounting area becomes smaller, and the commercial value of miniaturization and thinning can be increased.

(3) Since the connection and fixation at the opening are made using photocurable resin, there is no unnecessary temperature rise and it is easy to lead and fix by light irradiation.
By firmly fixing the electrodes and the film, a highly reliable package can be manufactured easily and inexpensively, which greatly contributes to the industrial production of this type of package.

[Brief explanation of drawings]

FIG. 1 is a sectional view of the structure of a conventional mounting body, FIG. 2 is a sectional view of the structure of a mounting body according to the method of an embodiment of the present invention, and FIG. 3 is a sectional view of the structure of a mounting body of an embodiment of the present invention. , Fig. 4 (al~
(dl is a process sectional view showing a method for manufacturing a packaged body according to another embodiment of the present invention. 1...Semiconductor element, 10...Display panel, 12... ...Display panel electrode, 15...Protrusion, 20...Flexible resin film, 21.21'...1...Lead group, lead, 24...・Opening part, 25...Photo-curing resin. Name of agent: Patent attorney Shigetaka Awano Haka 1 person 3rd meter

Claims (1)

[Claims] One of the leads formed on the flexible film is joined to an electrode of a semiconductor element via a protrusion, and the film is cut to form an open end without the flexible film at the other end of the extended lead. A region in which the flexible film remains is formed in the hole and the end of the lead, and photocuring is performed between the lead in the opening without the flexible film and the electrode formed on the insulating substrate. A method for producing a mounted body, the method comprising: pressing the leads and electrodes in the openings with a tool with a resin interposed therebetween, curing the resin by irradiating light or applying heat, and fixing the leads and electrodes. .