JPH0236280Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Technical Field of the Invention] This invention relates to a hybrid integrated circuit device in which a semiconductor element is flip-chip bonded to a circuit board.

[Prior art]

Flip-chip bonding of semiconductor devices is
A protruding electrode called a bump and made of a conductive metal (generally a solder material) is provided on the electrode surface of the semiconductor element, and the bump is soldered to the electrode on the circuit board with the bump side facing downward. This flip-chip bonding allows reflow soldering at the same time as other passive components and has high reliability in bonding strength, so it is used for electronic components in a wide range of fields. However, unlike discrete components with leads, the semiconductor element is bare and has the disadvantage of being vulnerable to external forces.

As the scale of hybrid integrated circuits becomes increasingly complex and systemized, there is a demand for hybrid integrated circuit devices that are as dense and highly integrated as possible, but flip-chip bonding has the disadvantages of handling as described above. Therefore, recruitment was restricted.

Hybrid integrated circuit devices are becoming more sophisticated, have larger circuit scales, and are becoming more dense and highly integrated. For this reason, circuit boards on which semiconductor elements are flip-chip bonded are often further attached to other printed circuit boards.

A conventional high-density packaging hybrid integrated circuit device of this type is shown in a schematic cross-sectional view in FIG. 1 is a hybrid integrated circuit device, which is configured as follows. 2 is a circuit board; 3 is a semiconductor element flip-chip bonded on a wiring conductor (not shown) on the circuit board 2; 4 is various passive components soldered to the wiring conductor on the circuit board 2; 5 is a clip lead drawn out from the circuit board 2.

Reference numeral 6 denotes a printed circuit board (generally referred to as a motherboard) in which a hybrid integrated circuit device 1, various discrete components 8 having leads 7, an IC 9, etc. are incorporated.

In the above-mentioned conventional device, the semiconductor element 2 on the circuit board 1 is exposed and can be cracked or chipped due to external mechanical force, resulting in defects and low reliability. To deal with this, if the entire hybrid integrated circuit device 1 is sealed with a thermosetting resin such as epoxy resin, the filling resin will enter the slight gap between the semiconductor element 3 and the circuit board 2, and due to thermosetting, Due to differences in physical properties such as expansion coefficients,
Stress is applied to the semiconductor element 3, resulting in poor adhesion at the bonding portion, which may reduce reliability.

In order to eliminate this problem, there is a device in which the hybrid integrated circuit device 1 is housed in an insulating container in advance and sealed with gel-like silicone resin, but this is cumbersome, takes up a large amount of space, and is expensive. This was hindering high-density implementation.

[Summary of the idea]

In this idea, the outer periphery of a semiconductor element flip-chip bonded on a circuit board is surrounded by caps at intervals, and these caps are made of synthetic resin and are glued onto the circuit board. The silicone resin injected into the interior through the injection hole provided covers the semiconductor element and seals it in a gel state.
A hybrid integrated circuit device that is protected from the outside, can be easily sealed, has improved bonding reliability, does not increase the external size of the circuit device, and does not hinder high-density packaging. is intended to provide.

[Example of idea]

FIG. 2 is a sectional view showing the main parts of a hybrid integrated circuit device according to an embodiment of this invention. Reference numeral 10 designates a hybrid integrated circuit device, in which a semiconductor element 3 is flip-chip bonded onto a circuit board 2 on which wiring conductors (not shown) are formed, and passive components 4 are soldered. Reference numeral 11 denotes a mortar-shaped cap made of a synthetic resin material that surrounds the semiconductor element 3 at intervals, has an injection hole 12 in its upper part, and is bonded onto the circuit board 2 with an adhesive 13. This adhesive 13 uses a silicone-based resin that hardens quickly. A silicone resin 14 is injected into the cap 11 from the injection hole 12 using a syringe or the like, covers the semiconductor element 3, and is gelled. This gel-like silicone resin 14 can be easily worked if it has thixotropic properties.

In this way, the hybrid integrated circuit device 10 in which the semiconductor element 3 is sealed with the gel-like silicone resin 14 is easy to handle.

In the above embodiment, the cap 11 is shaped like a mortar, but it can be shaped like a hemisphere or an upper plate if the cap 11 has an injection hole in the upper part and surrounds the semiconductor element 3 at a distance from the side periphery and above. It may be of various shapes, such as a circular cylindrical shape.

[Effect of idea]

As described above, according to the invention, the outer periphery of a semiconductor element flip-chip bonded on a circuit board is surrounded by a cap made of synthetic resin with an injection hole in the upper part, and this cap is used as a circuit board. It is adhered to the substrate, and silicone resin is injected into the cap through the injection hole, covering the semiconductor element and sealing it in a gel-like state, making the sealing process easy and simple, protecting the semiconductor element from the outside and preventing bonding. The reliability of the circuit has been improved, and it can be incorporated into printed circuit boards without increasing the external size of the circuit device.
High-density mounting is possible.

[Brief explanation of drawings]

FIG. 1 is a schematic cross-sectional view showing a state in which a conventional hybrid integrated circuit device is mounted, and FIG. 2 is a cross-sectional view showing essential parts of a hybrid integrated circuit device according to an embodiment of the present invention. In the figure, 2... circuit board, 3... semiconductor element, 4... passive component, 10... hybrid integrated circuit device, 11... cap, 12... injection hole, 13...
...adhesive, 14...gel silicone resin. In addition,
The same reference numerals in the figures indicate the same or corresponding parts.

Claims (1)

[Scope of utility model registration request] A semiconductor element flip-chip bonded on a circuit board, a cap made of a synthetic resin material and having an injection hole in its upper part, surrounding the semiconductor element at intervals and bonded to the circuit board, A hybrid integrated circuit device comprising a silicone resin injected into the cap through the hole to cover the semiconductor element, gelled and sealed.