KR960034343A - 이방도전성 접착제 및 그것을 이용한 도전접속구조 - Google Patents

이방도전성 접착제 및 그것을 이용한 도전접속구조 Download PDF

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KR960034343A
KR960034343A KR1019950004725A KR19950004725A KR960034343A KR 960034343 A KR960034343 A KR 960034343A KR 1019950004725 A KR1019950004725 A KR 1019950004725A KR 19950004725 A KR19950004725 A KR 19950004725A KR 960034343 A KR960034343 A KR 960034343A
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South Korea
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conductive particles
adhesive
conductive
insulating
connection terminals
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KR1019950004725A
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KR0132356B1 (ko
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미노루 사토
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가시오 가즈오
가시오 게이상기 가부시끼가이샤
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Publication of KR960034343A publication Critical patent/KR960034343A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • C—CHEMISTRY; METALLURGY
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    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
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    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
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    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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Abstract

본 발명은 면방향의 절연성을 충분히 확보하고, 또, 서로 대향하는 접속단자간의 전기저항을 낮게 할 수 있는 이방도전성접착제 및 그것을 이용한 도전접속구조를 제공하기 위한 것으로, 제1전자부품에 설치된 제1접속단자와, 제2전자부품에 설치된 제2접속단자의 사이에는 이방도전성 접착제가 개재되어 있다. 이 이방도전성 접착제는 절연성 접착제중에 제1도전성입자와 제2도전성입자를 혼입하여 형성되어 있다.
여기에서 제1도전성입자의 표면에는 절연성피막이 피복되어 있고, 또, 제2도전성입자의 표면에는 절연성피막은 피복되어 있지 않다.
제1및 제2접속단자에 의해 이방도전성 접착제를 열압착하면 제1도전성입자를 피복하는 절연성피막에 있어서, 제1및 제2의 접속단자에 면하는 부분이 파손되어 제1도전성입자에 있어서, 절연성접착제의 이파손부분에서 노출된 부분이 제1 및 제2 접속단자에 전기적으로 접속됨과 동시에 제2도전성입자가 제1 및 제2의 접속단자에 그들과 면하는 부분에서 전기적으로 접속된다.
제1도전성입자는 그 표면에 절연성피막이 피복되어 있으므로 이방도전성접착제는 면방향으로는 확실한 절연성을 가짐과 동시에 제2도전성입자는 그 표면이 절연성피막으로 피복되어 있지 않으므로 제1 및 제2의 접속단자 사이에는 양호한 전기적접속이 얻어진다.

Description

이방도전성 접착제 및 그것을 이용한 도전접속구조
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (4)

  1. 절연성접착제(16)와, 상기 절연성접착제(16) 중에 혼합되고, 표면에 절연성피막(14)이 설치된 제1도전성입자(15)와, 상기 절연성접착제(16)중에 혼합되고, 표면에 절연성피막(14)이 설치되어 있지 않은 제2도전성입자(15a)로 구성되는 것을 특징으로 하는 이방도전성 접착제.
  2. 제1항에 있어서, 상기 제1도전성입자(15)의 개수는 상기 제2도전성입자(15a)의 개수 이상인 것을 특징으로 하는 이방도전성 접착제.
  3. 제1항에 있어서, 상기 제1도전성입자(15) 및 상기 제2도전성입자(15a)중의 적어도 한쪽은 수지입자(17)의 표면을 도전성피막(18)으로 피막하여 되는 입자로 구성되는 것을 특징으로 하는 이방도전성 접착제
  4. 제1접속단자(11)와, 상기 제1접속단자(11)에 대향하여 배치된 제2접속단자(7)와, 상기 제1 및 제2접속단자(11,7) 사이에 개재되고, 표면에 절연성 피막(14)이 설치된 복수의 제1도전성입자(15)와, 상기 제1 및 제2접속단자(11,7)사이에 개재되고, 표면에 절연성 피막(14)이 설치되어 있지 않은 복수의 제2도전성입자(15a)와 상기 제1 및 제2접속단자(11,7) 사이의 공간에 충전된 절연성접착제(16)로 구성되고, 상기 제1도전성입자(15)에 설치된 상기 절연성피막(14)에 있어서, 상기 제1 및 제2접속단자(11,7)에 면하는 부분이 파손되어 상기 제1도전성입자(15)에 있어서 상기 절연성피막(14)의 이 파손부에서 노출된 부분이 상기 제1 및 제2접속단자(11,7)에 전기적으로 접속되어 있음과 동시에 상기 제2도전성입자(15a)가 상기 제1 및 제2접속단자(11,7)에 그들과 면하는 부분에 있어서, 전기적으로 접속되어 있는 것을 특징으로 하는 도전접속구조.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950004725A 1994-03-10 1995-03-08 이방도전성 접착제 및 그것을 이용한 도전접속구조 KR0132356B1 (ko)

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JP6065417A JP2737647B2 (ja) 1994-03-10 1994-03-10 異方導電性接着剤およびそれを用いた導電接続構造
JP94-65417 1994-03-10

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100643640B1 (ko) * 1997-02-27 2007-06-07 세이코 엡슨 가부시키가이샤 접속구조체,액정장치,전자기기와이방도전성접착제및그제조방법

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100290993B1 (ko) * 1995-06-13 2001-08-07 이사오 우치가사키 반도체장치,반도체탑재용배선기판및반도체장치의제조방법
JPH11168263A (ja) * 1997-09-30 1999-06-22 Canon Inc 光デバイス装置及びその製造方法
JP2000207943A (ja) * 1999-01-11 2000-07-28 Sony Corp 異方性導電膜及び異方性導電膜を用いた電気的接続装置
US6891110B1 (en) 1999-03-24 2005-05-10 Motorola, Inc. Circuit chip connector and method of connecting a circuit chip
JP2001015551A (ja) * 1999-06-29 2001-01-19 Toshiba Corp 半導体装置およびその製造方法
JP3427086B2 (ja) * 2000-02-23 2003-07-14 Ｎｅｃエレクトロニクス株式会社 Ｉｃソケット
TW531868B (en) * 2001-08-21 2003-05-11 Au Optronics Corp Soldering type anisotropic conductive film
US6777071B2 (en) * 2002-04-25 2004-08-17 Micron Technology, Inc. Electrical interconnect using locally conductive adhesive
AU2003254854A1 (en) * 2002-08-09 2004-02-25 Jsr Corporation Anisotropic conductivity connector, conductive paste composition, probe member, wafer inspecting device, and wafer inspecting method
AU2003254855A1 (en) * 2002-08-09 2004-02-25 Jsr Corporation Anisotropic conductivity connector, probe member, wafer inspecting device, and wafer inspecting method
JP2005019393A (ja) * 2003-06-05 2005-01-20 Sharp Corp 異方性導電物、表示装置、表示装置の製造方法および導電部材
KR100684221B1 (ko) * 2003-06-09 2007-02-22 제이에스알 가부시끼가이샤 이방 도전성 커넥터 및 웨이퍼 검사 장치
US7281931B2 (en) * 2003-07-28 2007-10-16 Japan Electronics Industry Ltd. Electrical connector for connecting electrical units, electrical device, and production method for producing electrical device
KR100637429B1 (ko) * 2003-10-24 2006-10-20 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
DE102004014214B3 (de) * 2004-03-23 2005-09-15 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Verbinden eines Chips und eines Substrats
KR100650284B1 (ko) * 2005-02-22 2006-11-27 제일모직주식회사 도전성능이 우수한 고분자 수지 미립자, 전도성 미립자 및이를 포함한 이방 전도성 접속재료
JP2007041389A (ja) * 2005-08-04 2007-02-15 Nec Lcd Technologies Ltd 表示装置及びその製造方法
TW200739612A (en) * 2006-02-27 2007-10-16 Hitachi Chemical Co Ltd Circuit connecting material, connection structure for circuit member using the same, and method for producing such connection structure
US7452217B2 (en) * 2006-06-22 2008-11-18 Sankyo Kasei Co., Ltd. Connecting member for surface mounting circuit
US20090278213A1 (en) 2008-05-08 2009-11-12 International Business Machines Corporation Electrode arrays and methods of fabricating the same using printing plates to arrange particles in an array
KR20130018276A (ko) 2010-03-31 2013-02-20 쓰리엠 이노베이티브 프로퍼티즈 컴파니 디스플레이용 전자 물품 및 그 제조 방법
KR101568659B1 (ko) * 2013-03-29 2015-11-12 제일모직주식회사 도전성 접착층을 포함하는 이방 도전성 필름 및 상기 필름에 의해 접속된 반도체 장치
JP6889020B2 (ja) 2016-05-02 2021-06-18 デクセリアルズ株式会社 異方性導電フィルムの製造方法、及び異方性導電フィルム
US10411218B2 (en) * 2017-10-30 2019-09-10 Wuhun China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Quasi crystalline conductive particles between a substrate and IC chip
US20190355277A1 (en) * 2018-05-18 2019-11-21 Aidmics Biotechnology (Hk) Co., Limited Hand-made circuit board
CN109679515B (zh) * 2018-12-24 2021-08-24 武汉华星光电半导体显示技术有限公司 各向异性导电胶膜及显示面板

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4113981A (en) * 1974-08-14 1978-09-12 Kabushiki Kaisha Seikosha Electrically conductive adhesive connecting arrays of conductors
JPH0291360U (ko) * 1988-12-29 1990-07-19
US5180888A (en) * 1989-08-10 1993-01-19 Casio Computer Co., Ltd. Conductive bonding agent and a conductive connecting method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100643640B1 (ko) * 1997-02-27 2007-06-07 세이코 엡슨 가부시키가이샤 접속구조체,액정장치,전자기기와이방도전성접착제및그제조방법

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CN1047474C (zh) 1999-12-15
MY112280A (en) 2001-05-31
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US5586892A (en) 1996-12-24
KR0132356B1 (ko) 1998-04-14
JPH07247467A (ja) 1995-09-26

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