KR920000126A - 마이크로파 반도체 부품용 칩 캐리어 - Google Patents

마이크로파 반도체 부품용 칩 캐리어 Download PDF

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KR920000126A
KR920000126A KR1019910001601A KR910001601A KR920000126A KR 920000126 A KR920000126 A KR 920000126A KR 1019910001601 A KR1019910001601 A KR 1019910001601A KR 910001601 A KR910001601 A KR 910001601A KR 920000126 A KR920000126 A KR 920000126A
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terminal
power supply
chip carrier
contact
drain
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KR1019910001601A
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발터 찜머만
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발도르프, 피켄셔
지멘스 악티엔게젤샤프트
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Publication of KR920000126A publication Critical patent/KR920000126A/ko

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Abstract

내용 없음

Description

마이크로파 반도체 부품용 칩 캐리어
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도 내지 제3도는 본 발명에 따른 칩 캐리어, 또는 본 발명에 따른 칩 캐리어를 갖는 마이크로파 부품의 여러실시예들을 나타낸 도면.

Claims (21)

  1. 적어도 제1 및 제2전원접점들과, 게이트접점과, 드레인접점과를 갖는 반도체 칩: 접촉영역에 위치된 반도체 칩과, 제1외부 전원단자와, 제2외부 전원단자와, 외부 게이트단자와, 그리고 상기 제1 및 제2전원단자, 상기 게이트단자, 상기 접촉영역에 있는 상기 드레인단자의 부분들, 및 상기 접촉영역을 둘러싸는 보호 피복재와로 구성되어 있는 칩 캐리어 조립체 : 제1전원접점, 제2전원접점, 게이트접점, 및 드레인접점을 제1외부 전원단자, 제2외부 전원단자, 외부 게이트단자 및 외부 드레인단자에 연결시키는 각각의 접촉수단 ; 으로 구성된 반도체 부품조립체로서 : 상기 제1전원단자는 제2면에 있는 접촉영역으로부터 밖으로 뻗어 있으며, 상기 제1전원단자 및 드레인단자및 제2전원단자는 제2면에 있는 접촉영역으로부터 밖으로 뻗어있으며; 상기 제1전원단자 및 드레인단자는 기하학적 직선의 제1면에 놓여 있고, 게이트단자 및 제2전원단자는 상기 기하학적 직선의 제2면에 놓여 있으며, 상기 제1외부 전원단자 및 제2외부 전원단자는 접촉영역을 통과하는 웨브형 황단부재를 통해 연결되어 있으며, 상기 반도체칩이 상기 횡단부재상에 고정되어 있으며, 상기 횡단부재상에 고정되어 있으며; 상기 횡단부재는 상기 기하학적 직선에 대해서 경사지게 뻗어있는 반도체 부품 조립체.
  2. 제1항에 있어서, 상기 보호 피복재가 직사각형이며, 상기 기하학적 직선이 상기 보호 피복재의 제1 및 제2면을 가로지르는 반도체 부품 조립체.
  3. 제1항에 있어서, 상기 보호 피복재가 플라스틱으로 제조되며, 상기 반도체 칩이 마이크로파 부품인 반도체 부품 조립체.
  4. 제1항에 있어서, 상기 보호 피복재가 제1 및 제2면을 갖는 직사각형 하우징으로 구성되며, 상기 제1전원단자 및 상기 제1게이트단자가 상기 제1면으로부터 바깥쪽으로 뻗어있고, 상기 드레인단자 및 상기 제2전원단자가 상기 제2면으로부터 바깥쪽으로 뻗어 있으며, 상기 기하학적 직선이 상기 보호 피복재의 상기 제1 및 제2면을 가로지르는 반도체 부품 조립체.
  5. 제1외부 전원단자, 제2외부 전원단자, 외부 게이트단자, 및 외부 드레인단자로 구성된, 적어도 4개의 외부전기접점을 포함하는 마이크로파 반도체 부품용 칩 캐리어 조립체로서 : 상기 제1전원단자 및 게이트단자가 상기 칩 캐리어의 제1면에 배열되어 있고, 제2전원단자 및 드레인단자는 칩 캐리어의 제2면에 배열되어 있으며 : 칩 캐리어의 평면도에서, 기하학적 직선이 칩 캐리어의 제1면에서 제1전원단자와 게이트단자 사이에 배열되도록, 그리고 칩 캐리어의 제2면에는 제2전원단자에 드레인단자 사이에 배열되도록 단자들이 배열되어 있고, 제1전원단자와 제2전원단자는 상기 기하학적 직선에 대해 서로 다른 면에 위치되어 있으며 : 제1전원단자는 횡단부재를 통해서 제2전원단자와 연결되어 일체로 되어 있고, 상기 횡단부재상에 반도체 칩을 고정시키기 위한 공간이 제공되어 있으며 : 상기 횡단부재가 상기 기하학적 직선에 경사져 있는 반도체 부품 조립체.
  6. 제5항에 있어서, 2개의 외부접점이 칩 캐리어의 종방향 제1면과 제2면에 배열되어 있으며, 상기 기하학적 직선이 상기 제1면과 제2면 사이에서 칩 캐리어의 축에 대해 횡단하는 칩 캐리어 조립체.
  7. 제5항에 있어서, 상기 횡단부재를 따라 종방향으로 뻗어 있는 중심선이 기하학적 직선과 경사지게 교차하는 칩 캐리어 조립체.
  8. 제5항에 있어서, 상기 횡단부재가 상기 기하학적 직선에 대해 45°각도를 이루며 종방향으로 뻗어 있는 칩 캐리어 조립체.
  9. 제5항에 있어서, 반도체 칩을 고정시키기 위한 상기 공간이 직사각형의 공간을 형성하며, 직사각형의 측면이 상기 기하학적 직선에 대해 경사져 있는 칩 캐리어 조립체.
  10. 제5항에 있어서, 드레인단자 및 게이트단자가 횡단부재의 측부에 바로 근접한 전극부분을 갖고 있는 칩캐리어 조립체.
  11. 제10항에 있어서, 횡단부재에 가장 가까이 근접해 있는 드레인 전극부분의 경계선이 상기 기하학적 직선에 애해서 경사져 있는 칩 캐리어 조립체.
  12. 제10항에 있어서, 횡단부재에 가장 가까이 근접해 잇는 게이트 전극부분의 경계선이 상기 기하학적 직선에 대해서 경사져 있는 칩 캐리어 조립체.
  13. 제10항에 있어서, 상기 칩 캐리어 조립체에 피복재가 있으며, 상기 게이트 전극부분과 드레인부분중 적어도 하나가 상기 피복재에 안정하게 고정시키기 위한 수단을 갖고 있는 칩 캐리어 조립체.
  14. 제10항에 있어서, 반도체 칩이 2개의 연결배선을 통해서 게이트 전극부분과 연결되어 있는 칩 캐리어 조립체.
  15. 제10항에 있어서, 반도체 칩이 2개의 연결배선을 통해서 드레인 전극부분과 연결되어 있는 칩 캐리어 조립체.
  16. 제10항에 있어서, 게이트 전극부분이 2가닥으로 접촉되어 있는 칩 캐리어 조립체.
  17. 제10항에 있어서, 전원 전극부분이 4가닥으로 접촉되어 있는 칩 캐리어 조립체.
  18. 제10항에 있어서, 드레인 전극부분이 2가닥으로 접촉되어 있는 칩 캐리어 조립체.
  19. 제5항에 있어서, 반도체 칩이 4개의 연결배선을 통해서 횡단부재에 연결되어 있는 칩 캐리어 조립체.
  20. 제5항에 있어서, 반도체 칩이 직사각형으로 되어 있고, 직사각형의 측면들이 기하학적 직선에 경사지게 배열되어 있는 칩 캐리어 조립체.
  21. 적어도 제1전원접점과 제2전원접점, 게이트접점, 및 드레인접점을 갖는 반도체 칩; 접촉영역에 위치된 반도체 칩과, 제1외부 전원단자와, 제2외부전원단자와, 외부 게이트단자와, 그리고 상기 제1 및 제2전원단자, 상기 게이트 단자, 상기 접촉영역에 있는 상기 드레인단자의 부분들, 및 상기 접촉영역을 둘러싸는 보호 피복재화로 구성되어 있는 칩 캐리어 조립체 ; 제1전원접점, 제2전원접점, 게이트접점, 및 드레인접점을 제1외부 전원단자, 제2외부 전원단자, 외부 게이트 단자, 및 외부 드레인단자에 연결시키는 각각의 접촉수단 : 으로 구성된 반도체 부품조립체로서 ; 상기 제1전원단자 및 게이트단자는 그 제1면에 있는 접촉영역으로부터 밖으로 뻗어 있으며, 드레인단자 및 제2전원단자는 제2면에 있는 접촉영역으로부터 밖으로 뻗어 있으며; 상기 제1전원단자 및 드레인단자는 기하학적 직선의 제1면에 놓여 있고, 게이트단자 및 제2전원단자는 상기 기하학적 직선의 제2면에 놓여 있으며, 상기 제1외부 전원단자 및 제2외부 전원단자는 접촉영역을 통과하는 웨브형 횡단부재를 통해 연결되어 있으며; 상기 반도체 칩이 상기 횡단부재상에 고정되어 있으며, 상기 횡단부재는 상기 기하학적 직선에 대해서 경사지게 뻗어 있으며 ; 반도체 칩에 연관된 제1전원단자 및 제2전원단자, 드레인단자, 및 게이트단자의 배치 및 배열이 12GHz 이상에서 조립체의 동작을 허용케하는 마이크로파 반도체 부품 조립체.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910001601A 1990-01-31 1991-01-31 마이크로파 반도체 부품용 칩 캐리어 KR920000126A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP90101925.7 1990-01-31
EP90101925A EP0439656B1 (de) 1990-01-31 1990-01-31 Chipträger für ein Mikrowellen-Halbleiterbauelement

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KR920000126A true KR920000126A (ko) 1992-01-10

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EP0668615A1 (de) * 1994-02-18 1995-08-23 Siemens Aktiengesellschaft Kunststoff-SMD-Gehäuse für einen Halbleiterchip
US8410601B2 (en) * 2009-11-15 2013-04-02 Microsemi Corporation RF package
US8034666B2 (en) * 2009-11-15 2011-10-11 Microsemi Corporation Multi-layer thick-film RF package

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JPS55120152A (en) * 1979-03-09 1980-09-16 Fujitsu Ltd Semiconductor device
JPS5793571A (en) * 1980-12-02 1982-06-10 Nec Corp Semiconductor device
US4446375A (en) * 1981-10-14 1984-05-01 General Electric Company Optocoupler having folded lead frame construction
JPS58142576A (ja) * 1982-02-19 1983-08-24 Hitachi Ltd デユアルゲ−トｍｏｓ−ｆｅｔ
JPS59172262A (ja) * 1983-03-18 1984-09-28 Mitsubishi Electric Corp 半導体モジユ−ルの製造方法
US4794431A (en) * 1986-04-21 1988-12-27 International Rectifier Corporation Package for photoactivated semiconductor device
JPS62274645A (ja) * 1986-05-23 1987-11-28 Hitachi Ltd リ−ドフレ−ム及びそれを用いた電子装置
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US5155575A (en) 1992-10-13

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