KR920007134A - 유전 패키지 본체에 전기도선이 있는 ic패키지 - Google Patents

유전 패키지 본체에 전기도선이 있는 ic패키지 Download PDF

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KR920007134A
KR920007134A KR1019910016891A KR910016891A KR920007134A KR 920007134 A KR920007134 A KR 920007134A KR 1019910016891 A KR1019910016891 A KR 1019910016891A KR 910016891 A KR910016891 A KR 910016891A KR 920007134 A KR920007134 A KR 920007134A
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South Korea
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annular portion
conductor film
dielectric
dielectric annular
package
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KR1019910016891A
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KR950010107B1 (ko
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마사야 다마무라
요시로 모니노
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세끼사와 요시
후지쓰 가부시끼가이샤
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Publication of KR950010107B1 publication Critical patent/KR950010107B1/ko

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Abstract

내용 없음

Description

유전 패키지 본체에 전기도선이 있는 IC패키지
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 캡부분이 제거된 본 발명의 제1실시예에 따른 IC패키지의 투시도.
제2도는 제4도에서 선 II-II를 따라 취한 제1도의 IC패키지의 단면도.
제3도는 제4도에서 선 III-III를 따라 취한 제1도의 IC패키지의 단면도.

Claims (8)

  1. 반도체 칩 ; 반도체 칩을 싸기 위하여, 바닥부분, 바닥부분위에 배열되고 반도체 칩을 둘러싸는 제1유전 환상부분, 제1유전 환상부분위에 배열되는 제2유전 환성부분 및 제2유전 환상부분에 부착되는 캡부분으로 이루어지며, 상기 제1및 제2유전 환상부분은 상기 및 하부 표면, 내부 및 외부 가장자리와 내부 및 외부 가장자리 사이의 폭을 가지는 패키지 본체 ; 제2유전 환상부분의 폭보다 커서 제1유전 환상부분의 상부 표면의 제1부분이 제2유전 환상부분에 의해 덮혀지고 제1유전 환상부분의 상부 표면의 제2부분이 노출되도록 하는 제1유전 환상부분의 폭 ; 제1유전 환상부분의 내부 및 외부 가장자리 사이를 실제로 연장시키기 위해 제1유전 환상부분의 상부 표면상에 형성되는 전기도선 ; 제1유전 환상부분의 제1덮혀진 부분에 대응하여 제2도체막, 전기도선의 제1부분 및 제1도체막에 의해 스트립선을 형성하고, 제1유전 환상부분의 제2노출된 부분에 대응하여 전기도선의 제2부분 및 제1도체막에 의해 마이크로 스트립선을 형성하도록, 제1유전 환상부분의 하부 표면상에 접지 및 형성되어지는 제1도체막과, 제2유전 환상부분의 상기 표면상에 접지 및 형성되어지는 제2도체막 ; 및 최소한 제1유전 환상부분의 제2노출된 부분의 일부에 대응하여 제1유전 환상부분에 제공되고, 제1도체막보다 도선에 인접하고, 제1유전 혼상부분의 제2노광된 부분에 대응하여 전기도선의 제2부분으로 구성되는 접지되어지는 제3도체막으로 이루어진 IC패키지.
  2. 제1항에 있어서, 제1유전 환상부분이 서로 겹쳐지는 표면을 갖는 세분된 부분들로 이루어지고, 제3도체막이 겹쳐진 표면중의 하나에 형성되는 IC패키지.
  3. 제1항에 있어서, 제1유전 환상부분의 제1덮혀진 부분의 그의 내부와 외부 가장자리 사이에 위치하며, 제2노출된 부분은 제1덮혀진 부분의 안쪽위에 안부분과 제1덮혀진 부분의 바깥쪽에 위에 바깥부분으로 이루어지는 IC패키지.
  4. 제3항에 있어서, 제3도체막이 제1유전 환상부분의 제2노광된 부분의 안부분과 바깥부분에 대응하여 제공되는 IC패키지.
  5. 제3항에 있어서, 제3도체막이 제1유전 환상부분의 제2노광된 부분의 안부분과 바깥부분중의 하나에 대응하여 제공되는 IC패키지.
  6. 제1항에 있어서, 전기도선의 신호전송선과 최소한 하나의 전원선을 포함하고, 접지되어지는 제4좁은 도체막이 최소한 한 전원선에 대응하여 제1유전 환상부분에 제공되고 제3도체막에 연결되는 IC패키지.
  7. 제6항에 있어서, 접지되어지는 제5좁은 도체막이 최소한 한 전원선에다가 제4좁은 도체막에 대응하여 제2유전 환상부분에 제공되는 IC패키지.
  8. 제1항에 있어서, 제1유전 환상부분이 제2유전 환상부분의 두께와 같은 두께를 갖으므로 제1도체막 및 제2도체막이 전기도선으로 부터 같은 거리에 있게 되는 IC패키지.
    ※ 참고사항 : 최초출원 내용에 의하여 공개되는 것임.
KR1019910016891A 1990-09-28 1991-09-27 유전 패키지 본체에 전기도선이 있는 ic 패키지 KR950010107B1 (ko)

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US5218230A (en) 1993-06-08
DE69123323T2 (de) 1997-04-03
JPH04137655A (ja) 1992-05-12
EP0478160A3 (en) 1993-03-31
EP0478160A2 (en) 1992-04-01
DE69123323D1 (de) 1997-01-09
KR950010107B1 (ko) 1995-09-07
EP0478160B1 (en) 1996-11-27

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