KR850006299A - 배선기판 - Google Patents

배선기판

Info

Publication number
KR850006299A
KR850006299A KR1019850000149A KR850000149A KR850006299A KR 850006299 A KR850006299 A KR 850006299A KR 1019850000149 A KR1019850000149 A KR 1019850000149A KR 850000149 A KR850000149 A KR 850000149A KR 850006299 A KR850006299 A KR 850006299A
Authority
KR
South Korea
Prior art keywords
wiring board
heating
note
insulating film
metal particles
Prior art date
Application number
KR1019850000149A
Other languages
English (en)
Other versions
KR920005071B1 (ko
Inventor
요시오(외 5) 후지와라
Original Assignee
오오가노리오
소니 가부시끼 가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 오오가노리오, 소니 가부시끼 가이샤 filed Critical 오오가노리오
Publication of KR850006299A publication Critical patent/KR850006299A/ko
Application granted granted Critical
Publication of KR920005071B1 publication Critical patent/KR920005071B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof

Abstract

내용 없음

Description

배선기판
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명 배선기판의 일실시예를 도시하는 확대 단면도.
* 도면의 주요부분에 대한 부호의 설명
1 : 절연기판 2 : 도전패턴
3 : 절연성 접착제 4 : 표면이 절연성 산화피막을 가지는 금속입자
5 : 접착제층 6 : 박리지

Claims (1)

  1. 배선기판상의 전면 또는 소정부분 표면에 절연막이 형성된 가압가열에 의하여 용융하는 금속으로 이루어지는 금속입자가 분산된 가열에 의하여 용융 유동하는 절연성 접착제를 피착한 것을 특징으로 하는 배선기판.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019850000149A 1984-02-24 1985-01-11 배선기판 KR920005071B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP59033793A JPS60178690A (ja) 1984-02-24 1984-02-24 配線基板
JP33793 1984-02-24
JP84-33793 1984-02-24

Publications (2)

Publication Number Publication Date
KR850006299A true KR850006299A (ko) 1985-01-11
KR920005071B1 KR920005071B1 (ko) 1992-06-26

Family

ID=12396345

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019850000149A KR920005071B1 (ko) 1984-02-24 1985-01-11 배선기판

Country Status (2)

Country Link
JP (1) JPS60178690A (ko)
KR (1) KR920005071B1 (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6261397A (ja) * 1985-09-11 1987-03-18 ソニ−ケミカル株式会社 配線基板の接続方法
JPH0519665Y2 (ko) * 1987-09-03 1993-05-24
US4998692A (en) * 1988-02-10 1991-03-12 Toyoda Gosei Co., Ltd. Hose fitting fixing construction
US5136365A (en) * 1990-09-27 1992-08-04 Motorola, Inc. Anisotropic conductive adhesive and encapsulant material
JP4772212B2 (ja) 2001-05-31 2011-09-14 浜松ホトニクス株式会社 Ｘ線発生装置
JP2014065766A (ja) 2012-09-24 2014-04-17 Dexerials Corp 異方性導電接着剤

Also Published As

Publication number Publication date
JPS60178690A (ja) 1985-09-12
KR920005071B1 (ko) 1992-06-26

Similar Documents

Publication Publication Date Title
KR880004724A (ko) 금속 기판 및 그 제조 방법
KR880008730A (ko) 플렉시블 인쇄회로 기판용 단자구조물
KR900017449A (ko) 전자 어셈블리 및 전자 어셈블리를 형성하는 공정
KR850001658A (ko) 인쇄 배선판
DE59800648D1 (de) Widerstands-Heizvorrichtung für flächige Objekte, insbesondere für Spiegel
KR840000080A (ko) 혼성집적회로부품 및 그 부착방법
KR840005921A (ko) 전자 장치
KR970061017A (ko) 도체층부착이방성도전시트 및 이를 사용한 배선기판
KR910008821A (ko) 반도체장치의 제조방법
KR970003772A (ko) 필름 캐리어, 필름 캐리어를 사용한 반도체 장치 및 반도체 소자를 장착하는 방법
KR890007056A (ko) 가스센서 및 그 제조방법
KR920007134A (ko) 유전 패키지 본체에 전기도선이 있는 ic패키지
KR850006299A (ko) 배선기판
KR890004431A (ko) 반도체 장치
KR940012590A (ko) 메탈코어타입 다층리드프레임
KR960039289A (ko) 절연페이스트 및 이를 이용한 후막 인쇄 다층 회로
KR960028723A (ko) 프린트 회로기판
KR850004371A (ko) 연결 시트
KR890702417A (ko) 알루미늄 질화물 세라믹을 분리시키는 방법에 의한 유도 금속화 방법
KR900019179A (ko) 후막회로의 성형에 사용되는 기판
KR830004645A (ko) 전기전도성 적층판(積層板)
BR9906465A (pt) Substrato para circuito eletrônico compreendendo meios anti-remoção
JPS6484690A (en) Printed wiring board and the production thereof
KR880700616A (ko) 다층 프린트 기판
KR900010819A (ko) 플랫 코일의 실장 방법

Legal Events

Date Code Title Description
A201 Request for examination
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20040521

Year of fee payment: 13

EXPY Expiration of term