KR960028723A - 프린트 회로기판 - Google Patents

프린트 회로기판 Download PDF

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Publication number
KR960028723A
KR960028723A KR1019950042447A KR19950042447A KR960028723A KR 960028723 A KR960028723 A KR 960028723A KR 1019950042447 A KR1019950042447 A KR 1019950042447A KR 19950042447 A KR19950042447 A KR 19950042447A KR 960028723 A KR960028723 A KR 960028723A
Authority
KR
South Korea
Prior art keywords
printed circuit
circuit board
resistor
conductor layer
board according
Prior art date
Application number
KR1019950042447A
Other languages
English (en)
Inventor
아키히토 쓰찌다
요시토 세끼노
Original Assignee
사카모토 지아키
간토 가세이 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 사카모토 지아키, 간토 가세이 고교 가부시키가이샤 filed Critical 사카모토 지아키
Publication of KR960028723A publication Critical patent/KR960028723A/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09763—Printed component having superposed conductors, but integrated in one circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

프린트회로용 기재(2)에 도전체층(4)을 설치한 프린트기판(2)의 두께방향으로 도전체층(4)의 표면과 동일면이 되도록 도전체층(4)에 저항체(5)를 도통시켜 설치했다.

Description

프린트 회로기판
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 제1실시예의 프린트 회로기판의 요부종단면도, 제2도는 상기의 저항체가 매입된 상태를 나타내는 종단면도, 제3도는 본 발명의 제3실시예의 프린트 회로기판의 요부종단면도.

Claims (6)

  1. 프린트회로용 기제에 도전체층을 설치한 프린트기판의 두께방향으로 도전체층의 표면과, 동일면이 되도록 도전체층에 저항체를 도통시켜서 설치한 것을 특징으로 하는 프린트 회로기판.
  2. 제1항의 발명에 있어서, 저항체를 만드는 구멍의 직경 또는 구멍의 형상을 적외선택하여 저항체를 소정의 저항치로 하는 것을 특징으로 하는 프린트 회로기판.
  3. 제1항의 발명에 있어서, 저항체의 재질을 적외선택하여 소정의 저항치로 하는 것을 특징으로 하는 프린트 회로기판.
  4. 제1항의 발명에 있어서, 프린트기판이 내층에 전기배선을 가지고 다층프린트기판임을 특징으로 하는 프린트 회로기판.
  5. 제1항의 발명에 있어서, 프린트 회로기판을 절연층을 개재하여 복수적층한 것을 특징으로 하는 프린트 회로기판.
  6. 제1항 및 제5항 기재의 발명에 있어서, 프린트 회로기판이 감산법 또는 가산법에 의하여 형성된것을 특징으로 하는 프린트 회로기판.
KR1019950042447A 1994-12-22 1995-11-21 프린트 회로기판 KR960028723A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP94-319628 1994-12-22
JP31962894 1994-12-22
JP95-139003 1995-06-06
JP7139003A JPH08228064A (ja) 1994-12-22 1995-06-06 プリント回路基板

Publications (1)

Publication Number Publication Date
KR960028723A true KR960028723A (ko) 1996-07-22

Family

ID=26471912

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950042447A KR960028723A (ko) 1994-12-22 1995-11-21 프린트 회로기판

Country Status (4)

Country Link
EP (1) EP0719079A1 (ko)
JP (1) JPH08228064A (ko)
KR (1) KR960028723A (ko)
SG (1) SG79881A1 (ko)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE511682C2 (sv) * 1998-03-05 1999-11-08 Etchtech Sweden Ab Motstånd i elektriska ledare på eller i mönsterkort, substrat och halvledarbrickor
JP3206561B2 (ja) * 1998-10-01 2001-09-10 日本電気株式会社 多層配線基板
DE10015270A1 (de) * 2000-03-28 2001-10-11 Siemens Ag Vertikale Realisierung von Dickschichtwiderständen in Multilayersubstraten
DE10015269A1 (de) * 2000-03-28 2001-06-28 Siemens Ag Innenliegende Widerstände in Bohrungen von Leiterplatten
IL141118A0 (en) 2001-01-25 2002-02-10 Cerel Ceramics Technologies Lt A method for the implementation of electronic components in via-holes of a multi-layer multi-chip module
DE10130927A1 (de) * 2001-06-27 2003-01-23 Siemens Ag Verfahren zum Integrieren eines elektronischen Bauteils in einem keramischen Körper und derartiger keramischer Körper
KR20040015941A (ko) * 2002-08-14 2004-02-21 조석현 저항물질 충진 방식의 저항 내장형 인쇄회로기판의 제조방법
DE10302104A1 (de) * 2003-01-21 2004-08-05 Friwo Gerätebau Gmbh Verfahren zum Herstellen von Schaltungsträgern mit intergrierten passiven Bauelementen
US7612976B2 (en) * 2005-07-21 2009-11-03 Cooper Technologies Company Transient voltage protection circuit boards and manufacturing methods
KR100832649B1 (ko) * 2006-06-27 2008-05-27 삼성전기주식회사 저항 내장형 인쇄회로기판 및 그 제조방법
DE102007051316B4 (de) * 2007-10-26 2010-12-02 Continental Automotive Gmbh Schaltungsträger mit hoher Bauteildichte
CN108684155B (zh) * 2015-04-27 2020-12-15 博敏电子股份有限公司 印制电路板中埋入电阻的方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02260593A (ja) * 1989-03-31 1990-10-23 Mitsumi Electric Co Ltd 回路基板の製造法
JPH04192491A (ja) * 1990-11-27 1992-07-10 Fujitsu Ltd ブロック状アクティブ回路部品
US5164699A (en) * 1990-12-17 1992-11-17 Hughes Aircraft Company Via resistors within-multi-layer, 3 dimensional structures substrates
US5055966A (en) * 1990-12-17 1991-10-08 Hughes Aircraft Company Via capacitors within multi-layer, 3 dimensional structures/substrates
JPH05347465A (ja) * 1991-09-10 1993-12-27 Sharp Corp プリント基板
JPH05218618A (ja) * 1992-01-30 1993-08-27 Cmk Corp プリント配線板の製造方法
JPH05343855A (ja) * 1992-06-08 1993-12-24 Cmk Corp 多層プリント配線板およびその製造方法
US5766670A (en) * 1993-11-17 1998-06-16 Ibm Via fill compositions for direct attach of devices and methods for applying same

Also Published As

Publication number Publication date
SG79881A1 (en) 2001-04-17
JPH08228064A (ja) 1996-09-03
EP0719079A1 (en) 1996-06-26

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