KR870003563A - 반도체장치 - Google Patents

반도체장치 Download PDF

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Publication number
KR870003563A
KR870003563A KR1019860000613A KR860000613A KR870003563A KR 870003563 A KR870003563 A KR 870003563A KR 1019860000613 A KR1019860000613 A KR 1019860000613A KR 860000613 A KR860000613 A KR 860000613A KR 870003563 A KR870003563 A KR 870003563A
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KR
South Korea
Prior art keywords
semiconductor device
side walls
side wall
semiconductor chip
input
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Application number
KR1019860000613A
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English (en)
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KR900001246B1 (ko
Inventor
준 후가야
Original Assignee
후지쓰가부시끼가이샤
야마모도 다꾸마
후지쓰 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority claimed from JP60015904A external-priority patent/JP2509904B2/ja
Priority claimed from JP14299485U external-priority patent/JPH083011Y2/ja
Priority claimed from JP60207503A external-priority patent/JPH0812888B2/ja
Application filed by 후지쓰가부시끼가이샤, 야마모도 다꾸마, 후지쓰 가부시끼가이샤 filed Critical 후지쓰가부시끼가이샤
Publication of KR870003563A publication Critical patent/KR870003563A/ko
Application granted granted Critical
Publication of KR900001246B1 publication Critical patent/KR900001246B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance

Abstract

내용 없음

Description

반도체장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 의한 반도체장치를 나타내는 것으로 a도는 평면도, b도와 c도는 그의 부분단면도.
제2도는 제1도의 반도체장치의 사시도.
제3도는 제1도의 반도체장치의 등가회로도.

Claims (6)

  1. 반도체 칩을 장치하기 위한 기부판과, 상기 반도체 칩을 둘러싸도록 상기 기부판상에 배치되는 측면 벽들과, 상기 반도체 칩에 연결되어 상기 측면벽들로부터 외측으로 연장되는 입력리이드편 및 출력이리드편과, 그리고 상기 입력 및 출력리이드편들이 차지한 위치들간의 상기 측면벽으로부터 외측으로 연장되는 적어도 하나의 접지리이드편을 포함하되, 상기 입력 및 출력리이드편들이 차지하는 상기 위치들에 있는 상기 측면벽들은 전기 절연재로 제조되며, 상기 접지리이드편이 차지하는 위치에 있는 상기 측면벽은 상기 측면벽의 내측으로 연장되는 접속단자와 상기 측면벽의 외측으로 연장되는 상기 접지리이드편과 일체로 된 하나의 몸체로서 금속재료 제조되는 것이 특징인 반도체장치.
  2. 제1항에서, 상기 측면벽들은 장방형 상자의 4측면들로 구성되며, 상기 입력 및 출력리이드편들은 상기 상자의 한쌍의 두 대향 측면들로부터 연장되며 또한 상기 접지리이드편들은 상기 상자의 다른 쌍의 두 대향 측면들로부터 연장되는 것이 특징인 반도체장치.
  3. 제2항에서, 상기 접지리이드편들이 연장되는 두대향 측면벽들은 내부접속단자 및 외부접지편과 각각 일체로 되는 두 측면벽들을 포함하는 하나의 몸체로서 금속접지단자 블록을 형성하도록 연결 브리지들을 통하여 다른 두 대향하는 측면벽들 위에서 함께 상호연결되는 것이 특징인 반도체장치.
  4. 제1,2 또는 3항에서, 상기 기부판의 적어도 일부가 열방출을 위한 금속으로 제조되고, 상기 반도체 칩은 상기 금속부분상에 장치되는 것이 특징인 반도체장치.
  5. 제1항에서, 밀봉금속층은 상기 측면벽들의 전체 상연부표면을 따라 배치되며 또한 캡은 상기 밀봉금속층을 통하여 상기 측벽들상에 고정되는 것이 특징인 반도체장치.
  6. 제1항에서, 상기 반도체 칩은 초고주파수 갈리움 아세닉 전계효과 트랜지스터인 것이 특징인 반도체장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019860000613A 1985-01-30 1986-01-30 반도체장치 KR900001246B1 (ko)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP60015904A JP2509904B2 (ja) 1985-01-30 1985-01-30 半導体装置用パツケ−ジ
JP60-015904 1985-01-30
JP14299485U JPH083011Y2 (ja) 1985-09-19 1985-09-19 半導体装置用パツケ−ジ
JP60-142994 1985-09-19
JP142994 1985-09-19
JP60207503A JPH0812888B2 (ja) 1985-09-19 1985-09-19 半導体装置用パツケ−ジ
JP207503 1985-09-19
JP60-207503 1985-09-19

Publications (2)

Publication Number Publication Date
KR870003563A true KR870003563A (ko) 1987-04-18
KR900001246B1 KR900001246B1 (ko) 1990-03-05

Family

ID=27281186

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860000613A KR900001246B1 (ko) 1985-01-30 1986-01-30 반도체장치

Country Status (6)

Country Link
US (1) US4825282A (ko)
EP (1) EP0190077B1 (ko)
KR (1) KR900001246B1 (ko)
AU (1) AU564928B2 (ko)
CA (1) CA1264380C (ko)
DE (1) DE3688205T2 (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5150196A (en) * 1989-07-17 1992-09-22 Hughes Aircraft Company Hermetic sealing of wafer scale integrated wafer
US5067008A (en) * 1989-08-11 1991-11-19 Hitachi Maxell, Ltd. Ic package and ic card incorporating the same thereinto
US5223741A (en) * 1989-09-01 1993-06-29 Tactical Fabs, Inc. Package for an integrated circuit structure
US5126827A (en) * 1991-01-17 1992-06-30 Avantek, Inc. Semiconductor chip header having particular surface metallization
FR2673765A1 (fr) * 1991-03-05 1992-09-11 Thomson Composants Militaires Boitier de circuit integre a connexion de puissance.
US5334874A (en) * 1991-09-13 1994-08-02 Metzler Richard A Electronic device package
US6040625A (en) * 1997-09-25 2000-03-21 I/O Sensors, Inc. Sensor package arrangement

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3502786A (en) * 1967-06-14 1970-03-24 Milton Stoll Flat pack spacer of low thermal diffusivity
DE1914442C3 (de) * 1969-03-21 1978-05-11 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Halbleiteranordnung
US3801938A (en) * 1972-05-31 1974-04-02 Trw Inc Package for microwave semiconductor device
JPS5758783B2 (ko) * 1973-02-22 1982-12-11 Nippon Electric Co
US3946428A (en) * 1973-09-19 1976-03-23 Nippon Electric Company, Limited Encapsulation package for a semiconductor element
US4030001A (en) * 1975-11-19 1977-06-14 E-Systems, Inc. Co-planar lead connections to microstrip switching devices
JPS5834755Y2 (ja) * 1978-09-18 1983-08-04 富士通株式会社 半導体装置
JPS5544755A (en) * 1978-09-25 1980-03-29 Nec Corp Semiconductor container
JPS55120152A (en) * 1979-03-09 1980-09-16 Fujitsu Ltd Semiconductor device
JPS55140251A (en) * 1979-04-12 1980-11-01 Fujitsu Ltd Semiconductor device
JPS5852858A (ja) * 1981-09-24 1983-03-29 Nec Corp 半導体装置
JPS58190046A (ja) * 1982-04-30 1983-11-05 Fujitsu Ltd 半導体装置
JPS5999745A (ja) * 1982-11-29 1984-06-08 Nec Corp マイクロ波ロ−ノイズ電界効果トランジスタ用容器
JPH05240974A (ja) * 1991-10-04 1993-09-21 Sanyo Electric Co Ltd 機器の制御装置

Also Published As

Publication number Publication date
AU564928B2 (en) 1987-09-03
CA1264380A (en) 1990-01-09
DE3688205D1 (de) 1993-05-13
AU5279486A (en) 1986-08-28
DE3688205T2 (de) 1993-07-22
US4825282A (en) 1989-04-25
KR900001246B1 (ko) 1990-03-05
EP0190077A2 (en) 1986-08-06
CA1264380C (en) 1990-01-09
EP0190077B1 (en) 1993-04-07
EP0190077A3 (en) 1987-05-06

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