KR900013654A - 반도체 장치 - Google Patents
반도체 장치 Download PDFInfo
- Publication number
- KR900013654A KR900013654A KR1019900002683A KR900002683A KR900013654A KR 900013654 A KR900013654 A KR 900013654A KR 1019900002683 A KR1019900002683 A KR 1019900002683A KR 900002683 A KR900002683 A KR 900002683A KR 900013654 A KR900013654 A KR 900013654A
- Authority
- KR
- South Korea
- Prior art keywords
- mis
- type
- semiconductor devices
- capacitor
- opposite
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims description 5
- 239000003990 capacitor Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
- H01L27/0641—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region without components of the field effect type
- H01L27/0676—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region without components of the field effect type comprising combinations of diodes, or capacitors or resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/92—Capacitors with potential-jump barrier or surface barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
- H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
- H01L27/0255—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using diodes as protective elements
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 제1실시예에 따른 MIS형 콘덴서를 포함한 반도체장치의 단면도.
제2도는 그 평면도.
제3도는 제1실시예에 따른 반도체장치의 등가회로도.
Claims (1)
- 제1도전형의 반도체기판(3)중에 형성된 제1영역(7)을 한쪽의 전극으로 갖춘(MIS)형 콘덴서(C)와, 이 MIS형 콘덴서(C)의 양단간에 서로 반대극성으로 직렬접속된 최소한 1쌍의 다이오드(D1,D2)를 구비하여 구성되고, 그 중 1개의 다이오드가 상기 반도체기판(3)중에 형성된 반대도전형의 웰영역(12)과 이 반대 도전형의 웰영역(12)내에 형성된 제1도전형의 제2,제3영역(9,11) 및 상기 MIS형 콘덴서(C)의 양단을 상기 제2, 제3영역(9,11)에 각각 접속시키는 배선수단(W1,W2)을 포함하고 있는 것을 특징으로 하는 반도체장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1047221A JP2786652B2 (ja) | 1989-02-28 | 1989-02-28 | 半導体装置 |
JP1-47221 | 1989-02-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR900013654A true KR900013654A (ko) | 1990-09-06 |
KR930006143B1 KR930006143B1 (ko) | 1993-07-07 |
Family
ID=12769129
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019900002683A KR930006143B1 (ko) | 1989-02-28 | 1990-02-28 | 반도체장치 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5089875A (ko) |
EP (1) | EP0385450B1 (ko) |
JP (1) | JP2786652B2 (ko) |
KR (1) | KR930006143B1 (ko) |
DE (1) | DE69033960T2 (ko) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5706163A (en) * | 1995-11-28 | 1998-01-06 | California Micro Devices Corporation | ESD-protected thin film capacitor structures |
KR970053932A (ko) * | 1995-12-08 | 1997-07-31 | 김광호 | 트랜지스터의 래치 전압을 이용한 정전 내력 향상 모스 축전기 |
US5892262A (en) * | 1996-06-03 | 1999-04-06 | Winbond Electronics Corp. | Capacitor-triggered electrostatic discharge protection circuit |
US6417556B1 (en) * | 2000-02-02 | 2002-07-09 | Advanced Micro Devices, Inc. | High K dielectric de-coupling capacitor embedded in backend interconnect |
US6838367B1 (en) | 2000-08-24 | 2005-01-04 | Micron Technology, Inc. | Method for simultaneous formation of fuse and capacitor plate and resulting structure |
JP3873679B2 (ja) * | 2001-07-23 | 2007-01-24 | セイコーエプソン株式会社 | 半導体容量装置、昇圧回路および不揮発性半導体記憶装置 |
JP2006100308A (ja) * | 2004-09-28 | 2006-04-13 | Sanyo Electric Co Ltd | 半導体装置、全波整流回路、半波整流回路 |
JP4986404B2 (ja) * | 2005-03-17 | 2012-07-25 | 三菱電機株式会社 | 半導体装置 |
US7420793B2 (en) * | 2006-01-12 | 2008-09-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Circuit system for protecting thin dielectric devices from ESD induced damages |
JP2009245503A (ja) * | 2008-03-31 | 2009-10-22 | Nec Electronics Corp | 半導体記憶装置 |
WO2015025753A1 (ja) * | 2013-08-19 | 2015-02-26 | 株式会社村田製作所 | Esd保護機能付薄膜キャパシタ装置およびその製造方法 |
DE102014008990B4 (de) | 2014-06-13 | 2016-11-10 | Dietmar Dreyer | Halbleiterverstärker zur Speicherung von elektrischer Energie auf der Basis eines generierten Schwingkreises |
US11351048B2 (en) | 2015-11-16 | 2022-06-07 | Boston Scientific Scimed, Inc. | Stent delivery systems with a reinforced deployment sheath |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3469155A (en) * | 1966-09-23 | 1969-09-23 | Westinghouse Electric Corp | Punch-through means integrated with mos type devices for protection against insulation layer breakdown |
JPS5821374A (ja) * | 1981-07-29 | 1983-02-08 | Toshiba Corp | 半導体装置 |
JPS5825264A (ja) * | 1981-08-07 | 1983-02-15 | Hitachi Ltd | 絶縁ゲート型半導体装置 |
JPS60144972A (ja) * | 1984-01-06 | 1985-07-31 | Toshiba Corp | 半導体装置 |
JPS60229359A (ja) * | 1984-04-27 | 1985-11-14 | Matsushita Electric Ind Co Ltd | 高周波半導体装置 |
US4651178A (en) * | 1985-05-31 | 1987-03-17 | Rca Corporation | Dual inverse zener diode with buried junctions |
JPS6218938U (ko) * | 1985-07-18 | 1987-02-04 | ||
JPS62154661A (ja) * | 1985-12-26 | 1987-07-09 | Toshiba Corp | 半導体装置 |
US4758873A (en) * | 1986-05-16 | 1988-07-19 | National Semiconductor Corporation | Balanced MOS capacitor with low stray capacitance and high ESD survival |
-
1989
- 1989-02-28 JP JP1047221A patent/JP2786652B2/ja not_active Expired - Fee Related
-
1990
- 1990-02-28 KR KR1019900002683A patent/KR930006143B1/ko not_active IP Right Cessation
- 1990-02-28 EP EP90103926A patent/EP0385450B1/en not_active Expired - Lifetime
- 1990-02-28 DE DE69033960T patent/DE69033960T2/de not_active Expired - Fee Related
-
1991
- 1991-04-23 US US07/689,668 patent/US5089875A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2786652B2 (ja) | 1998-08-13 |
EP0385450A3 (en) | 1991-07-17 |
DE69033960T2 (de) | 2002-11-07 |
EP0385450B1 (en) | 2002-05-08 |
KR930006143B1 (ko) | 1993-07-07 |
DE69033960D1 (de) | 2002-06-13 |
JPH02226757A (ja) | 1990-09-10 |
US5089875A (en) | 1992-02-18 |
EP0385450A2 (en) | 1990-09-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR880004580A (ko) | 전력 mosfet와 제어회로가 통합된 반도체소자 | |
KR940010352A (ko) | 반도체기억장치 | |
KR860002153A (ko) | 반도체 장치 | |
KR900013654A (ko) | 반도체 장치 | |
KR850002670A (ko) | 마스터 슬라이스 반도체 장치 | |
KR850000803A (ko) | 반도체 장치 | |
KR910019235A (ko) | 반도체기억장치 | |
KR890016679A (ko) | 반도체장치 | |
KR910007129A (ko) | 입력보호회로를 구비한 반도체장치 | |
KR950028013A (ko) | 보호회로를 내장한 절연게이트형 반도체장치 | |
KR880006782A (ko) | 접합 파괴방지 반도체장치 | |
KR900019259A (ko) | 쌍방향제어정류 반도체장치 | |
KR930003416A (ko) | 저용량 2중 확산형 전계효과 트랜지스터 | |
KR900701044A (ko) | 반도체 장치 | |
KR950020965A (ko) | 반도체 장치 | |
KR900004040A (ko) | 반도체 집적회로 디바이스 | |
KR910017656A (ko) | 반도체장치 | |
KR850000805A (ko) | 받도체장치 | |
KR960009209A (ko) | 반도체 집적회로 | |
KR950015829A (ko) | 전계효과에 의해 제어가능한 반도체 소자 | |
KR930011296A (ko) | 전계효과형 트랜지스터 | |
KR910008853A (ko) | 반도체장치와 그 제조방법 | |
KR920018932A (ko) | 반도체장치 | |
KR910015041A (ko) | 두개의 에미터 단자를 갖는 고주파수 smd 트랜지스터 | |
KR890013790A (ko) | 반도체 장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20060630 Year of fee payment: 14 |
|
LAPS | Lapse due to unpaid annual fee |