KR950012613A - 반도체 장치 및 그 제조 방법 - Google Patents

반도체 장치 및 그 제조 방법 Download PDF

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Publication number
KR950012613A
KR950012613A KR1019940025286A KR19940025286A KR950012613A KR 950012613 A KR950012613 A KR 950012613A KR 1019940025286 A KR1019940025286 A KR 1019940025286A KR 19940025286 A KR19940025286 A KR 19940025286A KR 950012613 A KR950012613 A KR 950012613A
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KR
South Korea
Prior art keywords
wiring pattern
semiconductor substrate
semiconductor device
manufacturing
same material
Prior art date
Application number
KR1019940025286A
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English (en)
Other versions
KR0155584B1 (ko
Inventor
고우사쿠 치다
요시하루 히라노
다쿠야 치바
분사쿠 아라야
Original Assignee
사또오 후미오
가부시기가이샤 도시바
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Application filed by 사또오 후미오, 가부시기가이샤 도시바 filed Critical 사또오 후미오
Publication of KR950012613A publication Critical patent/KR950012613A/ko
Application granted granted Critical
Publication of KR0155584B1 publication Critical patent/KR0155584B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
    • H01L21/32139—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer using masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
    • H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

본 발명은 소자 특성의 저하를 가급적 방지하여 신뢰도 향상을 도모할 수 있는 반도체 장치를 제공하며, 반도체 기판상에 형성되는 배선 패턴(3)을 갖는 기능 회로 모듈(2)과, 반도체 기판상의 소영역(4)에 대한 배선 패턴의 근접 영역상에서 배선 패턴과 동시에 형성되며 배선 패턴과 동일 재료인 더미 배선 패턴(5)을 구비하고 있는 것을 특징으로 한다.

Description

반도체 장치 및 그 제조 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 반도체 장치의 일 실시예의 구성을 나타내는 평면도.
제2도는 제1도에 도시된 반도체 장치를 라인 A-A 로 절단한 경우의 단면도.

Claims (2)

  1. 반도체 기판(1)상에 형성된 배선 패턴(3)을 포함한 기능 회로 모듈(2)과, 상기 반도체 기판상의 소영역(4)의 상기 배선 패턴에 근접하여 상기 배선 패턴과 동시에 형성되며 상기 배선 패턴과 동일 재료의 더미 배선 패턴(5)을 구비하는 것을 특징으로 하는 반도체 장치.
  2. 반도체 기판상의 기능 회로 모듈에 대한 배선 패턴을 형성하는 동시에 반도체 기판상의 소영역의 상기 배선 패턴에 근접하여 상기 배선 패턴과 동일 재료의 더미 배선 패턴을 형성시키는 단계를 포함하는 것을 특징으로 하는 반도체 장치의 제조 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019940025286A 1993-10-06 1994-10-04 반도체 장치 및 그 제조방법 KR0155584B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP5250493A JPH07106327A (ja) 1993-10-06 1993-10-06 半導体装置及びその製造方法
JP93-250493 1993-10-06

Publications (2)

Publication Number Publication Date
KR950012613A true KR950012613A (ko) 1995-05-16
KR0155584B1 KR0155584B1 (ko) 1998-12-01

Family

ID=17208694

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940025286A KR0155584B1 (ko) 1993-10-06 1994-10-04 반도체 장치 및 그 제조방법

Country Status (3)

Country Link
EP (1) EP0647966A1 (ko)
JP (1) JPH07106327A (ko)
KR (1) KR0155584B1 (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6242363B1 (en) 1999-08-11 2001-06-05 Adc Telecommunications, Inc. Method of etching a wafer layer using a sacrificial wall to form vertical sidewall
US6229640B1 (en) * 1999-08-11 2001-05-08 Adc Telecommunications, Inc. Microelectromechanical optical switch and method of manufacture thereof
US6801682B2 (en) 2001-05-18 2004-10-05 Adc Telecommunications, Inc. Latching apparatus for a MEMS optical switch
JP5265939B2 (ja) * 2008-02-08 2013-08-14 セイコーインスツル株式会社 半導体装置の製造方法
CN110753452A (zh) * 2019-10-30 2020-02-04 江苏上达电子有限公司 一种精密线路的外部蚀刻补偿方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61263130A (ja) * 1985-05-15 1986-11-21 Toshiba Corp 半導体装置の製造方法
JPS6289331A (ja) * 1985-10-16 1987-04-23 Toshiba Corp 微細パタ−ンの加工方法
JPS63181355A (ja) * 1987-01-22 1988-07-26 Nec Yamagata Ltd 半導体装置
JPH02189922A (ja) * 1989-01-18 1990-07-25 Nec Corp 半導体装置の製造方法

Also Published As

Publication number Publication date
EP0647966A1 (en) 1995-04-12
JPH07106327A (ja) 1995-04-21
KR0155584B1 (ko) 1998-12-01

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