KR950012696A - 반도체 패키지 - Google Patents
반도체 패키지 Download PDFInfo
- Publication number
- KR950012696A KR950012696A KR1019940026726A KR19940026726A KR950012696A KR 950012696 A KR950012696 A KR 950012696A KR 1019940026726 A KR1019940026726 A KR 1019940026726A KR 19940026726 A KR19940026726 A KR 19940026726A KR 950012696 A KR950012696 A KR 950012696A
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor package
- guide
- cap
- package
- section
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Packaging Frangible Articles (AREA)
Abstract
반도체 패키지는 그 상부면에서 적어도 대각선으로 대향한 2개의 모서리에서 러그의 형태로 된 가이드를 가진다. 패키지에 부착되는 캡은 가이트의 내부면과 대응하는 작을 이룬 형태이다. 따라서 패키지는 캡에 확고히 밀봉되고 밀접하게 부착된다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제3A도는 본 발명을 구체화하는 반도체 패키지의 사시도,
제3B도는 제3A도의 선 3B-3B'를 취한 단면도,
제4도는 본 발명의 다른 실시예의 사시도.
Claims (4)
- 패키지를 밀봉하기 위한 캡과, 상기 캡을 부착하기 위한 부착면과, 상기 부착면의 다수의 모서리에 배치된 러그 형태로 된 가이드를 구비하는 것을 특징으로 하는 반도체 패키지.
- 제1항에 있어서, 상기 가이드는 사각형 단면을 갖는 것을 특징으로 하는 반도체 패키지.
- 제1항에 있어서, 상기 가이드는 삼각형 단면을 갖는 것을 특징으로 하는 반도체 패키지.
- 제1항에 있어서, 상기 캡은 가이드의 내부면과 상호보완하는 형태를 갖는 것을 특징으로 하는 반도체 패키지.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP93-281637 | 1993-10-15 | ||
JP5281637A JP2522186B2 (ja) | 1993-10-15 | 1993-10-15 | 半導体パッケ―ジ |
Publications (2)
Publication Number | Publication Date |
---|---|
KR950012696A true KR950012696A (ko) | 1995-05-16 |
KR0143872B1 KR0143872B1 (ko) | 1998-07-01 |
Family
ID=17641892
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019940026726A KR0143872B1 (ko) | 1993-10-15 | 1994-10-14 | 반도체 패키지 |
Country Status (3)
Country | Link |
---|---|
US (2) | US5646443A (ko) |
JP (1) | JP2522186B2 (ko) |
KR (1) | KR0143872B1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100674206B1 (ko) * | 2005-01-25 | 2007-01-25 | 엔이씨 일렉트로닉스 가부시키가이샤 | 반도체 장치 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3003638B2 (ja) * | 1997-08-05 | 2000-01-31 | 日本電気株式会社 | 半導体装置、その製造方法 |
US5949137A (en) * | 1997-09-26 | 1999-09-07 | Lsi Logic Corporation | Stiffener ring and heat spreader for use with flip chip packaging assemblies |
USD877102S1 (en) * | 2017-12-28 | 2020-03-03 | Shindengen Electric Manufacturing Co., Ltd. | Semiconductor module |
USD906271S1 (en) * | 2018-04-13 | 2020-12-29 | Rohm Co., Ltd. | Semiconductor module |
JP1632999S (ko) * | 2018-06-12 | 2019-06-03 | ||
USD937231S1 (en) * | 2020-04-06 | 2021-11-30 | Wolfspeed, Inc. | Power semiconductor package |
JP1711418S (ja) * | 2021-10-13 | 2022-03-31 | 半導体素子 | |
USD1009818S1 (en) * | 2021-10-13 | 2024-01-02 | Rohm Co., Ltd. | Semiconductor device |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1345856A (en) * | 1920-02-06 | 1920-07-06 | Hughes Lionel Worsley | Packing-case |
JPS5547772U (ko) * | 1978-09-26 | 1980-03-28 | ||
JPS56137658A (en) * | 1980-03-31 | 1981-10-27 | Chiyou Lsi Gijutsu Kenkyu Kumiai | Semiconductor device |
JPS5794952U (ko) * | 1980-12-01 | 1982-06-11 | ||
JPS6297355A (ja) * | 1985-10-23 | 1987-05-06 | Toshiba Corp | 気密封止型半導体装置 |
JPS62106653A (ja) * | 1985-11-05 | 1987-05-18 | Mitsubishi Electric Corp | 半導体装置 |
JPS63275152A (ja) * | 1987-05-07 | 1988-11-11 | Nec Corp | Ic用ソケット |
JPH01187839A (ja) * | 1988-01-22 | 1989-07-27 | Nec Corp | 半導体素子用積層型セラミック容器 |
JPH027453A (ja) * | 1988-06-27 | 1990-01-11 | Fuji Photo Film Co Ltd | ガラスキャップ法 |
JPH02125344U (ko) * | 1989-03-27 | 1990-10-16 | ||
JP2506449B2 (ja) * | 1989-06-30 | 1996-06-12 | 富士通株式会社 | パッケ―ジ |
JPH0443671A (ja) * | 1990-06-11 | 1992-02-13 | Matsushita Electron Corp | 半導体装置およびその製造方法 |
JPH04177862A (ja) * | 1990-11-13 | 1992-06-25 | Nec Kyushu Ltd | 半導体装置用セラミックパッケージ |
JPH04246847A (ja) * | 1991-02-01 | 1992-09-02 | Nec Kyushu Ltd | 半導体集積回路のパッケージ |
-
1993
- 1993-10-15 JP JP5281637A patent/JP2522186B2/ja not_active Expired - Fee Related
-
1994
- 1994-10-14 KR KR1019940026726A patent/KR0143872B1/ko not_active IP Right Cessation
-
1996
- 1996-01-11 US US08/584,161 patent/US5646443A/en not_active Expired - Fee Related
-
1997
- 1997-01-07 US US08/779,606 patent/US5789812A/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100674206B1 (ko) * | 2005-01-25 | 2007-01-25 | 엔이씨 일렉트로닉스 가부시키가이샤 | 반도체 장치 |
Also Published As
Publication number | Publication date |
---|---|
JP2522186B2 (ja) | 1996-08-07 |
US5789812A (en) | 1998-08-04 |
KR0143872B1 (ko) | 1998-07-01 |
US5646443A (en) | 1997-07-08 |
JPH07115145A (ja) | 1995-05-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20040331 Year of fee payment: 7 |
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LAPS | Lapse due to unpaid annual fee |