JP1711418S - 半導体素子 - Google Patents

半導体素子

Info

Publication number
JP1711418S
JP1711418S JP2021022273F JP2021022273F JP1711418S JP 1711418 S JP1711418 S JP 1711418S JP 2021022273 F JP2021022273 F JP 2021022273F JP 2021022273 F JP2021022273 F JP 2021022273F JP 1711418 S JP1711418 S JP 1711418S
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JP
Japan
Prior art keywords
semiconductor element
terminal
package
viewed
short
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Active
Application number
JP2021022273F
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English (en)
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Priority to JP2021022273F priority Critical patent/JP1711418S/ja
Application granted granted Critical
Publication of JP1711418S publication Critical patent/JP1711418S/ja
Priority to US29/834,030 priority patent/USD1009819S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

この意匠に係る物品は、いわゆるＳＯＰ（Ｓｍａｌｌ Ｏｕｔｌｉｎｅ Ｐａｃｋａｇｅ）と称されることのある半導体素子であって、大きな放熱部材を備えたものである。正面視において、パッケージ部の低い位置から端子が突出していることにより、端子と放熱部材との距離が近くなっている。
JP2021022273F 2021-10-13 2021-10-13 半導体素子 Active JP1711418S (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2021022273F JP1711418S (ja) 2021-10-13 2021-10-13 半導体素子
US29/834,030 USD1009819S1 (en) 2021-10-13 2022-04-08 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021022273F JP1711418S (ja) 2021-10-13 2021-10-13 半導体素子

Publications (1)

Publication Number Publication Date
JP1711418S true JP1711418S (ja) 2022-03-31

Family

ID=80912953

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021022273F Active JP1711418S (ja) 2021-10-13 2021-10-13 半導体素子

Country Status (2)

Country Link
US (1) USD1009819S1 (ja)
JP (1) JP1711418S (ja)

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Also Published As

Publication number Publication date
USD1009819S1 (en) 2024-01-02

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