JP1699856S - 半導体素子 - Google Patents

半導体素子

Info

Publication number
JP1699856S
JP1699856S JP2020026987F JP2020026987F JP1699856S JP 1699856 S JP1699856 S JP 1699856S JP 2020026987 F JP2020026987 F JP 2020026987F JP 2020026987 F JP2020026987 F JP 2020026987F JP 1699856 S JP1699856 S JP 1699856S
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JP
Japan
Prior art keywords
semiconductor element
semiconductor
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Active
Application number
JP2020026987F
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English (en)
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Priority to JP2020026987F priority Critical patent/JP1699856S/ja
Priority to US29/767,916 priority patent/USD973029S1/en
Application granted granted Critical
Publication of JP1699856S publication Critical patent/JP1699856S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2020026987F 2020-12-15 2020-12-15 半導体素子 Active JP1699856S (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2020026987F JP1699856S (ja) 2020-12-15 2020-12-15 半導体素子
US29/767,916 USD973029S1 (en) 2020-12-15 2021-01-26 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020026987F JP1699856S (ja) 2020-12-15 2020-12-15 半導体素子

Publications (1)

Publication Number Publication Date
JP1699856S true JP1699856S (ja) 2021-11-15

Family

ID=78508141

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020026987F Active JP1699856S (ja) 2020-12-15 2020-12-15 半導体素子

Country Status (2)

Country Link
US (1) USD973029S1 (ja)
JP (1) JP1699856S (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1695824S (ja) * 2021-03-19 2021-09-27
JP1695848S (ja) * 2021-03-19 2021-09-27
JP1695826S (ja) * 2021-03-19 2021-09-27
JP1695849S (ja) * 2021-03-19 2021-09-27
JP1695850S (ja) * 2021-03-19 2021-09-27
JP1695825S (ja) * 2021-03-19 2021-09-27
USD1021831S1 (en) * 2021-03-23 2024-04-09 Rohm Co., Ltd. Power semiconductor module
JP1711418S (ja) * 2021-10-13 2022-03-31 半導体素子
USD1009818S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD401912S (en) * 1995-11-27 1998-12-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD394244S (en) * 1995-11-27 1998-05-12 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD505399S1 (en) * 2003-03-14 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD505400S1 (en) * 2004-03-26 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
JP6069904B2 (ja) * 2012-06-22 2017-02-01 富士通株式会社 磁気抵抗メモリ
USD717255S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719926S1 (en) * 2012-09-20 2014-12-23 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717256S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719113S1 (en) * 2012-09-20 2014-12-09 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717254S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD772182S1 (en) * 2014-04-02 2016-11-22 Mitsubishi Electric Corporation Power semiconductor device
USD824866S1 (en) * 2016-09-30 2018-08-07 Rohm Co., Ltd. Semiconductor device
JP1593817S (ja) * 2017-03-28 2017-12-25
JP1603175S (ja) * 2017-10-19 2018-05-07
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD906271S1 (en) * 2018-04-13 2020-12-29 Rohm Co., Ltd. Semiconductor module
JP1665773S (ja) * 2018-11-07 2020-08-11
JP1664527S (ja) 2019-10-28 2020-07-27
JP1664528S (ja) 2019-10-28 2020-07-27
USD932452S1 (en) * 2019-11-27 2021-10-05 The Noco Company Semiconductor device
USD920264S1 (en) * 2019-11-27 2021-05-25 The Noco Company Semiconductor device

Also Published As

Publication number Publication date
USD973029S1 (en) 2022-12-20

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