JP1695824S - - Google Patents
Info
- Publication number
- JP1695824S JP1695824S JPD2021-5674F JP2021005674F JP1695824S JP 1695824 S JP1695824 S JP 1695824S JP 2021005674 F JP2021005674 F JP 2021005674F JP 1695824 S JP1695824 S JP 1695824S
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2021-5674F JP1695824S (ja) | 2021-03-19 | 2021-03-19 | |
US29/807,874 USD1012048S1 (en) | 2021-03-19 | 2021-09-15 | Semiconductor module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2021-5674F JP1695824S (ja) | 2021-03-19 | 2021-03-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP1695824S true JP1695824S (ja) | 2021-09-27 |
Family
ID=77847456
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JPD2021-5674F Active JP1695824S (ja) | 2021-03-19 | 2021-03-19 |
Country Status (2)
Country | Link |
---|---|
US (1) | USD1012048S1 (ja) |
JP (1) | JP1695824S (ja) |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD394244S (en) * | 1995-11-27 | 1998-05-12 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD470463S1 (en) * | 2001-11-30 | 2003-02-18 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD472530S1 (en) * | 2001-11-30 | 2003-04-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD874411S1 (en) | 2008-04-13 | 2020-02-04 | Rohm Co., Ltd. | Semiconductor module |
JP1615980S (ja) | 2018-04-13 | 2018-10-15 | ||
JP1615883S (ja) | 2018-04-13 | 2018-10-15 | ||
JP5991440B2 (ja) * | 2013-09-10 | 2016-09-14 | 三菱電機株式会社 | 半導体装置、半導体モジュール |
CN110050339B (zh) * | 2016-12-16 | 2023-12-22 | 日立能源有限公司 | 具有低栅极通路电感的功率半导体模块 |
JP1615885S (ja) | 2018-04-13 | 2018-10-15 | ||
USD873226S1 (en) | 2018-04-13 | 2020-01-21 | Rohm Co., Ltd. | Semiconductor module |
JP1615981S (ja) | 2018-04-13 | 2018-10-15 | ||
DE212020000492U1 (de) * | 2019-07-02 | 2021-07-23 | Rohm Co., Ltd. | Halbleiterbauteil |
JP7457812B2 (ja) * | 2020-01-16 | 2024-03-28 | 住友電気工業株式会社 | 半導体モジュール |
JP1699856S (ja) * | 2020-12-15 | 2021-11-15 | 半導体素子 |
-
2021
- 2021-03-19 JP JPD2021-5674F patent/JP1695824S/ja active Active
- 2021-09-15 US US29/807,874 patent/USD1012048S1/en active Active
Also Published As
Publication number | Publication date |
---|---|
USD1012048S1 (en) | 2024-01-23 |