USD973029S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD973029S1
USD973029S1 US29/767,916 US202129767916F USD973029S US D973029 S1 USD973029 S1 US D973029S1 US 202129767916 F US202129767916 F US 202129767916F US D973029 S USD973029 S US D973029S
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Prior art keywords
semiconductor device
view
design
ornamental design
side perspective
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US29/767,916
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English (en)
Inventor
Kohei Tanikawa
Takumi Kanda
Kenji Hayashi
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Rohm Co Ltd
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Rohm Co Ltd
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Assigned to ROHM CO., LTD. reassignment ROHM CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HAYASHI, KENJI, KANDA, TAKUMI, TANIKAWA, KOHEI
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US29/767,916 2020-12-15 2021-01-26 Semiconductor device Active USD973029S1 (en)

Applications Claiming Priority (2)

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JP2020-026987D 2020-12-15
JP2020026987F JP1699856S (ja) 2020-12-15 2020-12-15 半導体素子

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USD973029S1 true USD973029S1 (en) 2022-12-20

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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1009818S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1009819S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1012049S1 (en) * 2021-03-19 2024-01-23 Rohm Co., Ltd. Semiconductor module
USD1012048S1 (en) * 2021-03-19 2024-01-23 Rohm Co., Ltd. Semiconductor module
USD1013648S1 (en) * 2021-03-19 2024-02-06 Rohm Co., Ltd. Semiconductor module
USD1013647S1 (en) * 2021-03-19 2024-02-06 Rohm Co., Ltd. Semiconductor module
USD1015283S1 (en) * 2021-03-19 2024-02-20 Rohm Co., Ltd. Semiconductor module
USD1015284S1 (en) * 2021-03-19 2024-02-20 Rohm Co., Ltd. Semiconductor module
USD1021831S1 (en) * 2021-03-23 2024-04-09 Rohm Co., Ltd. Power semiconductor module
USD1030686S1 (en) * 2021-03-23 2024-06-11 Rohm Co., Ltd. Power semiconductor module

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USD401912S (en) * 1995-11-27 1998-12-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD505400S1 (en) * 2004-03-26 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD505399S1 (en) * 2003-03-14 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
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USD717254S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717256S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719113S1 (en) * 2012-09-20 2014-12-09 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719926S1 (en) * 2012-09-20 2014-12-23 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD777124S1 (en) * 2014-04-02 2017-01-24 Mitsubishi Electric Corporation Power semiconductor device
USD824866S1 (en) * 2016-09-30 2018-08-07 Rohm Co., Ltd. Semiconductor device
USD856947S1 (en) * 2017-10-19 2019-08-20 Rohm Co., Ltd. Semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
JP1664527S (ja) 2019-10-28 2020-07-27
JP1664528S (ja) 2019-10-28 2020-07-27
USD900759S1 (en) * 2018-11-07 2020-11-03 Rohm Co., Ltd. Semiconductor device
USD901405S1 (en) * 2017-03-28 2020-11-10 Rohm Co., Ltd. Semiconductor device
USD906271S1 (en) * 2018-04-13 2020-12-29 Rohm Co., Ltd. Semiconductor module
USD920264S1 (en) * 2019-11-27 2021-05-25 The Noco Company Semiconductor device
USD932452S1 (en) * 2019-11-27 2021-10-05 The Noco Company Semiconductor device

Patent Citations (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD394244S (en) * 1995-11-27 1998-05-12 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD401912S (en) * 1995-11-27 1998-12-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD505399S1 (en) * 2003-03-14 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD505400S1 (en) * 2004-03-26 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
JP2014007263A (ja) * 2012-06-22 2014-01-16 Fujitsu Ltd 磁気抵抗メモリ
USD717255S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717256S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719113S1 (en) * 2012-09-20 2014-12-09 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719926S1 (en) * 2012-09-20 2014-12-23 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717254S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD777124S1 (en) * 2014-04-02 2017-01-24 Mitsubishi Electric Corporation Power semiconductor device
USD783550S1 (en) * 2014-04-02 2017-04-11 Mitsubishi Electric Corporation Power semiconductor device
USD824866S1 (en) * 2016-09-30 2018-08-07 Rohm Co., Ltd. Semiconductor device
USD901405S1 (en) * 2017-03-28 2020-11-10 Rohm Co., Ltd. Semiconductor device
USD856947S1 (en) * 2017-10-19 2019-08-20 Rohm Co., Ltd. Semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD864135S1 (en) * 2017-10-26 2019-10-22 Mitsubishi Electric Corporation Semiconductor device
USD906271S1 (en) * 2018-04-13 2020-12-29 Rohm Co., Ltd. Semiconductor module
USD900759S1 (en) * 2018-11-07 2020-11-03 Rohm Co., Ltd. Semiconductor device
JP1664527S (ja) 2019-10-28 2020-07-27
JP1664528S (ja) 2019-10-28 2020-07-27
USD920264S1 (en) * 2019-11-27 2021-05-25 The Noco Company Semiconductor device
USD932452S1 (en) * 2019-11-27 2021-10-05 The Noco Company Semiconductor device

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
ON Semiconductor, announced on Aug. 19, 2018 [online], retrieved on Aug. 8, 2020, retrieved from internet, https://www.amazon.com/Semiconductor-LM2902N-LM2902-Quadruple-Operational/dp/B07GNRVNV4 (Year: 2018). *
Rohm, announced on Jul. 20, 2021 [online], retrieved on Aug. 8, 2022, https://web.archive.org/web/20210720165742/https://www.rohm.com/news-detail?news-title=hybrid-igbts-with-built-in-sic-diode&defaultGroupId=false (Year: 2021). *
Unbranded Analog Device, announced on Nov. 26, 2018 [online], retrieved on Aug. 8, 2022, retrieved from internet, https://www.amazon.com/Semiconductor-LM2902N-LM2902-Quadruple-Operational/dp/B07GNRVNV4 (Year: 2018). *

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1012049S1 (en) * 2021-03-19 2024-01-23 Rohm Co., Ltd. Semiconductor module
USD1012048S1 (en) * 2021-03-19 2024-01-23 Rohm Co., Ltd. Semiconductor module
USD1013648S1 (en) * 2021-03-19 2024-02-06 Rohm Co., Ltd. Semiconductor module
USD1013647S1 (en) * 2021-03-19 2024-02-06 Rohm Co., Ltd. Semiconductor module
USD1015283S1 (en) * 2021-03-19 2024-02-20 Rohm Co., Ltd. Semiconductor module
USD1015284S1 (en) * 2021-03-19 2024-02-20 Rohm Co., Ltd. Semiconductor module
USD1021831S1 (en) * 2021-03-23 2024-04-09 Rohm Co., Ltd. Power semiconductor module
USD1030686S1 (en) * 2021-03-23 2024-06-11 Rohm Co., Ltd. Power semiconductor module
USD1009818S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1009819S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device

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