JPWO2019197946A5 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JPWO2019197946A5 JPWO2019197946A5 JP2020512942A JP2020512942A JPWO2019197946A5 JP WO2019197946 A5 JPWO2019197946 A5 JP WO2019197946A5 JP 2020512942 A JP2020512942 A JP 2020512942A JP 2020512942 A JP2020512942 A JP 2020512942A JP WO2019197946 A5 JPWO2019197946 A5 JP WO2019197946A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023032991A JP2023063351A (ja) | 2018-04-12 | 2023-03-03 | 半導体装置 |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018076694 | 2018-04-12 | ||
| JP2018076752 | 2018-04-12 | ||
| JP2018076752 | 2018-04-12 | ||
| JP2018076694 | 2018-04-12 | ||
| PCT/IB2019/052744 WO2019197946A1 (ja) | 2018-04-12 | 2019-04-04 | 半導体装置、および半導体装置の作製方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023032991A Division JP2023063351A (ja) | 2018-04-12 | 2023-03-03 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2019197946A1 JPWO2019197946A1 (ja) | 2021-04-22 |
| JPWO2019197946A5 true JPWO2019197946A5 (ja) | 2022-03-10 |
| JP7240383B2 JP7240383B2 (ja) | 2023-03-15 |
Family
ID=68163981
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020512942A Active JP7240383B2 (ja) | 2018-04-12 | 2019-04-04 | 半導体装置 |
| JP2023032991A Pending JP2023063351A (ja) | 2018-04-12 | 2023-03-03 | 半導体装置 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023032991A Pending JP2023063351A (ja) | 2018-04-12 | 2023-03-03 | 半導体装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (3) | US11355530B2 (ja) |
| JP (2) | JP7240383B2 (ja) |
| WO (1) | WO2019197946A1 (ja) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7161529B2 (ja) | 2018-06-08 | 2022-10-26 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| WO2023126741A1 (ja) * | 2021-12-29 | 2023-07-06 | 株式会社半導体エネルギー研究所 | 半導体装置、記憶装置、及び半導体装置の作製方法 |
| WO2023166374A1 (ja) * | 2022-03-04 | 2023-09-07 | 株式会社半導体エネルギー研究所 | 半導体装置、及び半導体装置の作製方法 |
| WO2023170511A1 (ja) * | 2022-03-11 | 2023-09-14 | 株式会社半導体エネルギー研究所 | 半導体装置、記憶装置、及び電子機器 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10361290B2 (en) | 2014-03-14 | 2019-07-23 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device comprising adding oxygen to buffer film and insulating film |
| JP6857447B2 (ja) | 2015-01-26 | 2021-04-14 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US10403646B2 (en) | 2015-02-20 | 2019-09-03 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| JP6674838B2 (ja) | 2015-05-21 | 2020-04-01 | 株式会社半導体エネルギー研究所 | 電子装置 |
| US10424671B2 (en) | 2015-07-29 | 2019-09-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, circuit board, and electronic device |
| KR102513517B1 (ko) | 2015-07-30 | 2023-03-22 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 전자 기기 |
| US9773787B2 (en) * | 2015-11-03 | 2017-09-26 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, memory device, electronic device, or method for driving the semiconductor device |
| US10868045B2 (en) | 2015-12-11 | 2020-12-15 | Semiconductor Energy Laboratory Co., Ltd. | Transistor, semiconductor device, and electronic device |
| CN108886021B (zh) | 2016-02-12 | 2023-07-25 | 株式会社半导体能源研究所 | 半导体装置及其制造方法 |
| US10333004B2 (en) | 2016-03-18 | 2019-06-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, semiconductor wafer, module and electronic device |
| US10032918B2 (en) * | 2016-04-22 | 2018-07-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| WO2017187301A1 (en) | 2016-04-28 | 2017-11-02 | Semiconductor Energy Laboratory Co., Ltd. | Transistor, semiconductor device, and electronic device |
| US10910407B2 (en) | 2017-01-30 | 2021-02-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| WO2019186331A1 (ja) | 2018-03-29 | 2019-10-03 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP2019201062A (ja) | 2018-05-15 | 2019-11-21 | 株式会社半導体エネルギー研究所 | 半導体装置、および半導体装置の作製方法 |
-
2019
- 2019-04-04 JP JP2020512942A patent/JP7240383B2/ja active Active
- 2019-04-04 WO PCT/IB2019/052744 patent/WO2019197946A1/ja active Application Filing
- 2019-04-04 US US17/041,852 patent/US11355530B2/en active Active
-
2022
- 2022-04-26 US US17/729,017 patent/US11894397B2/en active Active
-
2023
- 2023-03-03 JP JP2023032991A patent/JP2023063351A/ja active Pending
- 2023-12-29 US US18/399,990 patent/US20240162252A1/en active Pending
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