JP1665773S - - Google Patents

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Publication number
JP1665773S
JP1665773S JPD2018-24474F JP2018024474F JP1665773S JP 1665773 S JP1665773 S JP 1665773S JP 2018024474 F JP2018024474 F JP 2018024474F JP 1665773 S JP1665773 S JP 1665773S
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
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JPD2018-24474F
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Publication date
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Priority to JPD2018-24474F priority Critical patent/JP1665773S/ja
Priority to US29/689,348 priority patent/USD900759S1/en
Application granted granted Critical
Publication of JP1665773S publication Critical patent/JP1665773S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2018-24474F 2018-11-07 2018-11-07 Active JP1665773S (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JPD2018-24474F JP1665773S (ja) 2018-11-07 2018-11-07
US29/689,348 USD900759S1 (en) 2018-11-07 2019-04-29 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2018-24474F JP1665773S (ja) 2018-11-07 2018-11-07

Publications (1)

Publication Number Publication Date
JP1665773S true JP1665773S (ja) 2020-08-11

Family

ID=71949048

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2018-24474F Active JP1665773S (ja) 2018-11-07 2018-11-07

Country Status (2)

Country Link
US (1) USD900759S1 (ja)
JP (1) JP1665773S (ja)

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USD920937S1 (en) * 2019-03-29 2021-06-01 Shindengen Electric Manufacturing Co., Ltd. Power module device containing semiconductor elements
USD939458S1 (en) * 2019-05-29 2021-12-28 Diodes Incorporated Leadframe
USD940090S1 (en) * 2019-05-29 2022-01-04 Diodes Incorporated Leadframe
JP1660133S (ja) * 2019-09-26 2020-05-25
USD934187S1 (en) * 2020-01-21 2021-10-26 Lang Cheng Integrated circuit package
USD937231S1 (en) * 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package
JP1680788S (ja) * 2020-07-31 2021-03-08
JP1682283S (ja) * 2020-07-31 2021-03-29
JP1699856S (ja) * 2020-12-15 2021-11-15 半導体素子
JP1695980S (ja) * 2021-03-09 2021-09-27

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Publication number Priority date Publication date Assignee Title
USD523403S1 (en) * 2004-09-09 2006-06-20 Kabushiki Kaisha Toshiba Substrate for a semiconductor device
KR101184375B1 (ko) * 2010-05-10 2012-09-20 매그나칩 반도체 유한회사 패드 영역의 크랙 발생을 방지하는 반도체 장치 및 그 제조 방법
USD648290S1 (en) * 2010-06-08 2011-11-08 Miyoshi Electronics Corporation Semiconductor device
USD674760S1 (en) * 2011-04-01 2013-01-22 Fuji Electric Co., Ltd. Semiconductor device
USD717254S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD769832S1 (en) * 2013-02-19 2016-10-25 Sony Corporation Semiconductor device
USD729250S1 (en) * 2013-07-30 2015-05-12 Samsung Electronics Co., Ltd. Semiconductor memory device
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DE112016004980B4 (de) * 2015-10-28 2024-05-08 Mitsubishi Electric Corporation Leistungs-halbleitereinrichtung
JP1561023S (ja) * 2016-03-24 2016-10-17
JP1563812S (ja) 2016-04-11 2016-11-21
JP6827776B2 (ja) * 2016-11-15 2021-02-10 ローム株式会社 半導体デバイス
KR20180070973A (ko) * 2016-12-19 2018-06-27 삼성전자주식회사 미세 패턴 형성 방법, 커패시터 및 그의 형성 방법, 반도체 소자 및 그의 제조 방법, 반도체 소자를 포함하는 전자 시스템
US10557191B2 (en) * 2017-01-31 2020-02-11 Sakai Display Products Corporation Method for producing deposition mask, deposition mask, and method for producing organic semiconductor device
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JP2019151922A (ja) * 2018-02-28 2019-09-12 株式会社Flosfia 積層体および半導体装置

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