JP1695980S - - Google Patents
Info
- Publication number
- JP1695980S JP1695980S JPD2021-4834F JP2021004834F JP1695980S JP 1695980 S JP1695980 S JP 1695980S JP 2021004834 F JP2021004834 F JP 2021004834F JP 1695980 S JP1695980 S JP 1695980S
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2021-4834F JP1695980S (ja) | 2021-03-09 | 2021-03-09 | |
| US29/806,373 USD993201S1 (en) | 2021-03-09 | 2021-09-02 | Semiconductor module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2021-4834F JP1695980S (ja) | 2021-03-09 | 2021-03-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1695980S true JP1695980S (ja) | 2021-09-27 |
Family
ID=77847548
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JPD2021-4834F Active JP1695980S (ja) | 2021-03-09 | 2021-03-09 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD993201S1 (ja) |
| JP (1) | JP1695980S (ja) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1021830S1 (en) * | 2021-03-16 | 2024-04-09 | Rohm Co., Ltd. | Semiconductor module |
| USD1022932S1 (en) * | 2021-03-16 | 2024-04-16 | Rohm Co., Ltd. | Semiconductor module |
| USD1021829S1 (en) * | 2021-03-16 | 2024-04-09 | Rohm Co., Ltd. | Semiconductor module |
| JP1716066S (ja) * | 2021-09-01 | 2022-05-27 | ヒューズ | |
| JP1741186S (ja) * | 2022-11-01 | 2023-04-06 | 半導体素子 | |
| JP1741185S (ja) * | 2022-11-01 | 2023-04-06 | 半導体素子 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017147272A (ja) * | 2016-02-15 | 2017-08-24 | ローム株式会社 | 半導体装置およびその製造方法、ならびに、半導体装置の製造に使用されるリードフレーム中間体 |
| JP6846117B2 (ja) * | 2016-04-12 | 2021-03-24 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
| JP6752639B2 (ja) * | 2016-05-02 | 2020-09-09 | ローム株式会社 | 半導体装置の製造方法 |
| JP1580899S (ja) | 2016-11-15 | 2017-07-10 | ||
| JP1577511S (ja) | 2016-11-15 | 2017-05-29 | ||
| JP7154818B2 (ja) * | 2018-05-10 | 2022-10-18 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
| JP7199921B2 (ja) * | 2018-11-07 | 2023-01-06 | ローム株式会社 | 半導体装置 |
| JP1665773S (ja) * | 2018-11-07 | 2020-08-11 | ||
| JP7147501B2 (ja) * | 2018-11-19 | 2022-10-05 | ローム株式会社 | 半導体装置の製造方法 |
| JP7319808B2 (ja) * | 2019-03-29 | 2023-08-02 | ローム株式会社 | 半導体装置および半導体パッケージ |
| JP7312604B2 (ja) * | 2019-05-13 | 2023-07-21 | ローム株式会社 | 半導体装置 |
| JP7526010B2 (ja) * | 2020-03-04 | 2024-07-31 | ローム株式会社 | 半導体装置 |
-
2021
- 2021-03-09 JP JPD2021-4834F patent/JP1695980S/ja active Active
- 2021-09-02 US US29/806,373 patent/USD993201S1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| USD993201S1 (en) | 2023-07-25 |