JP1695980S - - Google Patents

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Publication number
JP1695980S
JP1695980S JPD2021-4834F JP2021004834F JP1695980S JP 1695980 S JP1695980 S JP 1695980S JP 2021004834 F JP2021004834 F JP 2021004834F JP 1695980 S JP1695980 S JP 1695980S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2021-4834F
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2021-4834F priority Critical patent/JP1695980S/ja
Priority to US29/806,373 priority patent/USD993201S1/en
Application granted granted Critical
Publication of JP1695980S publication Critical patent/JP1695980S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2021-4834F 2021-03-09 2021-03-09 Active JP1695980S (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JPD2021-4834F JP1695980S (ja) 2021-03-09 2021-03-09
US29/806,373 USD993201S1 (en) 2021-03-09 2021-09-02 Semiconductor module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2021-4834F JP1695980S (ja) 2021-03-09 2021-03-09

Publications (1)

Publication Number Publication Date
JP1695980S true JP1695980S (ja) 2021-09-27

Family

ID=77847548

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2021-4834F Active JP1695980S (ja) 2021-03-09 2021-03-09

Country Status (2)

Country Link
US (1) USD993201S1 (ja)
JP (1) JP1695980S (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1021830S1 (en) * 2021-03-16 2024-04-09 Rohm Co., Ltd. Semiconductor module
USD1022932S1 (en) * 2021-03-16 2024-04-16 Rohm Co., Ltd. Semiconductor module
USD1021829S1 (en) * 2021-03-16 2024-04-09 Rohm Co., Ltd. Semiconductor module
JP1716066S (ja) * 2021-09-01 2022-05-27 ヒューズ
JP1741186S (ja) * 2022-11-01 2023-04-06 半導体素子
JP1741185S (ja) * 2022-11-01 2023-04-06 半導体素子

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017147272A (ja) * 2016-02-15 2017-08-24 ローム株式会社 半導体装置およびその製造方法、ならびに、半導体装置の製造に使用されるリードフレーム中間体
JP6846117B2 (ja) * 2016-04-12 2021-03-24 ローム株式会社 半導体装置および半導体装置の製造方法
JP6752639B2 (ja) * 2016-05-02 2020-09-09 ローム株式会社 半導体装置の製造方法
JP1580899S (ja) 2016-11-15 2017-07-10
JP1577511S (ja) 2016-11-15 2017-05-29
JP7154818B2 (ja) * 2018-05-10 2022-10-18 ローム株式会社 半導体装置および半導体装置の製造方法
JP7199921B2 (ja) * 2018-11-07 2023-01-06 ローム株式会社 半導体装置
JP1665773S (ja) * 2018-11-07 2020-08-11
JP7147501B2 (ja) * 2018-11-19 2022-10-05 ローム株式会社 半導体装置の製造方法
JP7319808B2 (ja) * 2019-03-29 2023-08-02 ローム株式会社 半導体装置および半導体パッケージ
JP7312604B2 (ja) * 2019-05-13 2023-07-21 ローム株式会社 半導体装置
JP7526010B2 (ja) * 2020-03-04 2024-07-31 ローム株式会社 半導体装置

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Publication number Publication date
USD993201S1 (en) 2023-07-25

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