JP1563812S - - Google Patents

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Publication number
JP1563812S
JP1563812S JPD2016-7974F JP2016007974F JP1563812S JP 1563812 S JP1563812 S JP 1563812S JP 2016007974 F JP2016007974 F JP 2016007974F JP 1563812 S JP1563812 S JP 1563812S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2016-7974F
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2016-7974F priority Critical patent/JP1563812S/ja
Priority to US29/579,204 priority patent/USD796459S1/en
Application granted granted Critical
Publication of JP1563812S publication Critical patent/JP1563812S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2016-7974F 2016-04-11 2016-04-11 Active JP1563812S (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JPD2016-7974F JP1563812S (ja) 2016-04-11 2016-04-11
US29/579,204 USD796459S1 (en) 2016-04-11 2016-09-28 Packaged semiconductor circuit module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2016-7974F JP1563812S (ja) 2016-04-11 2016-04-11

Publications (1)

Publication Number Publication Date
JP1563812S true JP1563812S (ja) 2016-11-21

Family

ID=57322106

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2016-7974F Active JP1563812S (ja) 2016-04-11 2016-04-11

Country Status (2)

Country Link
US (1) USD796459S1 (ja)
JP (1) JP1563812S (ja)

Cited By (2)

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USD900759S1 (en) 2018-11-07 2020-11-03 Rohm Co., Ltd. Semiconductor device
USD906273S1 (en) 2018-11-07 2020-12-29 Rohm Co., Ltd. Semiconductor device

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JP1586205S (ja) * 2017-01-26 2017-09-19
USD837752S1 (en) * 2017-01-31 2019-01-08 Dylan James Sievers Heatsink
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USD920265S1 (en) * 2019-09-29 2021-05-25 China Chippacking Technology Co., Ltd. Integrated circuit package
USD920266S1 (en) * 2019-09-29 2021-05-25 China Chippacking Technology Co., Ltd. Integrated circuit package
USD928722S1 (en) * 2019-10-02 2021-08-24 Johann Kok Electrical circuit component
USD929477S1 (en) * 2020-01-07 2021-08-31 Worthington Cylinders Corporation Electronic module for a tank lid
USD924952S1 (en) * 2020-01-07 2021-07-13 Worthington Cylinders Corporation Electronic module for a tank lid
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JP1680788S (ja) * 2020-07-31 2021-03-08
JP1682283S (ja) * 2020-07-31 2021-03-29
JP1725616S (ja) * 2022-02-25 2022-09-26 半導体モジュール

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD900759S1 (en) 2018-11-07 2020-11-03 Rohm Co., Ltd. Semiconductor device
USD906273S1 (en) 2018-11-07 2020-12-29 Rohm Co., Ltd. Semiconductor device

Also Published As

Publication number Publication date
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