USD928722S1 - Electrical circuit component - Google Patents
Electrical circuit component Download PDFInfo
- Publication number
- USD928722S1 USD928722S1 US29/707,956 US201929707956F USD928722S US D928722 S1 USD928722 S1 US D928722S1 US 201929707956 F US201929707956 F US 201929707956F US D928722 S USD928722 S US D928722S
- Authority
- US
- United States
- Prior art keywords
- electrical circuit
- circuit component
- present
- view
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Description
Claims (1)
- The ornamental design for an electrical circuit component, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/707,956 USD928722S1 (en) | 2019-10-02 | 2019-10-02 | Electrical circuit component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/707,956 USD928722S1 (en) | 2019-10-02 | 2019-10-02 | Electrical circuit component |
Publications (1)
Publication Number | Publication Date |
---|---|
USD928722S1 true USD928722S1 (en) | 2021-08-24 |
Family
ID=77333682
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/707,956 Active USD928722S1 (en) | 2019-10-02 | 2019-10-02 | Electrical circuit component |
Country Status (1)
Country | Link |
---|---|
US (1) | USD928722S1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD962881S1 (en) * | 2019-05-06 | 2022-09-06 | Lam Research Corporation | Semiconductor wafer processing apparatus |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD312618S (en) * | 1988-03-24 | 1990-12-04 | Rodolfo Ambros | Enclosure for an electrical circuit board |
US5585670A (en) * | 1995-09-05 | 1996-12-17 | Mitsubishi Electric Semiconductor Software Co. | Semiconductor device package |
USD383727S (en) * | 1996-05-20 | 1997-09-16 | Brk Brands, Inc. | Protective electrical outlet plug |
USD389808S (en) * | 1996-01-09 | 1998-01-27 | Fuji Electric Co., Ltd. | Hybrid integrated circuit for electric power control |
USD396450S (en) * | 1996-12-24 | 1998-07-28 | Fuji Electric Co., Ltd. | Hybrid integrated circuit for electric power control |
USD453746S1 (en) * | 2001-07-26 | 2002-02-19 | Taiyo Yuden Co., Ltd. | Hybrid integrated circuit device |
USD465463S1 (en) * | 2001-06-15 | 2002-11-12 | Taiyo Yuden Co., Ltd. | Hybrid integrated circuit device |
US20030042584A1 (en) * | 2001-09-05 | 2003-03-06 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device and method of manufacturing the same |
US6555899B1 (en) * | 1999-10-15 | 2003-04-29 | Amkor Technology, Inc. | Semiconductor package leadframe assembly and method of manufacture |
USD796459S1 (en) * | 2016-04-11 | 2017-09-05 | Rohm Co., Ltd. | Packaged semiconductor circuit module |
USD849692S1 (en) * | 2017-09-14 | 2019-05-28 | Elbee Pty Ltd. | Outlet cover |
USD886072S1 (en) * | 2017-06-30 | 2020-06-02 | Tenka Inc. | Circuit cube |
USD915303S1 (en) * | 2018-08-02 | 2021-04-06 | Lorenzo Young Davis | Charger cover |
-
2019
- 2019-10-02 US US29/707,956 patent/USD928722S1/en active Active
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD312618S (en) * | 1988-03-24 | 1990-12-04 | Rodolfo Ambros | Enclosure for an electrical circuit board |
US5585670A (en) * | 1995-09-05 | 1996-12-17 | Mitsubishi Electric Semiconductor Software Co. | Semiconductor device package |
USD389808S (en) * | 1996-01-09 | 1998-01-27 | Fuji Electric Co., Ltd. | Hybrid integrated circuit for electric power control |
USD383727S (en) * | 1996-05-20 | 1997-09-16 | Brk Brands, Inc. | Protective electrical outlet plug |
USD396450S (en) * | 1996-12-24 | 1998-07-28 | Fuji Electric Co., Ltd. | Hybrid integrated circuit for electric power control |
US6555899B1 (en) * | 1999-10-15 | 2003-04-29 | Amkor Technology, Inc. | Semiconductor package leadframe assembly and method of manufacture |
USD465463S1 (en) * | 2001-06-15 | 2002-11-12 | Taiyo Yuden Co., Ltd. | Hybrid integrated circuit device |
USD453746S1 (en) * | 2001-07-26 | 2002-02-19 | Taiyo Yuden Co., Ltd. | Hybrid integrated circuit device |
US20030042584A1 (en) * | 2001-09-05 | 2003-03-06 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device and method of manufacturing the same |
USD796459S1 (en) * | 2016-04-11 | 2017-09-05 | Rohm Co., Ltd. | Packaged semiconductor circuit module |
USD886072S1 (en) * | 2017-06-30 | 2020-06-02 | Tenka Inc. | Circuit cube |
USD849692S1 (en) * | 2017-09-14 | 2019-05-28 | Elbee Pty Ltd. | Outlet cover |
USD915303S1 (en) * | 2018-08-02 | 2021-04-06 | Lorenzo Young Davis | Charger cover |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD962881S1 (en) * | 2019-05-06 | 2022-09-06 | Lam Research Corporation | Semiconductor wafer processing apparatus |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY |
|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO SMALL (ORIGINAL EVENT CODE: SMAL); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY |