USD509810S1 - Molding structure of electric element - Google Patents

Molding structure of electric element Download PDF

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Publication number
USD509810S1
USD509810S1 US29/187,214 US18721403F USD509810S US D509810 S1 USD509810 S1 US D509810S1 US 18721403 F US18721403 F US 18721403F US D509810 S USD509810 S US D509810S
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US
United States
Prior art keywords
electric element
molding structure
molding
electric
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/187,214
Inventor
Han-Cheng Hsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Delta Electronics Inc
Original Assignee
Delta Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delta Electronics Inc filed Critical Delta Electronics Inc
Priority to US29/187,214 priority Critical patent/USD509810S1/en
Assigned to DELTA ELECTRONICS INC. reassignment DELTA ELECTRONICS INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HSU, HAN-CHENG
Application granted granted Critical
Publication of USD509810S1 publication Critical patent/USD509810S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view of a molding structure of electric element;
FIG. 2 is a right side elevational view thereof;
FIG. 3 is a top plane view thereof;
FIG. 4 is a front elevational view thereof;
FIG. 5 is a bottom plane view thereof;
FIG. 6 is a left side elevational view thereof; and,
FIG. 7 is a rear elevational view thereof.

Claims (1)

  1. The ornamental design for a molding structure of electric element, as shown and described herein.
US29/187,214 2003-07-30 2003-07-30 Molding structure of electric element Expired - Lifetime USD509810S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/187,214 USD509810S1 (en) 2003-07-30 2003-07-30 Molding structure of electric element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/187,214 USD509810S1 (en) 2003-07-30 2003-07-30 Molding structure of electric element

Publications (1)

Publication Number Publication Date
USD509810S1 true USD509810S1 (en) 2005-09-20

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Family Applications (1)

Application Number Title Priority Date Filing Date
US29/187,214 Expired - Lifetime USD509810S1 (en) 2003-07-30 2003-07-30 Molding structure of electric element

Country Status (1)

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US (1) USD509810S1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD1043594S1 (en) * 2022-11-01 2024-09-24 Rohm Co., Ltd. Semiconductor device
USD1043595S1 (en) * 2022-11-01 2024-09-24 Rohm Co., Ltd. Semiconductor device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD1043594S1 (en) * 2022-11-01 2024-09-24 Rohm Co., Ltd. Semiconductor device
USD1043595S1 (en) * 2022-11-01 2024-09-24 Rohm Co., Ltd. Semiconductor device

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