TWI799533B - 半導體製造裝置 - Google Patents
半導體製造裝置 Download PDFInfo
- Publication number
- TWI799533B TWI799533B TW108108400A TW108108400A TWI799533B TW I799533 B TWI799533 B TW I799533B TW 108108400 A TW108108400 A TW 108108400A TW 108108400 A TW108108400 A TW 108108400A TW I799533 B TWI799533 B TW I799533B
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor manufacturing
- manufacturing equipment
- equipment
- semiconductor
- manufacturing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018-055519 | 2018-03-23 | ||
JP2018055519 | 2018-03-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201941358A TW201941358A (zh) | 2019-10-16 |
TWI799533B true TWI799533B (zh) | 2023-04-21 |
Family
ID=67986106
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108108400A TWI799533B (zh) | 2018-03-23 | 2019-03-13 | 半導體製造裝置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US11257703B2 (zh) |
JP (1) | JP7026778B2 (zh) |
KR (1) | KR102433151B1 (zh) |
CN (1) | CN111868912B (zh) |
TW (1) | TWI799533B (zh) |
WO (1) | WO2019181525A1 (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11640920B2 (en) * | 2018-01-29 | 2023-05-02 | Kyocera Corporation | Sample holder |
US11610799B2 (en) * | 2020-09-18 | 2023-03-21 | Applied Materials, Inc. | Electrostatic chuck having a heating and chucking capabilities |
CN112984884B (zh) * | 2021-05-17 | 2022-05-20 | 北京建筑大学 | 一种适用于正温环境的造雪机造雪方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6151203A (en) * | 1998-12-14 | 2000-11-21 | Applied Materials, Inc. | Connectors for an electrostatic chuck and combination thereof |
JP2015228398A (ja) * | 2014-05-30 | 2015-12-17 | 日本特殊陶業株式会社 | 半導体製造装置用部品 |
JP2016143795A (ja) * | 2015-02-03 | 2016-08-08 | 日本特殊陶業株式会社 | 静電チャック |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2592308B2 (ja) * | 1988-09-30 | 1997-03-19 | 株式会社日立製作所 | 半導体パッケージ及びそれを用いたコンピュータ |
JP3658029B2 (ja) * | 1994-02-21 | 2005-06-08 | 株式会社ルネサステクノロジ | 接続装置およびその製造方法 |
NZ332273A (en) | 1996-04-29 | 2000-04-28 | Procter & Gamble | Forced air convection oven process for finishing french fries |
JP2007258615A (ja) * | 2006-03-24 | 2007-10-04 | Ngk Insulators Ltd | 静電チャック |
JP4909704B2 (ja) * | 2006-10-13 | 2012-04-04 | 日本特殊陶業株式会社 | 静電チャック装置 |
JP2010103321A (ja) * | 2008-10-24 | 2010-05-06 | Ngk Spark Plug Co Ltd | 静電チャック装置 |
JP5795974B2 (ja) * | 2012-03-12 | 2015-10-14 | 日本碍子株式会社 | 半導体製造装置の製法 |
JP3181603U (ja) | 2012-12-03 | 2013-02-14 | 日本碍子株式会社 | 半導体製造装置 |
JP6428456B2 (ja) * | 2014-04-09 | 2018-11-28 | 住友大阪セメント株式会社 | 静電チャック装置 |
US9504195B2 (en) * | 2014-05-16 | 2016-11-22 | Tyco Electronics Corporation | Cover assemblies, kits and methods for covering electrical cables and connections |
JP6517754B2 (ja) * | 2016-07-12 | 2019-05-22 | 日本碍子株式会社 | 配線基板接合体 |
-
2019
- 2019-03-07 CN CN201980019242.6A patent/CN111868912B/zh active Active
- 2019-03-07 WO PCT/JP2019/009028 patent/WO2019181525A1/ja active Application Filing
- 2019-03-07 JP JP2020508179A patent/JP7026778B2/ja active Active
- 2019-03-07 KR KR1020207026712A patent/KR102433151B1/ko active IP Right Grant
- 2019-03-13 TW TW108108400A patent/TWI799533B/zh active
-
2020
- 2020-09-16 US US17/022,396 patent/US11257703B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6151203A (en) * | 1998-12-14 | 2000-11-21 | Applied Materials, Inc. | Connectors for an electrostatic chuck and combination thereof |
JP2015228398A (ja) * | 2014-05-30 | 2015-12-17 | 日本特殊陶業株式会社 | 半導体製造装置用部品 |
JP2016143795A (ja) * | 2015-02-03 | 2016-08-08 | 日本特殊陶業株式会社 | 静電チャック |
Also Published As
Publication number | Publication date |
---|---|
CN111868912B (zh) | 2023-11-03 |
US20200411357A1 (en) | 2020-12-31 |
TW201941358A (zh) | 2019-10-16 |
JPWO2019181525A1 (ja) | 2021-02-25 |
KR102433151B1 (ko) | 2022-08-16 |
US11257703B2 (en) | 2022-02-22 |
WO2019181525A1 (ja) | 2019-09-26 |
KR20200121350A (ko) | 2020-10-23 |
JP7026778B2 (ja) | 2022-02-28 |
CN111868912A (zh) | 2020-10-30 |
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