KR940013306A - 편평구조방식으로 된 전자모쥴 - Google Patents

편평구조방식으로 된 전자모쥴 Download PDF

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KR940013306A
KR940013306A KR1019930025433A KR930025433A KR940013306A KR 940013306 A KR940013306 A KR 940013306A KR 1019930025433 A KR1019930025433 A KR 1019930025433A KR 930025433 A KR930025433 A KR 930025433A KR 940013306 A KR940013306 A KR 940013306A
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chip
electronic module
casing
island
flat
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KR1019930025433A
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KR0174761B1 (ko
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닉클라우스 칼
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닉클라우스 칼
에섹 젬팩 에쓰.에이.
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Abstract

극단적인 편평구조방식에도 불구하고 전자모쥴(M)의 합성수지케이싱(10)내에 매설된 반도체-칩(1)의 파손경향은 현저하게 감소될 것이다. 이 칩은 시스템 반송체(20)의 칩-아일랜드위에 강판구조(리드프레임)의 형태로 조립되어 있다.
-칩에 의하여 부분적으로 카버되어질 수 있는 -외측접촉부(21)는 모쥴케이싱(10)의 하나의 편평측면에 하나의 평면에 놓여있다. 시스템 반송체의 강판에서 불가핀한 췌약선을 나타내며 칩-아일랜드(22)를 경계하고 있는 간극(22)은 정방형의 또는 장방형의 칩(1)의 모서리에 대하여 사선방향으로 (바람직하게는 45°하에서)지나가며 그리고 이로서 칩 재료중의 단결정구조에 의하여 주어지며 그리고 칩-모서리에 평행하게 지나는 가능한 파단선에 대하여 역시 사선방향으로 되어 있다.
강판중에 간극(23)으로부터 출발하는 또다른 간극(24)은 목적에 맞게 마찬가지로 칩-카아드에 사선방향으로 지난다. 또다른 조처들을 시스템 반송체(20)의 부분들과 모쥴 케이싱(10)사이의 기계적인 연결에 관한 것이며 그리고 또 반송체 몸체에의 주입시에 둘러싸는 합성수지재료와 전체의 모쥴(M)의 연결(예를 들면 칩 카아드-제조)에 관한 것이다.

Description

편평구조방식으로 된 전자모쥴
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 실시예 1에 따르는 시스템 반송체의 실시예를 나타내며,
제2도 및 제3도는 제1도에 의한 시스템 반송체로부터 출발하여 예를 들면 전자모쥴의 연속하는 제조단계의 부분도를 보이며,
제6도는 실시예 1에 따르는 전자모쥴의 사시도이다.

Claims (17)

  1. 합성수지케이싱(10)의 하나의 편평측(12)에 있는 하나의 평면에 놓여있으며 편평한 강판구조의 형상으로 된 시스템 반송체(20,20′)로부터 형성되어 있는 외측접촉부(21)를 가지며, 그리고 칩-아일랜드(22)를 거쳐서 시스템 반송체(20,20′)의 하나의 편평측상에 조립되어 있으며 케이싱(10)의 합성수지재료에 의하여 주위에 압축되며 그리고 외측 접촉부들(21)과 연결되어 있는 반도체-칩(1)을 가지는 편평구조방식으로 된 전자 모쥴에 있어서, 적어도 칩-아일랜드(22)를 제한하고 있으며, 이것을 외측접촉부(21)로부터 분리하고 있는, 시스템 반송체(20,20′)내에 있는 간극(23)이 정사각형의 또는 구형의 칩(1)의 모서리에 대하여 사면으로, 바람직하게는 약 45°로 지나고 있는 것을 특징으로 하는 전자모쥴.
  2. 칩-아일랜드(22)의 양측에 배열되어 있으며 외측 접촉부(21)의 평행한 2개의 열을 가지는 제1항에 있어서, 칩-아일랜드(22)는 대체로 정사각형이며, 그리고 상술한 열에 대하여 수직이거나 내지 평행으로 된 대각선들을 가지고 배열되어 있는 것을 특징으로 하는 전자모쥴.
  3. 제1항 또는 제2항에 있어서, 칩-아일랜드(22)를 경계하고 있는 상술한 간극(23)으로부터 출발하고 있으며 외측접촉부(21)를 분리하고 있는 간극(24)이 적어도 부분적으로 금이 새겨진 선들을 따라서 지나고 있는 것을 특징으로 하는 전자모쥴.
  4. 제1항에 있어서, 칩-아일랜드(22)와 인접하여 있는 범위에 있는 외측접촉부(21), 그리고 칩-아일랜드(22)와 연결되어 있는 시스템 반송체(20)의 범위(25)는 통공들(31)을 가지며 이 통공들은 합성수지케이싱(10)의 압축재료로서 채워져 있으며, 여기서 통공의 횡단면에 있는 압축재료는 접촉부(21)의 외측과 결합하여 놓여있는 것을 특징으로 하는 전자모쥴.
  5. 제1항에 있어서, 반도체-칩(1)은 절연되는 접착박지(2,2′)을 사용하여 칩-아일랜드(22)위에 장착되어 있는 것을 특징으로 하는 전자모쥴.
  6. 제5항에 있어서, 반도체-칩(1)이 칩-아일랜드(22)를 측방으로 지나서 돌출하며 절연하는 접착박지(2,2′)를 거쳐서 역시 외측 접촉부(21)의 인접한 범위에 부착되는 것을 특징으로 하는 전자모쥴.
  7. 제5항에 있어서, 접착박지(2′)는 통과하면서 역시 외측접촉부(21)위에 뻗쳐있으며 그리고 이것과는 대체로 아주 편평하게 결합되어 있는 것을 특징으로 하는 전자모쥴.
  8. 제5항 내지 제7항중의 어느 하나의 항에 있어서, 접착박지(2,2′) 및/또는 그의 접착재료층은 작은 전기전도도를 가지는 것을 특징으로 하는 전자모쥴.
  9. 합성수지 케이싱(10)과 중심이 맞추어진 편평한 합성수지-대상물에로의 주입을 하게 되어 있는 전항들중의 어느 하나의 항에 의한 전자모쥴에 있어서, 시스템 반송체(20,20′)는 케이싱 가장자리의 외측에 놓여있는 돌출부들(26,27,26′,34)을 형성하며, 이 돌기부들은 케이싱의 반대편에 놓여있는 편평측면(11)에의 방향으로 굽어져 있는 것을 특징으로 하는 전자모쥴.
  10. 제9항에 있어서, 상술한 돌출부들(26,27,26′,34)의 적어도 일부는 통공들(29,17) 또는 요입부(29′)를 굴곡부의 범위에 가지는 것을 특징으로 하는 전자모쥴.
  11. 제8항 또는 제10항에 있어서, 접착박지(2′)는 역시 돌출부들(34)의 적어도 일부를 거쳐서 이들의 통공들(17)의 범위에서 뻗쳐있는 것을 특징으로 하는 전자모쥴.
  12. 제9항에 있어서, 상기한 돌출부들(26,26′,27)의 적어도 일부분은 외측 접촉부들(21)과 기계적으로 연결되어 있는 것을 특징으로 하는 전자모쥴.
  13. 제9항에 있어서, 케이싱(10)에 관하여 서로 반대편에 놓여있는 2개의 돌출부들(27)은 이들의 단부의 범위에 중심조정개구들(36)이 형성되어 있으며, 이 개구들은 모쥴을 수용하고 있는 다이캐스팅형(44,45)의 중심조정 기구들(46)의 파지를 위한 것으로 정해져 있는 것을 특징으로 하는 전자모쥴.
  14. 안에 전자모쥴(M)이 제9항 내지 제13항중의 어느 하나의 항에 의하여 주입되어지는 특히 크레디트카아드 형상으로 된 편평한 합성수지대상물에 있어서, 이 대상물의 주입재료의 두께는 전자모쥴의 두께와 동일한 것을 특징으로 하는 편평한 합성수지 대상물.
  15. 전자모쥴의 외측접촉부(21)는 합성수지케이싱(10)과 연결되어 있으며 그리고 편평한 강판구조의 형상으로 된 시스템 반송체(20,20′)로부터 형성되어 있으며, 여기서 이 시스템 반송체(20,20′)상에는 케이싱(10)에 의하여 둘러쌓여진 반도체-칩(1)이 조립되어 있는, 편평구조방식으로 된 전자모쥴에 있어서, 시스템 반송체(20,20′)는 조립자동기계와의 공동작용을 위하여 정하여진, 합성수지케이싱(10)의 외부에 있는 돌출부들(27)을 가지며, 이 돌출부들은 파지구윤곽체 및/또는 위치조정윤곽체(35,36)를 갖추고 있으며 이 윤곽체들은 모쥴(M)의 외측윤곽(21)에 대하여 정확한 위치관계가 성립하는 것을 특징으로 하는 전자모쥴.
  16. 제15항에 있어서, 편평한 합성수지케이싱(10)의 2개의 서로 반대편에 놓여있는 가장자리마다 떨어져 있는 2개의 돌출부(27)가 존재하는 것을 특징으로 하는 전자모쥴.
  17. 제15항 또는 제16항에 있어서, 돌출부들(27)의 외측접촉부(21)중의 하나로부터 각각 나오며 합성수지케이싱(10)의 외측에서 케이싱의 두께에 걸쳐서 절곡되어 있으며 그리고 이들의 단부를 가지고는 외측 접촉부들(21)의 반대측에 놓여있는 하나의 케이싱-편평측(11)의 평면으로 도달하는 것을 특징으로 하는 전자모쥴.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019930025433A 1992-11-27 1993-11-26 초박형 구조로된 전자모쥴 KR0174761B1 (ko)

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DE59310040D1 (de) 2000-06-15
MY111079A (en) 1999-08-30
JP2515086B2 (ja) 1996-07-10
IL107696A (en) 1998-02-22
CH686325A5 (de) 1996-02-29

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