KR940013306A - 편평구조방식으로 된 전자모쥴 - Google Patents
편평구조방식으로 된 전자모쥴 Download PDFInfo
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- KR940013306A KR940013306A KR1019930025433A KR930025433A KR940013306A KR 940013306 A KR940013306 A KR 940013306A KR 1019930025433 A KR1019930025433 A KR 1019930025433A KR 930025433 A KR930025433 A KR 930025433A KR 940013306 A KR940013306 A KR 940013306A
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- 239000000463 material Substances 0.000 claims abstract 6
- 229920003002 synthetic resin Polymers 0.000 claims 9
- 239000000057 synthetic resin Substances 0.000 claims 9
- 239000000969 carrier Substances 0.000 claims 7
- 239000000853 adhesive Substances 0.000 claims 6
- 230000001070 adhesive effect Effects 0.000 claims 6
- 239000011888 foil Substances 0.000 claims 5
- 239000004065 semiconductor Substances 0.000 claims 5
- 229910000831 Steel Inorganic materials 0.000 claims 2
- 239000010959 steel Substances 0.000 claims 2
- 238000004512 die casting Methods 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 238000007373 indentation Methods 0.000 claims 1
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 230000007246 mechanism Effects 0.000 claims 1
- 229920003023 plastic Polymers 0.000 abstract 1
- 239000004033 plastic Substances 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- G—PHYSICS
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- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
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Abstract
극단적인 편평구조방식에도 불구하고 전자모쥴(M)의 합성수지케이싱(10)내에 매설된 반도체-칩(1)의 파손경향은 현저하게 감소될 것이다. 이 칩은 시스템 반송체(20)의 칩-아일랜드위에 강판구조(리드프레임)의 형태로 조립되어 있다.
-칩에 의하여 부분적으로 카버되어질 수 있는 -외측접촉부(21)는 모쥴케이싱(10)의 하나의 편평측면에 하나의 평면에 놓여있다. 시스템 반송체의 강판에서 불가핀한 췌약선을 나타내며 칩-아일랜드(22)를 경계하고 있는 간극(22)은 정방형의 또는 장방형의 칩(1)의 모서리에 대하여 사선방향으로 (바람직하게는 45°하에서)지나가며 그리고 이로서 칩 재료중의 단결정구조에 의하여 주어지며 그리고 칩-모서리에 평행하게 지나는 가능한 파단선에 대하여 역시 사선방향으로 되어 있다.
강판중에 간극(23)으로부터 출발하는 또다른 간극(24)은 목적에 맞게 마찬가지로 칩-카아드에 사선방향으로 지난다. 또다른 조처들을 시스템 반송체(20)의 부분들과 모쥴 케이싱(10)사이의 기계적인 연결에 관한 것이며 그리고 또 반송체 몸체에의 주입시에 둘러싸는 합성수지재료와 전체의 모쥴(M)의 연결(예를 들면 칩 카아드-제조)에 관한 것이다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 실시예 1에 따르는 시스템 반송체의 실시예를 나타내며,
제2도 및 제3도는 제1도에 의한 시스템 반송체로부터 출발하여 예를 들면 전자모쥴의 연속하는 제조단계의 부분도를 보이며,
제6도는 실시예 1에 따르는 전자모쥴의 사시도이다.
Claims (17)
- 합성수지케이싱(10)의 하나의 편평측(12)에 있는 하나의 평면에 놓여있으며 편평한 강판구조의 형상으로 된 시스템 반송체(20,20′)로부터 형성되어 있는 외측접촉부(21)를 가지며, 그리고 칩-아일랜드(22)를 거쳐서 시스템 반송체(20,20′)의 하나의 편평측상에 조립되어 있으며 케이싱(10)의 합성수지재료에 의하여 주위에 압축되며 그리고 외측 접촉부들(21)과 연결되어 있는 반도체-칩(1)을 가지는 편평구조방식으로 된 전자 모쥴에 있어서, 적어도 칩-아일랜드(22)를 제한하고 있으며, 이것을 외측접촉부(21)로부터 분리하고 있는, 시스템 반송체(20,20′)내에 있는 간극(23)이 정사각형의 또는 구형의 칩(1)의 모서리에 대하여 사면으로, 바람직하게는 약 45°로 지나고 있는 것을 특징으로 하는 전자모쥴.
- 칩-아일랜드(22)의 양측에 배열되어 있으며 외측 접촉부(21)의 평행한 2개의 열을 가지는 제1항에 있어서, 칩-아일랜드(22)는 대체로 정사각형이며, 그리고 상술한 열에 대하여 수직이거나 내지 평행으로 된 대각선들을 가지고 배열되어 있는 것을 특징으로 하는 전자모쥴.
- 제1항 또는 제2항에 있어서, 칩-아일랜드(22)를 경계하고 있는 상술한 간극(23)으로부터 출발하고 있으며 외측접촉부(21)를 분리하고 있는 간극(24)이 적어도 부분적으로 금이 새겨진 선들을 따라서 지나고 있는 것을 특징으로 하는 전자모쥴.
- 제1항에 있어서, 칩-아일랜드(22)와 인접하여 있는 범위에 있는 외측접촉부(21), 그리고 칩-아일랜드(22)와 연결되어 있는 시스템 반송체(20)의 범위(25)는 통공들(31)을 가지며 이 통공들은 합성수지케이싱(10)의 압축재료로서 채워져 있으며, 여기서 통공의 횡단면에 있는 압축재료는 접촉부(21)의 외측과 결합하여 놓여있는 것을 특징으로 하는 전자모쥴.
- 제1항에 있어서, 반도체-칩(1)은 절연되는 접착박지(2,2′)을 사용하여 칩-아일랜드(22)위에 장착되어 있는 것을 특징으로 하는 전자모쥴.
- 제5항에 있어서, 반도체-칩(1)이 칩-아일랜드(22)를 측방으로 지나서 돌출하며 절연하는 접착박지(2,2′)를 거쳐서 역시 외측 접촉부(21)의 인접한 범위에 부착되는 것을 특징으로 하는 전자모쥴.
- 제5항에 있어서, 접착박지(2′)는 통과하면서 역시 외측접촉부(21)위에 뻗쳐있으며 그리고 이것과는 대체로 아주 편평하게 결합되어 있는 것을 특징으로 하는 전자모쥴.
- 제5항 내지 제7항중의 어느 하나의 항에 있어서, 접착박지(2,2′) 및/또는 그의 접착재료층은 작은 전기전도도를 가지는 것을 특징으로 하는 전자모쥴.
- 합성수지 케이싱(10)과 중심이 맞추어진 편평한 합성수지-대상물에로의 주입을 하게 되어 있는 전항들중의 어느 하나의 항에 의한 전자모쥴에 있어서, 시스템 반송체(20,20′)는 케이싱 가장자리의 외측에 놓여있는 돌출부들(26,27,26′,34)을 형성하며, 이 돌기부들은 케이싱의 반대편에 놓여있는 편평측면(11)에의 방향으로 굽어져 있는 것을 특징으로 하는 전자모쥴.
- 제9항에 있어서, 상술한 돌출부들(26,27,26′,34)의 적어도 일부는 통공들(29,17) 또는 요입부(29′)를 굴곡부의 범위에 가지는 것을 특징으로 하는 전자모쥴.
- 제8항 또는 제10항에 있어서, 접착박지(2′)는 역시 돌출부들(34)의 적어도 일부를 거쳐서 이들의 통공들(17)의 범위에서 뻗쳐있는 것을 특징으로 하는 전자모쥴.
- 제9항에 있어서, 상기한 돌출부들(26,26′,27)의 적어도 일부분은 외측 접촉부들(21)과 기계적으로 연결되어 있는 것을 특징으로 하는 전자모쥴.
- 제9항에 있어서, 케이싱(10)에 관하여 서로 반대편에 놓여있는 2개의 돌출부들(27)은 이들의 단부의 범위에 중심조정개구들(36)이 형성되어 있으며, 이 개구들은 모쥴을 수용하고 있는 다이캐스팅형(44,45)의 중심조정 기구들(46)의 파지를 위한 것으로 정해져 있는 것을 특징으로 하는 전자모쥴.
- 안에 전자모쥴(M)이 제9항 내지 제13항중의 어느 하나의 항에 의하여 주입되어지는 특히 크레디트카아드 형상으로 된 편평한 합성수지대상물에 있어서, 이 대상물의 주입재료의 두께는 전자모쥴의 두께와 동일한 것을 특징으로 하는 편평한 합성수지 대상물.
- 전자모쥴의 외측접촉부(21)는 합성수지케이싱(10)과 연결되어 있으며 그리고 편평한 강판구조의 형상으로 된 시스템 반송체(20,20′)로부터 형성되어 있으며, 여기서 이 시스템 반송체(20,20′)상에는 케이싱(10)에 의하여 둘러쌓여진 반도체-칩(1)이 조립되어 있는, 편평구조방식으로 된 전자모쥴에 있어서, 시스템 반송체(20,20′)는 조립자동기계와의 공동작용을 위하여 정하여진, 합성수지케이싱(10)의 외부에 있는 돌출부들(27)을 가지며, 이 돌출부들은 파지구윤곽체 및/또는 위치조정윤곽체(35,36)를 갖추고 있으며 이 윤곽체들은 모쥴(M)의 외측윤곽(21)에 대하여 정확한 위치관계가 성립하는 것을 특징으로 하는 전자모쥴.
- 제15항에 있어서, 편평한 합성수지케이싱(10)의 2개의 서로 반대편에 놓여있는 가장자리마다 떨어져 있는 2개의 돌출부(27)가 존재하는 것을 특징으로 하는 전자모쥴.
- 제15항 또는 제16항에 있어서, 돌출부들(27)의 외측접촉부(21)중의 하나로부터 각각 나오며 합성수지케이싱(10)의 외측에서 케이싱의 두께에 걸쳐서 절곡되어 있으며 그리고 이들의 단부를 가지고는 외측 접촉부들(21)의 반대측에 놓여있는 하나의 케이싱-편평측(11)의 평면으로 도달하는 것을 특징으로 하는 전자모쥴.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH363392A CH686325A5 (de) | 1992-11-27 | 1992-11-27 | Elektronikmodul und Chip-Karte. |
CH03633/92-9 | 1992-11-27 |
Publications (2)
Publication Number | Publication Date |
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KR940013306A true KR940013306A (ko) | 1994-06-25 |
KR0174761B1 KR0174761B1 (ko) | 1999-02-01 |
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Country Status (11)
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EP (4) | EP0599194A1 (ko) |
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AU (2) | AU671868B2 (ko) |
CA (1) | CA2109761C (ko) |
CH (1) | CH686325A5 (ko) |
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Families Citing this family (47)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3383398B2 (ja) * | 1994-03-22 | 2003-03-04 | 株式会社東芝 | 半導体パッケージ |
DE4443767A1 (de) * | 1994-12-08 | 1996-06-13 | Giesecke & Devrient Gmbh | Elektronisches Modul und Datenträger mit elektrischem Modul |
DE19512191C2 (de) | 1995-03-31 | 2000-03-09 | Siemens Ag | Kartenförmiger Datenträger und Leadframe zur Verwendung in einem solchen Datenträger |
KR0170316B1 (ko) * | 1995-07-13 | 1999-02-01 | 김광호 | 반도체 장치의 패드 설계 방법 |
JPH0964240A (ja) | 1995-08-25 | 1997-03-07 | Toshiba Corp | 半導体装置および半導体装置の製造方法 |
DE19607212C1 (de) * | 1996-02-26 | 1997-04-10 | Richard Herbst | Verbundkörper, Verfahren und Kunststoff-Spritzgießwerkzeug zur Herstellung eines solchen |
RU2156521C2 (ru) * | 1996-05-17 | 2000-09-20 | Сименс Акциенгезелльшафт | Несущий элемент для полупроводниковой микросхемы |
JPH09327990A (ja) * | 1996-06-11 | 1997-12-22 | Toshiba Corp | カード型記憶装置 |
US5796586A (en) * | 1996-08-26 | 1998-08-18 | National Semiconductor, Inc. | Substrate board having an anti-adhesive solder mask |
US5796570A (en) * | 1996-09-19 | 1998-08-18 | National Semiconductor Corporation | Electrostatic discharge protection package |
US5773876A (en) * | 1996-11-06 | 1998-06-30 | National Semiconductor Corporation | Lead frame with electrostatic discharge protection |
US5907769A (en) | 1996-12-30 | 1999-05-25 | Micron Technology, Inc. | Leads under chip in conventional IC package |
DE19721281C2 (de) * | 1997-05-21 | 1999-04-01 | Ods Landis & Gyr Gmbh & Co Kg | Chipmodul für eine Chipkarte |
TW330337B (en) * | 1997-05-23 | 1998-04-21 | Siliconware Precision Industries Co Ltd | Semiconductor package with detached die pad |
EP0938060A1 (de) * | 1998-02-20 | 1999-08-25 | ESEC Management SA | Verfahren zur Herstellung eines Chipobjektes und Chipobjekt |
JP2002500794A (ja) * | 1998-03-27 | 2002-01-08 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 金属リードフレームを主体とする差し込みモジュールを有するデータ媒体 |
EP1068640A1 (de) * | 1998-04-06 | 2001-01-17 | Infineon Technologies AG | Verwendung der baulichen beschaffenheit eines elektronischen bauteils als referenz bei der positionierung des bauteils |
DE19816066A1 (de) * | 1998-04-09 | 1999-10-14 | Philips Patentverwaltung | Folie als Träger von integrierten Schaltungen |
FR2781068B1 (fr) * | 1998-07-07 | 2000-10-13 | Rue Cartes Et Systemes De | Procede de fabrication d'une carte a microcircuit permettant de limiter les contraintes mecaniques transmises a celui-ci et carte ainsi obtenue |
EP1118111A1 (de) * | 1998-09-29 | 2001-07-25 | Tyco Electronics Logistics AG | Verfahren zum eingiessen eines flachen elektronikmoduls in einen kunststoffkartenkörper durch thermoplastisches spritzgiessen |
EP1009023A1 (de) * | 1998-12-09 | 2000-06-14 | ESEC Management SA | Verfahren zur Verbindung von zwei Leiterstrukturen und Kunststoffobjekt |
US6179210B1 (en) * | 1999-02-09 | 2001-01-30 | Motorola, Inc. | Punch out pattern for hot melt tape used in smartcards |
DE19922473A1 (de) * | 1999-05-19 | 2000-11-30 | Giesecke & Devrient Gmbh | Chipträgermodul |
JP3822768B2 (ja) * | 1999-12-03 | 2006-09-20 | 株式会社ルネサステクノロジ | Icカードの製造方法 |
EP1119047A1 (de) * | 2000-01-18 | 2001-07-25 | Infineon Technologies AG | Flächiger Träger für ein Chipmodul und Herstellungsverfahren für ein Chipmodul |
US6538304B1 (en) * | 2000-11-16 | 2003-03-25 | Texas Instruments Incorporated | Corner bonding to lead frame |
DE10111028A1 (de) * | 2001-03-07 | 2002-09-19 | Infineon Technologies Ag | Chipkartenmodul |
DE10158770B4 (de) * | 2001-11-29 | 2006-08-03 | Infineon Technologies Ag | Leiterrahmen und Bauelement mit einem Leiterrahmen |
EP1629690B1 (en) * | 2003-05-09 | 2008-04-02 | Widex A/S | A method for manufacturing a carrier element for a hearing aid and a carrier element for a hearing aid |
DE10333840B4 (de) * | 2003-07-24 | 2006-12-28 | Infineon Technologies Ag | Halbleiterbauteil mit einem Kunststoffgehäuse, das eine Umverdrahrungsstruktur aufweist und Verfahren zu deren Herstellung |
DE202004003554U1 (de) | 2004-03-04 | 2004-06-03 | Novacard Informationssysteme Gmbh | Chipkarte |
US7495926B2 (en) * | 2004-10-05 | 2009-02-24 | Sony Ericsson Mobile Communications Ab | Interface module for electronic devices |
US7714415B2 (en) * | 2006-04-28 | 2010-05-11 | Intersil Americas, Inc. | Leadframe structures for semiconductor packages |
DE102007038318A1 (de) * | 2007-08-14 | 2009-02-19 | Giesecke & Devrient Gmbh | Hochgeprägter kartenförmiger Datenträger |
JP2009253153A (ja) * | 2008-04-09 | 2009-10-29 | Asmo Co Ltd | 樹脂封止型半導体装置 |
JP5649277B2 (ja) | 2008-12-22 | 2015-01-07 | ローム株式会社 | 半導体装置 |
US9293435B2 (en) | 2009-09-11 | 2016-03-22 | Rohm Co., Ltd. | Semiconductor device and production method therefor |
EP2369904A1 (fr) * | 2010-03-16 | 2011-09-28 | Gemalto SA | Module électronique à contacts latéraux, dispositif le comportant et procédé de fabrication d'un tel module |
US8649820B2 (en) | 2011-11-07 | 2014-02-11 | Blackberry Limited | Universal integrated circuit card apparatus and related methods |
USD703208S1 (en) | 2012-04-13 | 2014-04-22 | Blackberry Limited | UICC apparatus |
US8936199B2 (en) | 2012-04-13 | 2015-01-20 | Blackberry Limited | UICC apparatus and related methods |
USD701864S1 (en) | 2012-04-23 | 2014-04-01 | Blackberry Limited | UICC apparatus |
CN103928431B (zh) * | 2012-10-31 | 2017-03-01 | 矽力杰半导体技术(杭州)有限公司 | 一种倒装封装装置 |
EP2731058A1 (fr) * | 2012-11-13 | 2014-05-14 | Gemalto SA | Procédé de fabrication d'un module à puce électronique anti-charge électrostatique |
US11416728B2 (en) | 2019-08-15 | 2022-08-16 | Federal Card Services, LLC | Durable dual interface metal transaction cards |
US11455507B2 (en) | 2019-10-13 | 2022-09-27 | Federal Card Services, LLC | Metal transaction cards containing ceramic having selected coloring and texture |
WO2022227537A1 (zh) * | 2021-04-29 | 2022-11-03 | 上海凯虹科技电子有限公司 | 半导体器件及引线框架 |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1383297A (en) * | 1972-02-23 | 1974-02-12 | Plessey Co Ltd | Electrical integrated circuit package |
US4215360A (en) * | 1978-11-09 | 1980-07-29 | General Motors Corporation | Power semiconductor device assembly having a lead frame with interlock members |
DE3051195C2 (de) * | 1980-08-05 | 1997-08-28 | Gao Ges Automation Org | Trägerelement zum Einbau in Ausweiskarten |
DE3130213A1 (de) * | 1981-07-30 | 1983-02-17 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur herstellung einer tragbaren karte zur informationsverarbeitung |
JPS60747A (ja) * | 1983-06-17 | 1985-01-05 | Hitachi Ltd | レジンモ−ルドicパツケ−ジ |
JPS60171733A (ja) * | 1984-02-17 | 1985-09-05 | Hitachi Micro Comput Eng Ltd | 半導体装置 |
JPS615530A (ja) * | 1984-06-20 | 1986-01-11 | Hitachi Ltd | 半導体装置 |
FR2579798B1 (fr) * | 1985-04-02 | 1990-09-28 | Ebauchesfabrik Eta Ag | Procede de fabrication de modules electroniques pour cartes a microcircuits et modules obtenus selon ce procede |
JPS61234129A (ja) * | 1985-04-09 | 1986-10-18 | Yaesu Musen Co Ltd | トランシ−バの制御方式 |
JPS61269345A (ja) * | 1985-05-24 | 1986-11-28 | Hitachi Ltd | 半導体装置 |
FR2584862B1 (fr) * | 1985-07-12 | 1988-05-20 | Eurotechnique Sa | Procede de fabrication en continu de micromodules pour cartes contenant des composants, bande continue de micromodules et micromodules realises selon un tel procede |
JP2505172B2 (ja) * | 1986-09-30 | 1996-06-05 | 日立マクセル株式会社 | Icカ−ド |
CA1290676C (en) * | 1987-03-30 | 1991-10-15 | William Frank Graham | Method for bonding integrated circuit chips |
US5150193A (en) * | 1987-05-27 | 1992-09-22 | Hitachi, Ltd. | Resin-encapsulated semiconductor device having a particular mounting structure |
JP2696532B2 (ja) * | 1988-08-19 | 1998-01-14 | 株式会社日立製作所 | 半導体装置およびその製造方法 |
DE3809005A1 (de) * | 1988-03-17 | 1989-09-28 | Hitachi Semiconductor Europ Gm | Chipmodul und seine herstellung und verwendung |
JPH01270338A (ja) * | 1988-04-22 | 1989-10-27 | Mitsubishi Electric Corp | モールド封止半導体装置 |
US4937656A (en) * | 1988-04-22 | 1990-06-26 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
EP0339763A3 (en) * | 1988-04-28 | 1990-04-25 | Citizen Watch Co. Ltd. | Ic card |
JPH02144658A (ja) * | 1988-11-28 | 1990-06-04 | Hitachi Ltd | 文字の配置制御方式 |
FR2645680B1 (fr) * | 1989-04-07 | 1994-04-29 | Thomson Microelectronics Sa Sg | Encapsulation de modules electroniques et procede de fabrication |
JPH0726139Y2 (ja) * | 1989-04-17 | 1995-06-14 | リズム時計工業株式会社 | Icカード |
FR2659157B2 (fr) | 1989-05-26 | 1994-09-30 | Lemaire Gerard | Procede de fabrication d'une carte dite carte a puce, et carte obtenue par ce procede. |
DE3924439A1 (de) * | 1989-07-24 | 1991-04-18 | Edgar Schneider | Traegerelement mit wenigstens einem integrierten schaltkreis, insbesondere zum einbau in chip-karten, sowie verfahren zur herstellung dieser traegerelemente |
JPH0373560A (ja) * | 1989-08-14 | 1991-03-28 | Nec Corp | 半導体装置 |
JPH0793400B2 (ja) * | 1990-03-06 | 1995-10-09 | 株式会社東芝 | 半導体装置 |
FR2673042A1 (fr) * | 1991-02-18 | 1992-08-21 | Em Microelectronic Marin Sa | Module electronique resistant aux deformations mecaniques pour carte a microcircuits. |
JP2927982B2 (ja) * | 1991-03-18 | 1999-07-28 | ジャパンゴアテックス株式会社 | 半導体装置 |
-
1992
- 1992-11-27 CH CH363392A patent/CH686325A5/de not_active IP Right Cessation
-
1993
- 1993-11-18 EP EP93118564A patent/EP0599194A1/de not_active Withdrawn
- 1993-11-18 AT AT98101884T patent/ATE192883T1/de active
- 1993-11-18 EP EP95118345A patent/EP0706214A3/de not_active Withdrawn
- 1993-11-18 DE DE59310040T patent/DE59310040D1/de not_active Expired - Fee Related
- 1993-11-18 EP EP00106889A patent/EP1028462A1/de not_active Withdrawn
- 1993-11-18 EP EP98101884A patent/EP0843358B1/de not_active Expired - Lifetime
- 1993-11-19 JP JP5290842A patent/JP2515086B2/ja not_active Expired - Lifetime
- 1993-11-22 AU AU51848/93A patent/AU671868B2/en not_active Ceased
- 1993-11-22 IL IL107696A patent/IL107696A/en not_active IP Right Cessation
- 1993-11-23 CA CA002109761A patent/CA2109761C/en not_active Expired - Fee Related
- 1993-11-23 US US08/156,295 patent/US5550402A/en not_active Expired - Fee Related
- 1993-11-26 KR KR1019930025433A patent/KR0174761B1/ko not_active IP Right Cessation
- 1993-11-26 MY MYPI93002490A patent/MY111079A/en unknown
-
1996
- 1996-07-04 AU AU58375/96A patent/AU688682B2/en not_active Ceased
Also Published As
Publication number | Publication date |
---|---|
EP0843358A3 (de) | 1998-05-27 |
CA2109761C (en) | 1998-01-06 |
IL107696A0 (en) | 1994-02-27 |
EP0706214A3 (de) | 1998-01-14 |
EP0843358B1 (de) | 2000-05-10 |
AU688682B2 (en) | 1998-03-12 |
EP0599194A1 (de) | 1994-06-01 |
EP1028462A1 (de) | 2000-08-16 |
EP0706214A2 (de) | 1996-04-10 |
KR0174761B1 (ko) | 1999-02-01 |
EP0843358A2 (de) | 1998-05-20 |
AU671868B2 (en) | 1996-09-12 |
CA2109761A1 (en) | 1994-05-28 |
US5550402A (en) | 1996-08-27 |
AU5837596A (en) | 1996-09-05 |
ATE192883T1 (de) | 2000-05-15 |
AU5184893A (en) | 1994-06-09 |
JPH06236958A (ja) | 1994-08-23 |
DE59310040D1 (de) | 2000-06-15 |
MY111079A (en) | 1999-08-30 |
JP2515086B2 (ja) | 1996-07-10 |
IL107696A (en) | 1998-02-22 |
CH686325A5 (de) | 1996-02-29 |
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