KR960039305A - 반도체 장치 및 그 제조 방법 - Google Patents

반도체 장치 및 그 제조 방법 Download PDF

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KR960039305A
KR960039305A KR1019960011934A KR19960011934A KR960039305A KR 960039305 A KR960039305 A KR 960039305A KR 1019960011934 A KR1019960011934 A KR 1019960011934A KR 19960011934 A KR19960011934 A KR 19960011934A KR 960039305 A KR960039305 A KR 960039305A
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pads
concave portion
semiconductor device
semiconductor chip
concave
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KR1019960011934A
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KR100200254B1 (ko
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히데아끼 마에까와
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사또 후미오
가부시끼가이샤 도시바
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Abstract

본 발명의 반도체 장치는, 중앙이 오목형으로 소정 깊이로 홈파기 가공된 유리 에폭시 재료(3)와, 유리 에폭시 재료(3)의 오목형 부재에 배열된 다수의 본딩패드(5)와, 유리 에폭시 재료(3)의 오목형부 내에, 소자 영역이 본딩 패드(5)의 열에 대향하도록 배치되며, 본딩 패드(5)에 구형 금속(12)을 통해 전기적으로 접속된 콘택트 패드(1)를 갖는 반도체 소자(6)와, 반도체 소자(6)를 완전히 피복하도록 오목형부 내에 유입된 포팅제(2)를 구비한다. 본 발명을 사용함으로써, 외위기의 외형 치수의 축소, 제조 공정 감소 및 포팅제의 미충전 방지에 의한 신뢰성의 향상 등의 효과를 얻을 수 있다.

Description

반도체 장치 및 그 제조 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 실시예를 도시한 반도체 장치의 평면도 및 단면도.

Claims (5)

  1. 반도체 장치에 있어서, 중앙이 오목형으로 소정 깊이로 홈파기 가공된 외위기(3)와, 상기 외위기의 오목형부 내에 배열된 다수의 제1패드(5)와, 상기 외위기(3)의 오목형부 내에, 소자 영역이 상기 제1패드(5)의 열에 대향하도록 배치되며 상기 제1패드(5)에 금속 볼(12)을 통해 전기적으로 접속된 제2패드(1)를 갖는 반도체 칩(6)과, 상기 반도체 칩(6)을 완전히 피복하도록 상기 오목형부 내에 유입된 포팅 부재(2)를 구비하는 것을 특징으로 하는 반도체 장치.
  2. 제1항에 있어서, 상기 외위기(2)는 유리 에폭시 재료로 구성되어 있는 것을 특징으로 하는 반도체 장치.
  3. 반도체 장치의 제조 방법에 있어서, 중앙이 오목형으로 소정 깊이로 홈파기 가공되며 이 오목형부 내에 다수의 패드가 형성된 외위기의 상기 오목형부 내에, 반도체 칩을 이 소자 영역이 상기 패드의 열에 대향하도록 배치하면서 상기 패드에 금속 볼을 통해 전기적으로 접속하는 공정과, 상기 오목형부 내에 포팅 부재를 유입함과 동시에 상기 외위기의 중앙에 형성된 관통 구멍에서 흡인함으로써 상기 반도체 칩을 상기 포팅 부재로 완전히 피복하는 공정을 구비하는 것을 특징으로 하는 반도체 장치의 제조 방법.
  4. 반도체 장치의 제조 방법에 있어서, 유리 에폭시판을 중앙이 오목형으로 소정 깊이가 되도록 홈파기 가공함으로써 외위기를 형성하는 공정과, 상기 외위기의 오목형부 내에 다수의 패드를 형성하는 공정과, 상기 외위기의 오목형부 내에 소정 높이의 절연 부재를 배치하는 공정과, 반도체 칩의 다수의 콘택트 패드상에 금속 볼을 배치하는 공정과, 상기 절연 부재상에 상기 반도체 칩을 탑재시키면서 상기 다수의 패드와 상기 콘택트 패드를 서로 대향시켜 상기 금속 볼을 통해 전기적으로 접속하는 공정과, 상기 오목형부 내에 포팅 부재를 유입함과 동시에 상기 외위기의 중앙에 형성된 관통 구멍에서 흡인함으로써 상기 반도체 칩을 상기 포팅 부재로 완전히 피복하는 공정을 구비하는 것을 특징으로 하는 반도체 장치의 제조 방법.
  5. 제4항에 있어서, 상기 절연 부내는 폴리이미드 테이프로 구성되어 있는 것을 특징으로 하는 반도체 장치의 제조 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960011934A 1995-04-21 1996-04-19 반도체 장치 및 그 제조 방법 KR100200254B1 (ko)

Applications Claiming Priority (2)

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JP95-096367 1995-04-21
JP7096367A JPH08293524A (ja) 1995-04-21 1995-04-21 半導体装置およびその製造方法

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TW390004B (en) 2000-05-11
KR100200254B1 (ko) 1999-06-15
US5834835A (en) 1998-11-10
JPH08293524A (ja) 1996-11-05

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