JPS6489544A - Cap for photosemiconductor device case - Google Patents

Cap for photosemiconductor device case

Info

Publication number
JPS6489544A
JPS6489544A JP24831687A JP24831687A JPS6489544A JP S6489544 A JPS6489544 A JP S6489544A JP 24831687 A JP24831687 A JP 24831687A JP 24831687 A JP24831687 A JP 24831687A JP S6489544 A JPS6489544 A JP S6489544A
Authority
JP
Japan
Prior art keywords
cap
plated
ceiling
ring plate
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24831687A
Other languages
Japanese (ja)
Inventor
Toru Kamata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP24831687A priority Critical patent/JPS6489544A/en
Publication of JPS6489544A publication Critical patent/JPS6489544A/en
Pending legal-status Critical Current

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  • Led Devices (AREA)
  • Light Receiving Elements (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE:To obtain a cap for a container wherein an optical system with a stable optical fiber with high YAG laser weldability by providing a part of the external surface of a metallic cylindrical material with a stainless material exposed surface with gold laser weldability. CONSTITUTION:A transparent glass plate 1 is provided with a nonreflective coating at both ends thereof, and is hermetically sealed against a ring plate 2 which is a glass sealing metal consisting of copal or a 42 Ni-Fe alloy by a low melting point glass 3. When the transparent glass plate 1 is bonded to the metal ring plate 2, the whole surface of the metal is Au plated. On the other hand, a stainless cylindrical material 4, whose ceiling having a window hole at the center, is plated with Ni and Au, which is then removed only at the external part 4a of the ceiling, leaving the material exposed. The ring plate 2 plated with Au is bonded to the internal surface of the ceiling of the cylindrical body 4 with an Au-Sn eutectic alloy 5, thereby forming a cap for the photosemiconductors.
JP24831687A 1987-09-30 1987-09-30 Cap for photosemiconductor device case Pending JPS6489544A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24831687A JPS6489544A (en) 1987-09-30 1987-09-30 Cap for photosemiconductor device case

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24831687A JPS6489544A (en) 1987-09-30 1987-09-30 Cap for photosemiconductor device case

Publications (1)

Publication Number Publication Date
JPS6489544A true JPS6489544A (en) 1989-04-04

Family

ID=17176265

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24831687A Pending JPS6489544A (en) 1987-09-30 1987-09-30 Cap for photosemiconductor device case

Country Status (1)

Country Link
JP (1) JPS6489544A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5834835A (en) * 1995-04-21 1998-11-10 Kabushiki Kaisha Toshiba Semiconductor device having an improved structure for storing a semiconductor chip
JP2009071265A (en) * 2007-08-18 2009-04-02 Nichia Corp Semiconductor light-emitting device
JP2009524234A (en) * 2006-01-20 2009-06-25 ハイマイト アクティーゼルスカブ Light emitting device package with built-in electrostatic discharge protection
JP2014060218A (en) * 2012-09-14 2014-04-03 Nichia Chem Ind Ltd Light emitting device
JP2015065353A (en) * 2013-09-26 2015-04-09 京セラ株式会社 Optical semiconductor element housing package, and mounting structure equipped with the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5834835A (en) * 1995-04-21 1998-11-10 Kabushiki Kaisha Toshiba Semiconductor device having an improved structure for storing a semiconductor chip
JP2009524234A (en) * 2006-01-20 2009-06-25 ハイマイト アクティーゼルスカブ Light emitting device package with built-in electrostatic discharge protection
JP2009071265A (en) * 2007-08-18 2009-04-02 Nichia Corp Semiconductor light-emitting device
JP2014060218A (en) * 2012-09-14 2014-04-03 Nichia Chem Ind Ltd Light emitting device
JP2015065353A (en) * 2013-09-26 2015-04-09 京セラ株式会社 Optical semiconductor element housing package, and mounting structure equipped with the same

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