JP2014060218A - Light emitting device - Google Patents

Light emitting device Download PDF

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JP2014060218A
JP2014060218A JP2012203378A JP2012203378A JP2014060218A JP 2014060218 A JP2014060218 A JP 2014060218A JP 2012203378 A JP2012203378 A JP 2012203378A JP 2012203378 A JP2012203378 A JP 2012203378A JP 2014060218 A JP2014060218 A JP 2014060218A
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light
light emitting
emitting device
translucent member
emitting element
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JP6019977B2 (en
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Hirobumi Oka
博文 岡
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Nichia Chemical Industries Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide a light emitting device which is very excellent in light distribution characteristics.SOLUTION: A light emitting device according to this invention includes: a light emitting element; a base substance having a recessed part for housing the light emitting element; and a lid which is disposed above the light emitting element so as to be separated from the light emitting element and covers the recessed part of the base substance. The lid includes: a translucent member which transmits light from the light emitting element; and a frame material which is provided at an outer periphery of the translucent member and holds the translucent member. The frame material is joined to an upper surface of the base substance, and a reflection prevention layer is formed on one of an upper surface and a lower surface of the translucent member so as to be separated from a joining part between the translucent member and the frame material.

Description

本発明は、発光装置に関し、より詳細には、ガラス等の透光性部材で閉じられた発光装置に関する。   The present invention relates to a light emitting device, and more particularly to a light emitting device closed with a light transmissive member such as glass.

発光ダイオードやレーザーダイオード等の半導体発光素子は、発光装置の光源として利用することができる。近年、半導体発光素子と該半導体発光素子からの光を吸収して発光する蛍光体とを組み合わせ、白色系の混色光を発光する発光装置が実用化され、電化製品のインジケーターや液晶のバックライトなどの表示用として使用されている。そして、発光装置は、高い発光効率及び高輝度化により室内照明や車載用照明等に広く利用されることが期待されている。   A semiconductor light emitting element such as a light emitting diode or a laser diode can be used as a light source of a light emitting device. In recent years, a light-emitting device that emits white mixed color light by combining a semiconductor light-emitting element and a phosphor that emits light by absorbing light from the semiconductor light-emitting element has been put into practical use. It is used for display. The light-emitting device is expected to be widely used for indoor lighting, in-vehicle lighting, and the like due to high luminous efficiency and high luminance.

一般的に知られている発光装置は、パッケージ内に発光素子が実装され、その発光素子がエポキシ樹脂やシリコーン樹脂のような透光性の封止樹脂によって被覆されている。これらの発光装置における半導体発光素子は、発光によって発熱し、発光装置全体の急激な温度変化によって、封止樹脂が膨張あるいは収縮する。これにより、樹脂に被覆された発光素子やボンディングワイヤが悪影響を受けるおそれがある。   In a generally known light emitting device, a light emitting element is mounted in a package, and the light emitting element is covered with a light-transmitting sealing resin such as an epoxy resin or a silicone resin. The semiconductor light emitting elements in these light emitting devices generate heat by light emission, and the sealing resin expands or contracts due to a rapid temperature change of the entire light emitting device. As a result, the light emitting element or the bonding wire coated with the resin may be adversely affected.

また、青色系の短波長光を発する発光素子を用いる発光装置においては、高エネルギー光の照射を受ける樹脂の着色および劣化によって、透光性が変化するため、長時間の使用による発光装置の信頼性や、発光色の色ズレ、発光ムラなどの光学特性上の問題が生じていた。   Further, in a light-emitting device using a light-emitting element that emits blue-based short-wavelength light, the translucency changes due to coloring and deterioration of the resin that is irradiated with high-energy light. And problems with optical characteristics such as color deviation of emission color and uneven emission.

そのため、ガラス等の透光性部材で、基体に搭載された発光素子や該発光素子に接続された金属細線を密閉する発光装置が提案されている（例えば、特許文献１参照）。   For this reason, a light-emitting device that seals a light-emitting element mounted on a substrate and a thin metal wire connected to the light-emitting element with a light-transmitting member such as glass has been proposed (for example, see Patent Document 1).

このような発光装置では、通常、光の取出し効率を向上させるため、ガラス等の透光性部材の表面の全面に反射防止層（ＡＲコート層）が形成されている。しかしながら、透光性部材の表面の全面に反射防止層を形成した場合、透光性部材と基体との接合部付近においてガラス表面荒れによる配光特性のばらつきが発生することがある。
このような反射防止層を有する発光装置において、配光特性が良好であることが必要とされており、配光特性のさらなる向上が求められている。 In such a light-emitting device, an antireflection layer (AR coating layer) is usually formed on the entire surface of a translucent member such as glass in order to improve light extraction efficiency. However, when an antireflection layer is formed on the entire surface of the translucent member, variations in light distribution characteristics due to rough glass surface may occur in the vicinity of the junction between the translucent member and the substrate.
A light emitting device having such an antireflection layer is required to have good light distribution characteristics, and further improvement of the light distribution characteristics is required.

特開２００２−３５３５１６号公報JP 2002-353516 A

本発明は、上記事情に鑑みて成されたものであり、その目的とするところは、配光特性が極めて良好な発光装置を提供することにある。   The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a light emitting device with extremely good light distribution characteristics.

上記目的を達成するため、本発明に係る発光装置は、発光素子と、該発光素子を収容する凹部を有する基体と、前記発光素子の上部に離間して配置され前記基体の凹部を覆う蓋体と、を有してなり、
前記蓋体は、前記発光素子からの光を透過する透光性部材と、該透光性部材の外周に設けられ前記透光性部材を保持する枠材と、を有し、前記枠材が前記基体の上面と接合してなり、
前記透光性部材の上面および下面の少なくともいずれか一方の面に反射防止層が、前記透光性部材と前記枠材との接合部から離間して形成されてなることを特徴とする。
上記構成によれば、反射防止層が、透光性部材と枠材との接合部から離間して形成されているため、配光特性を向上させることができる。 In order to achieve the above object, a light-emitting device according to the present invention includes a light-emitting element, a base body having a concave portion that accommodates the light-emitting element, and a lid body that is disposed apart from the light-emitting element and covers the concave portion of the base body. And having
The lid includes a translucent member that transmits light from the light emitting element, and a frame member that is provided on an outer periphery of the translucent member and holds the translucent member. Bonded to the upper surface of the substrate,
An antireflection layer is formed on at least one of an upper surface and a lower surface of the translucent member so as to be separated from a joint portion between the translucent member and the frame member.
According to the above configuration, since the antireflection layer is formed away from the joint between the translucent member and the frame member, the light distribution characteristic can be improved.

また、本発明に係る発光装置において、前記反射防止層は、前記透光性部材における前記基体の凹部上方から、前記凹部上方より外側まで延在して設けられる。これにより、発光素子からの光、および発光素子から出た光がさらに凹部の内部で反射された光を効率よく外部に放出させることができる。   In the light emitting device according to the present invention, the antireflection layer is provided to extend from above the concave portion of the base of the translucent member to outside from above the concave portion. Thereby, the light from the light emitting element and the light reflected from the light emitting element can be efficiently emitted to the outside.

また、本発明に係る発光装置において、前記基体の上面と凹部との境界は、前記接合部より内側にあることが好ましい。これにより、凹部からの光を枠材で遮ることなく、効率よく外部に放出することができる。さらには、反射防止層を好ましい位置に形成することが可能となる。   In the light emitting device according to the present invention, it is preferable that a boundary between the upper surface of the base and the concave portion is inside the joint. Thereby, the light from the concave portion can be efficiently emitted to the outside without being blocked by the frame material. Furthermore, the antireflection layer can be formed at a preferred position.

また、本発明に係る発光装置において、前記基体の上面と凹部との境界は、好適には八角形である。これにより、基体の上面と枠材との接合領域を大きくとることができ、基体と蓋体との強い密着性を得ることができる。   In the light emitting device according to the present invention, the boundary between the upper surface of the base and the recess is preferably an octagon. Thereby, the joining area | region of the upper surface of a base | substrate and a frame material can be taken large, and the strong adhesiveness of a base | substrate and a cover body can be acquired.

また、本発明に係る発光装置において、前記枠材は、好適には内側の開口が円形である。   In the light emitting device according to the present invention, the frame member preferably has a circular inner opening.

また、本発明に係る発光装置において、前記反射防止層と前記接合部との間の距離が、０．２ｍｍ〜０．６ｍｍであることが好ましい。これにより、上記同様、良好な配光特性を得ることができるとともに、反射防止層による光取出し効率を高めることができる。   In the light emitting device according to the present invention, it is preferable that a distance between the antireflection layer and the joint is 0.2 mm to 0.6 mm. As a result, as described above, it is possible to obtain good light distribution characteristics and to increase the light extraction efficiency by the antireflection layer.

本発明に係る発光装置において、前記枠材は、好適には、コバール（鉄−ニッケル−コバルト合金）、ニッケル・鉄（例えばニッケル４２％）、ニッケル・鉄（例えばニッケル５０％）、およびインバーなどのニッケル鉄合金からなる群から選択された少なくとも一種により構成されている。このような材料は熱膨張係数が低いため好適である。   In the light emitting device according to the present invention, the frame material is preferably Kovar (iron-nickel-cobalt alloy), nickel / iron (for example, 42% nickel), nickel / iron (for example, nickel 50%), invar, or the like. And at least one selected from the group consisting of nickel-iron alloys. Such a material is preferable because it has a low coefficient of thermal expansion.

さらに、本発明に係る発光装置において、前記透光性部材は、好適には、ホウ珪酸ガラス、石英ガラス、サファイアガラス、フッ化カルシウムガラス、アルミノホウ珪酸ガラス、オキシナイトライドガラス、およびカルコゲナイドガラスからなる群から選択された少なくとも１種により構成されている。このような材料は熱膨張係数が低いため好適である。   Furthermore, in the light emitting device according to the present invention, the translucent member is preferably made of borosilicate glass, quartz glass, sapphire glass, calcium fluoride glass, aluminoborosilicate glass, oxynitride glass, and chalcogenide glass. It is composed of at least one selected from the group. Such a material is preferable because it has a low coefficient of thermal expansion.

また、本発明に係る発光装置において、前記透光性部材の熱膨張係数と前記枠材の熱膨張係数とが同じであることが好ましい。これにより、透光性部材を枠材に融着させて使用した場合に透光性部材および枠材に生じうる歪みを抑制することができる。   In the light emitting device according to the present invention, it is preferable that a thermal expansion coefficient of the translucent member and a thermal expansion coefficient of the frame member are the same. Thereby, when the translucent member is fused to the frame material and used, the distortion that may occur in the translucent member and the frame material can be suppressed.

また、本発明に係る発光装置において、前記透光性部材の上面と前記枠材の上面とが面一となるよう前記透光性部材が前記枠材により保持されていることが好ましい。透光性部材の上面と、枠材の上面とが面一となっているため、審美性に優れ、また透光性部材の側面が露出しておらず、当該側面が障害とならないため好適である。   In the light emitting device according to the present invention, it is preferable that the translucent member is held by the frame member so that the upper surface of the translucent member and the upper surface of the frame member are flush with each other. Since the upper surface of the translucent member and the upper surface of the frame material are flush with each other, it is excellent in aesthetics, and the side surface of the translucent member is not exposed, so that the side surface is not an obstacle. is there.

また、本発明に係る発光装置において、前記反射防止層が形成されていない領域の面積と、前記反射防止層が形成されている領域の面積との比率が、１：２〜１：５であることが好ましい。このような構成とすることにより、良好な配光特性を得ることができるとともに、反射防止層による光取出し効率を高めることができる。   In the light emitting device according to the present invention, the ratio of the area of the region where the antireflection layer is not formed to the area of the region where the antireflection layer is formed is 1: 2 to 1: 5. It is preferable. With such a configuration, good light distribution characteristics can be obtained, and light extraction efficiency by the antireflection layer can be increased.

本発明に係る発光装置は、発光素子と、該発光素子を収容する凹部を有する基体と、前記発光素子の上部に離間して配置され前記基体の凹部を覆う蓋体と、を有してなり、
前記蓋体は、前記発光素子からの光を透過する透光性部材と、該透光性部材の外周に設けられ前記透光性部材を保持する枠材と、を有し、前記枠材が前記基体の上面と接合してなり、
前記基体の上面と凹部との境界は、前記接合部より内側にあることを特徴とする。これにより、凹部からの光を枠材で遮ることなく、効率よく外部に放出することができる。 A light-emitting device according to the present invention includes a light-emitting element, a base body having a concave portion that accommodates the light-emitting element, and a lid that is spaced apart from the light-emitting element and covers the concave portion of the base body. ,
The lid includes a translucent member that transmits light from the light emitting element, and a frame member that is provided on an outer periphery of the translucent member and holds the translucent member. Bonded to the upper surface of the substrate,
The boundary between the upper surface of the base and the recess is located inside the joint. Thereby, the light from the concave portion can be efficiently emitted to the outside without being blocked by the frame material.

また、本発明に係る発光装置において、前記基体の上面と凹部との境界は、好適には八角形である。これにより、基体の上面と枠材との接合領域を大きくとることができ、基体と蓋体との強い密着性を得ることができる。   In the light emitting device according to the present invention, the boundary between the upper surface of the base and the recess is preferably an octagon. Thereby, the joining area | region of the upper surface of a base | substrate and a frame material can be taken large, and the strong adhesiveness of a base | substrate and a cover body can be acquired.

また、本発明に係る発光装置において、前記枠材は、好適には内側の開口が円形である。   In the light emitting device according to the present invention, the frame member preferably has a circular inner opening.

また、本発明に係る発光装置において、前記透光性部材の上面および下面の少なくともいずれか一方の面に反射防止層が形成されていることが好ましい。これにより、光の取出し効率を高めることができる。   In the light emitting device according to the present invention, it is preferable that an antireflection layer is formed on at least one of the upper surface and the lower surface of the translucent member. Thereby, the light extraction efficiency can be increased.

本発明によれば、反射防止層が、透光性部材と枠材との接合部から離間して形成されているため、配光特性に優れる発光装置を提供することができる。   According to the present invention, since the antireflection layer is formed away from the joint between the translucent member and the frame member, a light emitting device having excellent light distribution characteristics can be provided.

図１は、本発明の実施の形態に係る発光装置の斜視図である。FIG. 1 is a perspective view of a light emitting device according to an embodiment of the present invention. 図２は、本発明の実施の形態に係る発光装置を構成する基体の斜視図である。FIG. 2 is a perspective view of a base constituting the light emitting device according to the embodiment of the present invention. 図３は、図１の発光装置の、Ｘ−Ｘ’における断面図である。FIG. 3 is a cross-sectional view taken along the line X-X ′ of the light emitting device of FIG. 1. 図４（ａ）は、その発光装置の上面図、図４（ｂ）は、その発光装置の右側面図、図４（ｃ）は、その発光装置の前面図である。4A is a top view of the light emitting device, FIG. 4B is a right side view of the light emitting device, and FIG. 4C is a front view of the light emitting device. 図５は、実施の形態１に係る発光装置に用いられる蓋体の断面図である。FIG. 5 is a cross-sectional view of a lid used in the light emitting device according to Embodiment 1. 図６は、実施の形態２に係る発光装置に用いられる蓋体の断面図である。6 is a cross-sectional view of a lid used in the light emitting device according to Embodiment 2. FIG. 図７は、実施の形態３に係る発光装置に用いられる蓋体の断面図である。FIG. 7 is a cross-sectional view of a lid used in the light emitting device according to Embodiment 3. 図８は、実施の形態４に係る発光装置に用いられる蓋体の断面図である。FIG. 8 is a cross-sectional view of a lid used in the light emitting device according to Embodiment 4. 図９は、発光装置の断面において、相対放射強度が不連続となる位置を示した図である。FIG. 9 is a diagram showing a position where the relative radiation intensity is discontinuous in the cross section of the light emitting device. 図１０は、配光特性を示したグラフである。FIG. 10 is a graph showing the light distribution characteristics.

以下、本発明を実施するための態様を、図面を参照しながら詳細に説明する。しかしながら、以下に示す態様は、本発明の技術思想を具体化するための発光装置を例示するものであって、本発明を以下の実施の形態に限定するものではない。また、実施の形態に記載されている構成部品の寸法、材質、形状、その相対的配置等は、特定的な記載がない限り、本発明の範囲をそれのみに限定する趣旨ではなく、単なる例示にすぎない。なお、各図面が示す部材の大きさや位置関係等は、説明を明確にするために誇張していることがある。なお、以下の説明では、必要に応じて特定の方向や位置を示す用語（例えば、「上」、「下」、「右」、「左」、「前」、「後」およびそれらの用語を含む別の用語）を用いるが、それらの用語の使用は発明の理解を容易にするためであって、それらの用語の意味によって本発明の技術的範囲が制限されることはない。   Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the drawings. However, the modes shown below exemplify a light emitting device for embodying the technical idea of the present invention, and the present invention is not limited to the following embodiments. In addition, the dimensions, materials, shapes, relative arrangements, and the like of the component parts described in the embodiments are not intended to limit the scope of the present invention only to specific examples unless otherwise specified. Only. Note that the size, positional relationship, and the like of the members shown in each drawing may be exaggerated for clarity of explanation. In the following description, terms indicating a specific direction or position as necessary (for example, “up”, “down”, “right”, “left”, “front”, “rear”, and those terms) The use of these terms is intended to facilitate understanding of the invention, and the technical scope of the present invention is not limited by the meaning of these terms.

（実施の形態１）
図１は、本発明の実施の形態１に係る発光装置の斜視図であり、図２は、その発光装置を構成する基体の斜視図である。また、図３は、その発光装置の、Ｘ−Ｘ’における断面図であり、図４（ａ）は、その発光装置の上面図、図４（ｂ）は、その発光装置の右側面図、図４（ｃ）は、その発光装置の前面図である。 (Embodiment 1)
FIG. 1 is a perspective view of a light emitting device according to Embodiment 1 of the present invention, and FIG. 2 is a perspective view of a base constituting the light emitting device. 3 is a cross-sectional view of the light emitting device at XX ′, FIG. 4A is a top view of the light emitting device, FIG. 4B is a right side view of the light emitting device, FIG. 4C is a front view of the light emitting device.

図１〜４に示すように、実施の形態１に係る発光装置１は、発光素子２と、発光素子２を収容する凹部（凹部は、発光素子２が搭載された基板を収容する発光素子収容部とキャビティ２６とを併せた部分を意味する）を有する基体（以下支持基板と称することもある）３と、発光素子２の上部に離間して配置され基体３のキャビティ２６を覆う蓋体４と、を有する。   As shown in FIGS. 1 to 4, the light-emitting device 1 according to Embodiment 1 includes a light-emitting element 2 and a recess that houses the light-emitting element 2 (the recess is a light-emitting element housing that houses a substrate on which the light-emitting element 2 is mounted). And a lid 4 that is spaced apart above the light emitting element 2 and covers the cavity 26 of the substrate 3. And having.

図１に示すように、蓋体４は、発光素子２からの光を透過する透光性部材５と、透光性部材５の外周に設けられ透光性部材５を保持する枠材６と、を備える。発光装置１を封止するため、透光性部材５と枠材６とが、透光性部材５の下面２３の外縁部が枠材６の保持部１６の上面に融着することにより接合されている。   As shown in FIG. 1, the lid 4 includes a translucent member 5 that transmits light from the light emitting element 2, and a frame member 6 that is provided on the outer periphery of the translucent member 5 and holds the translucent member 5. . In order to seal the light emitting device 1, the translucent member 5 and the frame member 6 are joined by fusing the outer edge portion of the lower surface 23 of the translucent member 5 to the upper surface of the holding portion 16 of the frame member 6. ing.

図５は、実施の形態１に係る発光装置１に用いられる蓋体４の概略断面図である。図５に示すように、透光性部材の上面および下面のいずれか一方の面に反射防止層（以下ＡＲコート層と称することもある）が形成されている。そして、透光性部材５と枠材６との接合部１０（以下融着部分と称することもある）と、反射防止層１２とが離間、つまり接合部１０と反射防止層１２との間に、反射防止層１２が形成されていない領域Ａ１、Ａ２（Ａ１とＡ２とを併せてＡと称することがある）が形成されている。 FIG. 5 is a schematic cross-sectional view of the lid 4 used in the light emitting device 1 according to the first embodiment. As shown in FIG. 5, an antireflection layer (hereinafter also referred to as an AR coating layer) is formed on one of the upper surface and the lower surface of the translucent member. Then, the joint portion 10 (hereinafter also referred to as a fused portion) between the translucent member 5 and the frame member 6 and the antireflection layer 12 are separated, that is, between the joint portion 10 and the antireflection layer 12. Regions A 1 and A 2 where the antireflection layer 12 is not formed (A 1 and A 2 may be collectively referred to as A) are formed.

通常、例えば金属等の枠材に、例えばガラス等の透光性部材を融着させた場合、当該ガラスの融着部分付近において、ガラスが高温にさらされたことによりガラス表面が荒れている可能性がある。この場合、この荒れたガラス表面にＡＲコート層が形成されていると、図９に示す、蓋体４の透光性部材５と枠材６との接合部１０付近Ａ（図１０において、基体３の法線方向に対して例えば±６０°傾斜した位置に相当する（当該±６０°という数値は単に例示であって発光素子から透光性部材までの距離、透光性部材の大きさ等により変動する））で、相対放射強度が不連続となり、配光特性がばらつくことになる。   Normally, when a translucent member such as glass is fused to a frame material such as metal, the glass surface may be roughened due to the glass being exposed to high temperatures in the vicinity of the fused portion of the glass. There is sex. In this case, if an AR coating layer is formed on the rough glass surface, the vicinity of the joint 10 between the translucent member 5 and the frame member 6 of the lid 4 shown in FIG. 3 corresponds to, for example, a position inclined by ± 60 ° (the numerical value of ± 60 ° is merely an example, the distance from the light emitting element to the light transmitting member, the size of the light transmitting member, etc.) )), The relative radiation intensity becomes discontinuous and the light distribution characteristics vary.

これに対して、上述のように、透光性部材５と枠材６との接合部１０と、反射防止層１２との間に、反射防止層１２が存在しない領域Ａが形成されていることにより、発光素子から発せられた光は、領域Ａを透過する際は反射により、反射防止層１２が存在する領域よりも外部へ透過される光量が低減されるため、全面に反射防止層１２が存在する場合に比べて、接合部１０において相対放射強度が不連続とならず、良好な配光特性を有する発光装置を提供することができる。なお、反射防止膜としては、発光素子からの光を発光装置外部に取り出すよう反射を防止し、高透過率を実現するものであればどのような材料、また材料の組合せでもよいが、具体的な一例としては、Ａｌ２Ｏ３とＭｇＦ２を繰り返し積層した多層膜が挙げられる。 On the other hand, as described above, the region A where the antireflection layer 12 does not exist is formed between the joint portion 10 of the translucent member 5 and the frame member 6 and the antireflection layer 12. Accordingly, when the light emitted from the light emitting element is transmitted through the region A, the amount of light transmitted to the outside is reduced by reflection when compared with the region where the antireflection layer 12 exists. Compared with the case where it exists, the relative radiant intensity does not become discontinuous at the joint 10, and a light-emitting device having good light distribution characteristics can be provided. As the antireflection film, any material or combination of materials may be used as long as it prevents reflection so that light from the light emitting element is extracted to the outside of the light emitting device and realizes high transmittance. An example is a multilayer film in which Al 2 O 3 and MgF 2 are repeatedly laminated.

図１に示すように、本発明に係る発光装置１の蓋体４において、略矩形の板状体の中央付近が略円状に開口され枠材６（開口部が円形の枠材６）が形成されている。   As shown in FIG. 1, in the lid 4 of the light emitting device 1 according to the present invention, a frame material 6 (a frame material 6 having a circular opening) is formed by opening a substantially rectangular plate-like body in the vicinity of the center. Is formed.

図５に示すように、枠材６は、中央部分に開口部１４を有し、開口部１４の内周面に、透光性部材５を保持するための保持部１６が、開口部１４の内方に向かって突出して形成されている。保持部１６は、透光性部材５を良好に保持することが可能であれば、開口部１６の内周面１８の全体（内周面１８の周方向について全体）に形成されていてもよいし、内周面１８の一部（内周面１８の周方向について一部）に形成されていてもよい。保持部１６を内周面１８の一部に形成する場合は、保持部１６が透光性部材５を良好に保持することができるように、開口部１４の内周面１８の少なくとも３箇所以上に形成されていることが好ましい。図５に示すように、実施の形態１では、透光性部材５は枠材６より上側に突出しており、透光性部材５の上面２１は、枠材６の上面２２より上側に配置されている。実施の形態１において、本発明に係る「前記反射防止層が、透光性部材と前記枠材との接合部から離間して形成されてなる」とは、反射防止層１２を設けた、透光性部材５の上面２１または下面２３の外縁部に反射防止層１２が存在しないことを意味し、より具体的には、透光性部材５の側面２０の、透光性部材５と枠材６との接合部１０以外の部分と、透光性部材５の上面２１において、上側反射防止層１２が形成された領域の径方向外側の部分と、を合わせた領域Ａ１、並びに、透光性部材５の下面２３において、透光性部材５と枠材６との接合部１０と、下側反射防止層１２との間の領域Ａ２に反射防止層１２が存在しないことを意味する。このように構成することにより、例えばガラス等からなる透光性部材５と例えば金属等からなる枠材６との融着部分１０近くのガラス表面が荒れた領域に反射防止層１２が形成されていないため、配光特性のばらつきを抑制することができる。 As shown in FIG. 5, the frame member 6 has an opening 14 in the center portion, and a holding portion 16 for holding the translucent member 5 is provided on the inner peripheral surface of the opening 14. It is formed to project inward. If the holding | maintenance part 16 can hold | maintain the translucent member 5 favorably, you may be formed in the whole inner peripheral surface 18 (the whole circumferential direction of the inner peripheral surface 18) of the opening part 16. As shown in FIG. And it may be formed in a part of inner peripheral surface 18 (a part in the circumferential direction of inner peripheral surface 18). When the holding part 16 is formed on a part of the inner peripheral surface 18, at least three or more places on the inner peripheral surface 18 of the opening 14 so that the holding part 16 can hold the translucent member 5 satisfactorily. It is preferable to be formed. As shown in FIG. 5, in Embodiment 1, the translucent member 5 protrudes above the frame member 6, and the upper surface 21 of the translucent member 5 is disposed above the upper surface 22 of the frame member 6. ing. In Embodiment 1, according to the present invention, “the antireflection layer is formed apart from the joint between the translucent member and the frame member” means that the antireflection layer 12 is provided. This means that the antireflection layer 12 does not exist on the outer edge portion of the upper surface 21 or the lower surface 23 of the light transmissive member 5, and more specifically, the light transmissive member 5 and the frame material on the side surface 20 of the light transmissive member 5. A region A 1 that is a combination of a portion other than the joint portion 10 with the light-transmitting member 6 and a radially outer portion of the region where the upper antireflection layer 12 is formed on the upper surface 21 of the translucent member 5; This means that the antireflection layer 12 does not exist in the area A 2 between the joint portion 10 between the translucent member 5 and the frame member 6 and the lower antireflection layer 12 on the lower surface 23 of the conductive member 5. By constituting in this way, the antireflection layer 12 is formed in the region where the glass surface near the fusion part 10 between the translucent member 5 made of glass or the like and the frame member 6 made of metal or the like is rough. Therefore, variations in light distribution characteristics can be suppressed.

実施の形態１に係る発光装置１において、反射防止層１２が形成されていない領域の面積と、反射防止層１２が形成されている領域の面積との比率が、１：２〜１：５であることが好ましい。このような範囲にあれば、配光特性のばらつきを良好に抑えることができる。   In the light-emitting device 1 according to Embodiment 1, the ratio of the area of the region where the antireflection layer 12 is not formed to the area of the region where the antireflection layer 12 is formed is 1: 2 to 1: 5. Preferably there is. If it is in such a range, the dispersion | distribution of a light distribution characteristic can be suppressed favorably.

実施の形態１に係る発光装置１において、反射防止層１２が形成されていない領域Ａ（Ａ１、Ａ２）は、例えばガラスからなる透光性部材５の高温処理により表面が荒れた部分に、反射防止層１２が形成されていないことが肝要である。表面が荒れた部分に反射防止層１２が形成されていない限り、反射防止層１２と、透光性部材５と枠材６との接合部１０と、の間の距離は、如何なるものであってもよいが、好適には、０．２ｍｍ〜０．６ｍｍである。このような範囲にあれば、光の反射を抑制することができるとともに、配光特性のばらつきを良好に抑えることができる。 In the light emitting device 1 according to the first embodiment, the region A (A 1 , A 2 ) where the antireflection layer 12 is not formed is a portion where the surface is roughened by the high temperature treatment of the translucent member 5 made of glass, for example. It is important that the antireflection layer 12 is not formed. As long as the antireflection layer 12 is not formed on the rough surface, the distance between the antireflection layer 12 and the joint 10 between the translucent member 5 and the frame member 6 is any. However, it is preferably 0.2 mm to 0.6 mm. Within such a range, reflection of light can be suppressed, and variations in light distribution characteristics can be suppressed satisfactorily.

以下、本発明に係る発光装置１の各構成要素について説明する。   Hereinafter, each component of the light emitting device 1 according to the present invention will be described.

（蓋体４）
本発明に係る発光装置１において、蓋体４は、以下に説明する基体３を覆うためのものであり、上述したように、発光素子２からの光を透過する透光性部材５と、透光性部材５の外周に設けられ透光性部材５を保持する枠材６と、を備える。 (Cover 4)
In the light emitting device 1 according to the present invention, the lid 4 is for covering the base 3 described below, and as described above, the light transmissive member 5 that transmits light from the light emitting element 2 and the transparent member 5. A frame member 6 provided on the outer periphery of the light-sensitive member 5 and holding the light-transmissive member 5.

（透光性部材５）
実施の形態１に係る発光装置１において、蓋体４を構成する透光性部材５は、基体３のキャビティ２６内に配置された発光素子２からの光を透過させて、発光装置１の外部に光を放出させる機能を有する。 (Translucent member 5)
In the light emitting device 1 according to the first embodiment, the translucent member 5 constituting the lid 4 transmits light from the light emitting element 2 disposed in the cavity 26 of the base 3, and the outside of the light emitting device 1. Has a function of emitting light.

透光性部材５としては、ホウ珪酸ガラス、石英ガラス、サファイアガラス、フッ化カルシウムガラス、アルミノホウ珪酸ガラス、オキシナイトライドガラス、カルコゲナイドガラスからなる群から選択された少なくとも１種からなる無機材料を挙げることができる。好ましくは、透光性部材５はホウ珪酸ガラスである。ホウ珪酸ガラスは、耐光性が高いため、好適に用いられる。   Examples of the translucent member 5 include inorganic materials made of at least one selected from the group consisting of borosilicate glass, quartz glass, sapphire glass, calcium fluoride glass, aluminoborosilicate glass, oxynitride glass, and chalcogenide glass. be able to. Preferably, the translucent member 5 is borosilicate glass. Borosilicate glass is preferably used because of its high light resistance.

また透光性部材５に設けられる反射防止層１２は、透光性部材５のうち、基体３の凹部（キャビティ２６）の上方から、凹部（キャビティ２６）の上方より外側まで延在して設けられる。これにより、発光素子２からの光、および発光素子２から出た光がさらに凹部（キャビティ２６）の内部で反射された光（以下、これらの光を、凹部からの光と称することもある）を効率よく外部に放出させることができる。   Further, the antireflection layer 12 provided on the translucent member 5 is provided so as to extend from above the concave portion (cavity 26) of the base 3 to above the concave portion (cavity 26). It is done. Thereby, the light from the light emitting element 2 and the light emitted from the light emitting element 2 are further reflected inside the recess (cavity 26) (hereinafter, these lights may be referred to as the light from the recess). Can be efficiently released to the outside.

（枠材６）
実施の形態１に係る発光装置１において、枠材６は、透光性部材５を保持することができれば如何なる形状であっても良いが内側の開口が円形であることが好ましい。また例えば、図５に示すように、枠材６に形成された開口部１４が円形であって、その内周面１８に周回するように保持部１６が設けられていてもよい。保持部１６は、鉛直な断面において矩形の形状を有していてもよい。保持部１６は、開口部１４の内周面１８に周回するように設けられていることが好ましい。開口部１４の内周面１８に周回するように設けられた保持部１６及び開口部１８の内周面１８に透光性部材５を融着させることにより、透光性部材５を枠材６に密着させることができる。しかしながら、透光性部材５を保持することが可能であれば、内周面１８の少なくとも一部に設けられていてもよい。 (Frame material 6)
In the light emitting device 1 according to Embodiment 1, the frame member 6 may have any shape as long as it can hold the translucent member 5, but the inner opening is preferably circular. Further, for example, as shown in FIG. 5, the opening 14 formed in the frame member 6 may be circular, and the holding portion 16 may be provided so as to go around the inner peripheral surface 18. The holding part 16 may have a rectangular shape in a vertical cross section. The holding part 16 is preferably provided so as to go around the inner peripheral surface 18 of the opening 14. The translucent member 5 is fused to the inner peripheral surface 18 of the opening portion 18 and the holding portion 16 provided so as to circulate around the inner peripheral surface 18 of the opening portion 14, whereby the translucent member 5 is attached to the frame member 6. Can be adhered to. However, as long as the translucent member 5 can be held, it may be provided on at least a part of the inner peripheral surface 18.

枠材６を構成する材料としては、コバール（鉄−ニッケル−コバルト合金）、４２％ニッケル・鉄、５０％ニッケル・鉄、およびインバーなどのニッケル鉄合金が例示される。好適には、コバールである。コバールは、ガラス等の透光性部材の熱膨張係数と同じ熱膨張係数を有するため、透光性部材５を枠材６に融着させて使用する場合に、透光性部材５および枠材６に歪みが発生しないため好適に用いられる。   Examples of the material constituting the frame member 6 include Kovar (iron-nickel-cobalt alloy), 42% nickel / iron, 50% nickel / iron, and nickel iron alloys such as Invar. Kovar is preferred. Since Kovar has the same thermal expansion coefficient as that of the translucent member such as glass, the translucent member 5 and the frame member are used when the translucent member 5 is fused to the frame member 6. 6 is preferably used because no distortion occurs.

（接着材）
実施の形態１に係る発光装置において、接着材（不図示）が、蓋体４を基体３に接着するために使用される。接着材としては、例えば、エポキシ樹脂、シリコーン樹脂、ポリイミド樹脂、ポリアミド樹脂、フッ素系エラストマー、ガラス、Ａｕ、Ａｇ、Ｂｉ、Ｃｕ、Ｉｎ、Ｐｂ、ＳｎおよびＺｎから選択された少なくとも一種を含む共晶材（例えば、Ａｕ−Ｓｎ）、ホットメルト系樹脂、変性シリコーンおよび有機無機ハイブリッド樹脂から選択された少なくとも一種を含む材料を例示することができる。 (Adhesive)
In the light emitting device according to Embodiment 1, an adhesive (not shown) is used for bonding the lid 4 to the base 3. Examples of the adhesive include eutectic including at least one selected from epoxy resin, silicone resin, polyimide resin, polyamide resin, fluorine-based elastomer, glass, Au, Ag, Bi, Cu, In, Pb, Sn, and Zn. Examples thereof include materials containing at least one selected from materials (for example, Au—Sn), hot melt resins, modified silicones, and organic-inorganic hybrid resins.

（基体（支持基板）３）
基体３は、発光素子２を収容するためのものであり、中央部に後述のキャビティ２６が形成され、キャビティ２６内に発光素子２が配置されている。基体３には、接着材（不図示）を介し、後述の蓋体４が配置される。 (Substrate (support substrate) 3)
The base 3 is for accommodating the light emitting element 2, a cavity 26 described later is formed in the center, and the light emitting element 2 is disposed in the cavity 26. A lid 4 described later is disposed on the base 3 via an adhesive (not shown).

実施の形態１に係る発光装置１において、基体３の中央部には、上方に開口してキャビティ２６が形成されている。図１に示すように、キャビティ２６の下面に発光素子２を収容する発光素子収容部を備え、発光素子収容部には発光素子２（発光素子２を有する基板）が配置されている。キャビティ２６は例えば上面視八角形の形状を有し、発光素子収容部は例えば角部が丸みを帯びた矩形の形状を有する。実施の形態１において、本発明に係る「基体の凹部」とは、キャビティ２６とキャビティ２６内に設けられた発光素子収容部とを併せたものを意味する。また、発光素子収容部を有せず直接キャビティ２６の底面に発光素子２（発光素子２を有する基板）を配置する態様においては、本発明に係る「基体の凹部」とは、キャビティ２６を意味する。
また、キャビティ２６の周囲に、蓋体４が載置される蓋体載置部２７が形成されている。蓋体載置部２７の上面の、キャビティ２６に近接する領域には、キャビティ２６に沿って略八角形形状を有する環状の隆起部２８が形成されている。さらに、略八角形形状のキャビティ２６の対向する２つの辺２９から、それぞれ、当該辺２９と対向する基体３の辺３０に、通気のための通路３２が形成されている。通路３２を設けることにより、リフロー処理を安全且つ確実に行なうことができるほか、外部環境の温度湿度の急激な変化により、キャビティ２６内部空間と基体３の外部との温度差が生じて透光性部材５の内部に結露が発生し、透光性部材５が曇った場合であっても、短時間でキャビティ２６の内部空間と基体３の外部との温度・湿度を均一化し、曇りを除去することができる。通路３２の両サイドには、それぞれ、環状の隆起部２８から基体３の辺３０へ延びる第１の放射状隆起部３３が形成されている。各通路３２の両サイドに形成された一対の第１の放射状隆起部３３間において、環状の隆起部２８は形成されておらず、環状隆起部２８と第１の放射状隆起部３３とは連続している。このように構成されることにより、基体３を蓋体４で覆った状態において、キャビティ２６内の空間と基体３の外空間とが通路３２により連通している。 In the light emitting device 1 according to Embodiment 1, a cavity 26 is formed in the center of the base 3 so as to open upward. As shown in FIG. 1, the lower surface of the cavity 26 is provided with a light emitting element accommodating portion for accommodating the light emitting element 2, and the light emitting element 2 (a substrate having the light emitting element 2) is disposed in the light emitting element accommodating portion. The cavity 26 has, for example, an octagonal shape when viewed from above, and the light emitting element housing portion has, for example, a rectangular shape with rounded corners. In the first embodiment, the “recessed portion of the substrate” according to the present invention means a combination of the cavity 26 and the light emitting element accommodating portion provided in the cavity 26. Further, in the embodiment in which the light emitting element 2 (the substrate having the light emitting element 2) is arranged directly on the bottom surface of the cavity 26 without having the light emitting element accommodating portion, the “concave portion of the substrate” according to the present invention means the cavity 26. To do.
In addition, a lid placing portion 27 on which the lid 4 is placed is formed around the cavity 26. An annular raised portion 28 having a substantially octagonal shape is formed along the cavity 26 in a region near the cavity 26 on the upper surface of the lid placing portion 27. Furthermore, a passage 32 for ventilation is formed from the two opposing sides 29 of the substantially octagonal cavity 26 to the side 30 of the base 3 facing the side 29. By providing the passage 32, the reflow process can be performed safely and reliably, and the temperature difference between the internal space of the cavity 26 and the outside of the substrate 3 is caused by a rapid change in the temperature and humidity of the external environment. Even when condensation occurs inside the member 5 and the translucent member 5 becomes cloudy, the temperature and humidity between the internal space of the cavity 26 and the outside of the substrate 3 are made uniform in a short time to remove the fog. be able to. A first radial ridge 33 extending from the annular ridge 28 to the side 30 of the base 3 is formed on both sides of the passage 32. Between the pair of first radial ridges 33 formed on both sides of each passage 32, the annular ridge 28 is not formed, and the annular ridge 28 and the first radial ridge 33 are continuous. ing. With this configuration, the space in the cavity 26 communicates with the outer space of the substrate 3 through the passage 32 in a state where the substrate 3 is covered with the lid 4.

通路３２が形成された方向と垂直な方向には、環状の隆起部２８から基体３の辺３１へ延びる第２の放射状隆起部３４が形成されている。基体３を蓋体４で覆った状態において、一対の第１の放射状隆起部３３のうち一方と、環状の隆起部２８と、第２の放射状隆起部３４と、蓋体４の下面と、蓋体載置部２７の上面と、により囲まれて接着材が充填される接着材充填領域Ｂが形成され、接着材が当該接着材充填領域Ｂに充填されることにより蓋体４が基体３に固定される。実施の形態１では、図２に示すように、上面視略矩形の基体３の４つの角付近にそれぞれ接着材充填領域Ｂが形成されている。接着材充填領域Ｂの中央付近には、有底の凹部３５が形成され、当該凹部３５に接着材が流れ込み過剰の接着材が基体３の外周面に溢れ出ることを抑制する。また、接着材が凹部３５に流れ込み固化することで、アンカー効果により接着強度が向上する。   In a direction perpendicular to the direction in which the passage 32 is formed, a second radial ridge 34 extending from the annular ridge 28 to the side 31 of the base 3 is formed. In a state where the base 3 is covered with the lid 4, one of the pair of first radial ridges 33, the annular ridge 28, the second radial ridge 34, the lower surface of the lid 4, the lid An adhesive filling region B that is surrounded by the upper surface of the body mounting portion 27 and is filled with an adhesive is formed, and the adhesive 4 is filled in the adhesive filling region B, whereby the lid 4 is attached to the base 3. Fixed. In the first embodiment, as shown in FIG. 2, adhesive filling regions B are formed in the vicinity of the four corners of the substrate 3 that is substantially rectangular when viewed from above. A bottomed concave portion 35 is formed near the center of the adhesive filling region B, and the adhesive flows into the concave portion 35 to prevent excess adhesive from overflowing to the outer peripheral surface of the base 3. In addition, the adhesive material flows into the concave portion 35 and solidifies, whereby the adhesive strength is improved by the anchor effect.

また、環状の隆起部２８、第１の放射状隆起部３３、第２の放射状隆起部３４の高さは略一致することが好ましい。これら隆起部の高さは特に限定されるものではないが、これらの高さは、０．０１ｍｍ〜０．２ｍｍ、より好ましくは、０．０２ｍｍ〜０．１ｍｍである。このような高さであれば、接着材充填領域Ｂに適量の接着材を充填することができ、良好な接着効果を得ることができる。   Moreover, it is preferable that the heights of the annular ridge 28, the first radial ridge 33, and the second radial ridge 34 substantially coincide. Although the height of these protruding parts is not particularly limited, these heights are 0.01 mm to 0.2 mm, and more preferably 0.02 mm to 0.1 mm. With such a height, an appropriate amount of adhesive can be filled in the adhesive filling region B, and a good adhesive effect can be obtained.

実施の形態１における基体３には、発光素子２や外部の電極と電気的に接続される導電部材（不図示）が配置される。基体３の材料としては、ガラスエポキシ、樹脂、セラミックスなどの絶縁性部材が挙げられる。特に、前述の導電部材として、耐熱性および耐候性の高いセラミックスからなることが好ましく、そのようなセラミックス材料としては、アルミナ、窒化アルミニウム、ムライトなどが好ましい。なお、セラミックスからなる基体であっても、セラミックス以外の絶縁性材料からなる絶縁層をその一部に有していてもよい。このような材料としては、例えば、ＢＴレンジ、ガラスエポキシ、エポキシ系樹脂等が挙げられる。   Conductive members (not shown) that are electrically connected to the light emitting element 2 and external electrodes are disposed on the base 3 in the first embodiment. Examples of the material of the substrate 3 include insulating members such as glass epoxy, resin, and ceramics. In particular, the above-mentioned conductive member is preferably made of a ceramic having high heat resistance and weather resistance, and as such a ceramic material, alumina, aluminum nitride, mullite and the like are preferable. In addition, even if it is a base | substrate which consists of ceramics, you may have the insulating layer which consists of insulating materials other than ceramics in that part. Examples of such materials include BT range, glass epoxy, epoxy resin, and the like.

また、基体３は、正負一対のリード電極を導電部材として、成形樹脂にてインサート成形することもできる。そのような材料として、例えば、熱可塑性樹脂、熱硬化性樹脂等、具体的には、ポリフタルアミド（ＰＰＡ）、ポリカーボネート樹脂、ポリフェニレンサルファイド（ＰＰＳ）、液晶ポリマー（ＬＣＰ）、アクリロニトリルブタジエンスチレン（ＡＢＳ）樹脂、エポキシ樹脂、フェノール樹脂、アクリル樹脂、ポリブチレンテレフタレート（ＰＢＴ）樹脂等の樹脂が好ましい。   The base 3 can be insert-molded with a molding resin using a pair of positive and negative lead electrodes as a conductive member. Examples of such materials include thermoplastic resins and thermosetting resins, such as polyphthalamide (PPA), polycarbonate resin, polyphenylene sulfide (PPS), liquid crystal polymer (LCP), acrylonitrile butadiene styrene (ABS). ) Resins such as resin, epoxy resin, phenol resin, acrylic resin, polybutylene terephthalate (PBT) resin are preferred.

（基体３と蓋体４との接合）
前述したように、基体３は上面が、透光性部材５と枠材６とを有する蓋体４のうち、枠材６と接合され、基体３の凹部（キャビティ２６）を覆う。ここで、基体３の上面と凹部（キャビティ２６）との境界は、透光性部材５と枠材６との接合部１０より内側にあることが好ましい。これにより、凹部（キャビティ２６）からの光を枠材６で遮ることなく、効率よく外部に放出することができる。さらには、反射防止層１２を好ましい位置に形成することが可能となる。この理由を以下に説明する。
反射防止層１２は、透光性部材５のうち、基体３の凹部（キャビティ２６）の上方から、凹部（キャビティ２６）の上方より外側まで延在して設けられることが好ましく、これにより凹部からの光を効率よく外部に放出することができるが、ここで反射防止層１２は、透光性部材５と枠材６との接合部から離間して形成する必要がある。つまり、基体３の上面と凹部（キャビティ２６）との境界と、接合部１０との間に、反射防止層１２の外周が位置するように設けることができ、配光特性と凹部（キャビティ２６）から光を効率よく外部に放出することとの両立が容易に達成できることとなる。 (Bonding of base 3 and lid 4)
As described above, the upper surface of the base 3 is joined to the frame 6 in the lid 4 having the translucent member 5 and the frame 6 and covers the recess (cavity 26) of the base 3. Here, the boundary between the upper surface of the base 3 and the recess (cavity 26) is preferably inside the joint 10 between the translucent member 5 and the frame member 6. Thereby, the light from the recess (cavity 26) can be efficiently emitted to the outside without being blocked by the frame member 6. Furthermore, the antireflection layer 12 can be formed at a preferred position. The reason for this will be described below.
The antireflection layer 12 is preferably provided so as to extend from above the concave portion (cavity 26) of the base 3 to the outside from above the concave portion (cavity 26) of the translucent member 5. The antireflection layer 12 needs to be formed away from the joint between the translucent member 5 and the frame member 6. That is, the antireflection layer 12 can be provided so that the outer periphery of the antireflection layer 12 is positioned between the boundary between the upper surface of the substrate 3 and the recess (cavity 26) and the joint 10. Therefore, it is possible to easily achieve the coexistence of efficiently emitting light to the outside.

また、基体３の上面と凹部（キャビティ２６）との境界が、接合部１０より内側にあって、さらに基体３の上面と凹部（キャビティ２６）との境界が、八角形であることで、発光装置を小型で維持しつつ、基体の上面３と枠材６との接合領域を大きくとることができ、基体と蓋体との強い密着性を得ることができる。加えて、上述したように上面視略矩形の基体３の４つの角付近にそれぞれ接着材充填領域Ｂ（接合領域）を確保することができるが、この接合領域の確保と、環状の隆起部２８から基体３の辺３０へ延びる第１の放射状隆起部３３を有することにより確保される通路３２の距離の最短化との両立が容易に達成できることとなる。通路３２の距離は発光装置を使用中、使用後においても、凹部（キャビティ２６）内の空間と基体３の外空間との間を常に連通させておく必要があり、この通路が短いことで、埃の付着などにより通路が詰まる恐れを極力低減することができるので好ましい。   Further, the boundary between the upper surface of the substrate 3 and the recess (cavity 26) is inside the joint portion 10, and the boundary between the upper surface of the substrate 3 and the recess (cavity 26) is octagonal, thereby emitting light. While maintaining the apparatus in a small size, the bonding area between the upper surface 3 of the base and the frame member 6 can be increased, and strong adhesion between the base and the lid can be obtained. In addition, as described above, adhesive filling regions B (joining regions) can be secured in the vicinity of the four corners of the base body 3 that is substantially rectangular when viewed from above, but the securing of the joining regions and the annular raised portion 28 are ensured. Thus, it is possible to easily achieve coexistence with the shortening of the distance of the passage 32 ensured by having the first radial ridge 33 extending from the base 3 to the side 30 of the base 3. The distance of the passage 32 needs to always communicate between the space in the recess (cavity 26) and the outer space of the base body 3 even after using the light emitting device, and because this passage is short, This is preferable because the risk of clogging the passage due to dust adhesion or the like can be reduced as much as possible.

（発光素子）
発光素子２を構成する半導体発光素子としては、ＺｎＳｅやＧａＮなどの種々の半導体を使用したものを挙げることができるが、蛍光物質を有する発光装置とする場合には、その蛍光物質を効率良く励起することができる短波長の光を発光可能な窒化物半導体（ＩｎＸＡｌＹＧａ１−Ｘ−ＹＮ、０≦Ｘ、０≦Ｙ、Ｘ＋Ｙ≦１）が好適に挙げられる。他の発光素子としては、基板上に、III−Ｖ族化合物半導体、II−ＶI族化合物半導体等、種々の半導体によって、活性層を含む積層構造が形成されたものが挙げられる。基板としては、Ｃ面、Ａ面、Ｒ面のいずれかを主面とするサファイアやスピネル（ＭｇＡｌ２Ｏ４）のような絶縁性基板、または窒化珪素（６Ｈ、４Ｈ、３Ｃ）、シリコン、ＺｎＳ、ＺｎＯ、ＧａＡｓ、ダイヤモンド；ニオブ酸リチウム、ガリウム酸ネオジウム等の酸化物基板、窒化物半導体基板（ＧａＮ、ＡｌＮ等）等が挙げられる。半導体の構造としては、ＭＩＳ接合、ＰＩＮ接合、ＰＮ接合などのホモ構造、ヘテロ構造あるいはダブルヘテロ構造のものが挙げられる。また、半導体活性層を量子効果が生ずる薄膜に形成させた単一量子井戸構造、多重量子井戸構造としてもよい。活性層には、Ｓｉ、Ｇｅ等のドナー不純物及び／又はＺｎ、Ｍｇ等のアクセプター不純物がドープされる場合もある。得られる発光素子の発光波長は、半導体の材料、混晶比、活性層のＩｎＧａＮのＩｎ含有量、活性層にドープする不純物の種類を変化させるなどによって、発光波長を種々選択することができる。発光波長としては、例えば４３０ｎｍ以下、好ましくは４０５ｎｍ以下が、つまり紫外光発光の発光素子が好ましい。 (Light emitting element)
Examples of the semiconductor light emitting element constituting the light emitting element 2 include those using various semiconductors such as ZnSe and GaN. In the case of a light emitting device having a fluorescent material, the fluorescent material is efficiently excited. capable of emitting nitride semiconductor light of short wavelength that can be (in X Al Y Ga 1- X-Y N, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1) is preferably exemplified. Examples of other light-emitting elements include those in which a stacked structure including an active layer is formed on a substrate by various semiconductors such as a III-V group compound semiconductor and a II-VI group compound semiconductor. As a substrate, an insulating substrate such as sapphire or spinel (MgAl 2 O 4 ) whose main surface is any of C-plane, A-plane, and R-plane, or silicon nitride (6H, 4H, 3C), silicon, ZnS ZnO, GaAs, diamond; oxide substrates such as lithium niobate and neodymium gallate, nitride semiconductor substrates (GaN, AlN, etc.), and the like. Examples of the semiconductor structure include homostructures such as MIS junctions, PIN junctions, and PN junctions, heterostructures, and double heterostructures. Alternatively, the semiconductor active layer may have a single quantum well structure or a multiple quantum well structure in which a thin film in which a quantum effect is generated is formed. The active layer may be doped with donor impurities such as Si and Ge and / or acceptor impurities such as Zn and Mg. The emission wavelength of the obtained light-emitting element can be variously selected by changing the semiconductor material, the mixed crystal ratio, the In content of InGaN in the active layer, the type of impurities doped in the active layer, and the like. The emission wavelength is, for example, 430 nm or less, preferably 405 nm or less, that is, a light emitting element that emits ultraviolet light is preferable.

発光素子２と基体３とを固定する接着材（図示せず）は、例えば、金ペーストや銀ペーストのような導電性接着材や、Ａｕ、Ａｇ、Ｂｉ、Ｃｕ、Ｉｎ、Ｐｂ、ＳｎおよびＺｎから選択された少なくとも一種を含む共晶材（例えば、Ａｕ−Ｓｎ）、あるいはＡｕおよびＡｇから選択された少なくとも一種を含む鑞材を選択することができる。このような金属材料を含む接着材とすることにより、発光素子２の裏面に配置された電極（不図示）と、基体３の導電部材（不図示）とを電気的に接続させたり、発光素子２からの放熱性を向上させたりすることができる。また、発光素子２と基体３とを固定する接着材は、例えば、エポキシ樹脂やシリコーン樹脂などの透光性樹脂を選択することができる。   The adhesive (not shown) for fixing the light emitting element 2 and the substrate 3 is, for example, a conductive adhesive such as gold paste or silver paste, Au, Ag, Bi, Cu, In, Pb, Sn, and Zn. A eutectic material containing at least one selected from (for example, Au-Sn), or a brazing material containing at least one selected from Au and Ag can be selected. By using an adhesive containing such a metal material, an electrode (not shown) disposed on the back surface of the light emitting element 2 and a conductive member (not shown) of the base 3 can be electrically connected, or the light emitting element The heat dissipation from 2 can be improved. In addition, as an adhesive for fixing the light emitting element 2 and the substrate 3, for example, a translucent resin such as an epoxy resin or a silicone resin can be selected.

実施の形態１に係る発光装置１によれば、反射防止層１２が、透光性部材５と枠材６との接合部１０から離間して形成されているため、言い換えれば、接合部１０と、反射防止層１２との間に、反射防止層１２が存在しない領域Ａ（Ａ１、Ａ２）が形成されているため、配光特性に優れる発光装置を提供することができる。 According to the light emitting device 1 according to Embodiment 1, the antireflection layer 12 is formed away from the joint 10 between the translucent member 5 and the frame member 6, in other words, with the joint 10. Since the region A (A 1 , A 2 ) where the antireflection layer 12 does not exist is formed between the antireflection layer 12, a light emitting device having excellent light distribution characteristics can be provided.

（実施の形態２）
図６は、実施の形態２に係る発光装置１に用いられる蓋体４の断面図である。実施の形態２では、図６に示すように、透光性部材５の上面２１と枠材６の上面２２とが面一となるように配置されている。実施の形態２では、実施の形態１と同様に、枠材６の中央付近に開口部１４が形成され、開口部１４の内周面１８に、透光性部材５を保持するための保持部１６が形成されている点で実施の形態２は実施の形態１と一致するが、実施の形態１では透光性部材５が枠材６に対して上側に突出しているのに対して、実施の形態２では透光性部材５の上面２１が枠材６の上面２２と面一に形成されている点で実施の形態２は実施の形態１と異なる。その他の構成については、実施の形態１と同様である。実施の形態２において、本発明に係る「前記反射防止層が、透光性部材と前記枠材との接合部から離間して形成されてなる」とは、透光性部材５の上面２１において、透光性部材５と枠材６との接合部１０と、上側反射防止層１２との間の領域（すなわち、透光性部材５の上面２１において、上側反射防止層１２が形成された領域から透光性部材５の側面２０までの領域）Ａ１、並びに、透光性部材５の下面２３において、透光性部材５と枠材６との接合部１０と、下側反射防止層１２との間の領域Ａ２に反射防止層１２が存在しないことを意味する。このような構成とすることにより、上記と同様の効果を得ることができるとともに、透光性部材５の上面２１と、枠材６の上面２２とが面一に形成されているため、審美性に優れ、また透光性部材５の側面２０が露出しておらず、側面２０が障害とならないため好適である。 (Embodiment 2)
FIG. 6 is a cross-sectional view of the lid body 4 used in the light emitting device 1 according to the second embodiment. In the second embodiment, as shown in FIG. 6, the upper surface 21 of the translucent member 5 and the upper surface 22 of the frame member 6 are arranged to be flush with each other. In the second embodiment, as in the first embodiment, the opening 14 is formed near the center of the frame member 6, and the holding portion for holding the translucent member 5 on the inner peripheral surface 18 of the opening 14. The second embodiment is identical to the first embodiment in that 16 is formed. However, in the first embodiment, the translucent member 5 protrudes upward with respect to the frame member 6. In the second embodiment, the second embodiment is different from the first embodiment in that the upper surface 21 of the translucent member 5 is formed flush with the upper surface 22 of the frame member 6. Other configurations are the same as those in the first embodiment. In Embodiment 2, according to the present invention, “the antireflection layer is formed apart from the joint between the translucent member and the frame member” means that the upper surface 21 of the translucent member 5 is A region between the joint 10 of the translucent member 5 and the frame member 6 and the upper antireflection layer 12 (that is, a region where the upper antireflection layer 12 is formed on the upper surface 21 of the translucent member 5). To the side surface 20 of the translucent member 5) A 1 , and the lower surface 23 of the translucent member 5, the joint 10 between the translucent member 5 and the frame member 6, and the lower antireflection layer 12. This means that the antireflection layer 12 does not exist in the region A2 between the two . With such a configuration, the same effect as described above can be obtained, and the upper surface 21 of the translucent member 5 and the upper surface 22 of the frame member 6 are formed flush with each other. It is preferable because the side surface 20 of the translucent member 5 is not exposed and the side surface 20 does not become an obstacle.

（実施の形態３）
図７は、実施の形態３に係る発光装置１に用いられる蓋体４の断面図である。実施の形態３では、図７に示すように、上述した保持部を有せず、さらに透光性部材５の上面２１と枠材６の上面２２とが面一に形成されている。実施の形態３では、透光性部材５の上面２１が枠材６の上面２２と面一に形成されているのに対し、実施の形態１では、透光性部材５が枠材６に対して上側に突出して形成されている点、さらに、実施の形態３では、透光性部材５を保持するための保持部１６を有せず透光性部材５の外周面２０と枠材６の内周面１８とが当接しこれらが融着されて透光性部材５が枠材６に固定されているのに対して、実施の形態１では、枠材６の開口部１４の内周面１８に開口部１４の内方に向かって突出して形成された保持部１６に透光性部材５が融着されて透光性部材５が枠材６に固定されている点で、実施の形態３は実施の形態１と異なる。その他の構成については、実施の形態１と同様である。 (Embodiment 3)
FIG. 7 is a cross-sectional view of lid 4 used in light-emitting device 1 according to Embodiment 3. In the third embodiment, as shown in FIG. 7, the holding portion described above is not provided, and the upper surface 21 of the translucent member 5 and the upper surface 22 of the frame member 6 are formed flush with each other. In the third embodiment, the upper surface 21 of the translucent member 5 is formed flush with the upper surface 22 of the frame member 6, whereas in the first embodiment, the translucent member 5 is disposed with respect to the frame member 6. Further, in the third embodiment, the outer peripheral surface 20 of the translucent member 5 and the frame member 6 are not provided with the holding portion 16 for holding the translucent member 5 in the third embodiment. Whereas the inner peripheral surface 18 abuts and these are fused and the translucent member 5 is fixed to the frame member 6, in the first embodiment, the inner peripheral surface of the opening 14 of the frame member 6. The translucent member 5 is fused to a holding portion 16 formed so as to protrude toward the inside of the opening 14 at 18, and the translucent member 5 is fixed to the frame member 6. 3 is different from the first embodiment. Other configurations are the same as those in the first embodiment.

実施の形態３において、本発明に係る「前記反射防止層が、透光性部材と前記枠材との接合部から離間して形成されてなる」とは、透光性部材５の上面２１において、透光性部材５と枠材６との接合部１０と、上側反射防止層１２との間の領域（すなわち、透光性部材５の上面２１において、上側反射防止層１２が形成された領域から透光性部材５の側面２０までの領域）Ａ１、並びに、透光性部材５の下面２３において、透光性部材５と枠材６との接合部１０と、下側反射防止層１２との間の領域（すなわち、透光性部材５の下面２３において、下側反射防止層１２が形成された領域から透光性部材５の側面２０までの領域）Ａ２に反射防止層１２が存在しないことを意味する。実施の形態３では、保持部が設けられていないため、発光装置１の薄型化を図ることができるとともに、上述のように、透光性部材５の上面２１と枠材６の上面２２とが面一に形成されているため、審美性に優れ、また透光性部材５の側面２０が露出しておらず、側面２０が障害とならないため好適である。 In Embodiment 3, according to the present invention, “the antireflection layer is formed away from the joint between the translucent member and the frame member” means that on the upper surface 21 of the translucent member 5. A region between the joint 10 of the translucent member 5 and the frame member 6 and the upper antireflection layer 12 (that is, a region where the upper antireflection layer 12 is formed on the upper surface 21 of the translucent member 5). To the side surface 20 of the translucent member 5) A 1 , and the lower surface 23 of the translucent member 5, the joint 10 between the translucent member 5 and the frame member 6, and the lower antireflection layer 12. The antireflection layer 12 is located in a region A 2 (that is, the region from the lower surface 23 of the translucent member 5 where the lower antireflection layer 12 is formed to the side surface 20 of the translucent member 5) A2. It means not existing. In Embodiment 3, since the holding part is not provided, the light emitting device 1 can be thinned, and the upper surface 21 of the translucent member 5 and the upper surface 22 of the frame member 6 are formed as described above. Since it is formed flush, it is excellent in aesthetics, and the side surface 20 of the translucent member 5 is not exposed and the side surface 20 does not become an obstacle.

（実施の形態４）
図８は、実施の形態４に係る発光装置１に用いられる蓋体４の断面図である。実施の形態４では、図８に示すように、枠材６の開口部１４の内周面１８の上部に、透光性部材５を保持する保持部１６を有する。実施の形態４では、保持部１６は、枠材６の開口部１４の内周面１８の上部に設けられ、保持部１６の下面と透光性部材５の上面２１の外縁部分及び側面２０とが融着されて固定されているのに対して、実施の形態１では、保持部１６は、枠材６の開口部１４の内周面１８の下部に設けられ、保持部１６の上面と透光性部材５の下面２３の外縁部分及び側面２０の一部とが融着されて固定されている点で、実施の形態４は実施の形態１と異なる。その他の構成については、実施の形態１と同様である。 (Embodiment 4)
FIG. 8 is a cross-sectional view of lid 4 used in light-emitting device 1 according to Embodiment 4. In the fourth embodiment, as shown in FIG. 8, the holding portion 16 that holds the translucent member 5 is provided on the inner peripheral surface 18 of the opening portion 14 of the frame member 6. In the fourth embodiment, the holding portion 16 is provided on the upper part of the inner peripheral surface 18 of the opening 14 of the frame member 6, and the outer edge portion and the side surface 20 of the lower surface of the holding portion 16 and the upper surface 21 of the translucent member 5. In the first embodiment, the holding portion 16 is provided below the inner peripheral surface 18 of the opening portion 14 of the frame member 6, and is transparent to the upper surface of the holding portion 16. The fourth embodiment differs from the first embodiment in that the outer edge portion of the lower surface 23 of the optical member 5 and a part of the side surface 20 are fused and fixed. Other configurations are the same as those in the first embodiment.

実施の形態４において、本発明に係る「前記反射防止層が、透光性部材と前記枠材との接合部から離間して形成されてなる」とは、透光性部材５の上面２１において、透光性部材５と枠材６との接合部１０と、上側反射防止層１２との間の領域Ａ１、並びに、透光性部材５の下面２３において、透光性部材５と枠材６との接合部１０と、下側反射防止層１２との間の領域（すなわち、透光性部材５の下面２３において、下側反射防止層１２が形成された領域から透光性部材５の側面２０までの領域）Ａ２に反射防止層１２が存在しないことを意味する。このような構成とすることにより、保持部１６が透光性部材５の上側に位置するため透光性部材５が保持部１６より上方に移動できないため透光性部材５が枠材６から離脱しにくくなる。したがって、実施の形態４では、信頼性の高い発光装置を提供することができる。 In Embodiment 4, according to the present invention, “the antireflection layer is formed apart from the joint portion between the translucent member and the frame member” refers to the upper surface 21 of the translucent member 5. In the region A 1 between the joint portion 10 between the translucent member 5 and the frame member 6 and the upper antireflection layer 12 and the lower surface 23 of the translucent member 5, the translucent member 5 and the frame member. 6 in the region between the joint portion 10 and the lower antireflection layer 12 (that is, from the region where the lower antireflection layer 12 is formed on the lower surface 23 of the translucent member 5). antireflective layer 12 in the region) a 2 up side 20 which means that there is no. With this configuration, since the holding portion 16 is positioned above the translucent member 5, the translucent member 5 cannot move above the holding portion 16, and thus the translucent member 5 is detached from the frame member 6. It becomes difficult to do. Therefore, in Embodiment 4, a highly reliable light-emitting device can be provided.

１ 発光装置
２ 発光素子
３ 基体
４ 蓋体
５ 透光性部材
６ 枠材
１２ 反射防止層 DESCRIPTION OF SYMBOLS 1 Light-emitting device 2 Light-emitting element 3 Base | substrate 4 Lid body 5 Translucent member 6 Frame material 12 Antireflection layer

Claims (15)

発光素子と、該発光素子を収容する凹部を有する基体と、前記発光素子の上部に離間して配置され前記基体の凹部を覆う蓋体と、を有してなり、
前記蓋体は、前記発光素子からの光を透過する透光性部材と、該透光性部材の外周に設けられ前記透光性部材を保持する枠材と、を有し、前記枠材が前記基体の上面と接合してなり、
前記透光性部材の上面および下面の少なくともいずれか一方の面に反射防止層が、前記透光性部材と前記枠材との接合部から離間して形成されてなることを特徴とする発光装置。 A light-emitting element, a base having a recess for accommodating the light-emitting element, and a lid that is disposed separately from the light-emitting element and covers the recess of the base.
The lid includes a translucent member that transmits light from the light emitting element, and a frame member that is provided on an outer periphery of the translucent member and holds the translucent member. Bonded to the upper surface of the substrate,
A light-emitting device, wherein an antireflection layer is formed on at least one of an upper surface and a lower surface of the translucent member so as to be separated from a joint portion between the translucent member and the frame member. . 前記反射防止層は、前記透光性部材における前記基体の凹部上方から、前記凹部上方より外側まで延在してなる請求項１に記載の発光装置。   The light-emitting device according to claim 1, wherein the antireflection layer extends from above the concave portion of the base of the translucent member to the outside from above the concave portion. 前記基体の上面と凹部との境界は、前記接合部より内側にある請求項１または２に記載の発光装置。   The light-emitting device according to claim 1, wherein a boundary between the upper surface of the base and the concave portion is on an inner side than the joint portion. 前記基体の上面と凹部との境界は、八角形である請求項１乃至３のいずれかに記載の発光装置。   The light emitting device according to any one of claims 1 to 3, wherein a boundary between the upper surface of the base and the recess is an octagon. 前記枠材は、内側の開口が円形である請求項１乃至４のいずれかに記載の発光装置。   The light emitting device according to claim 1, wherein the frame member has a circular inner opening. 前記反射防止層と前記接合部との間の距離が、０．２ｍｍ〜０．６ｍｍである請求項１乃至５のいずれかに記載の発光装置。   The light emitting device according to claim 1, wherein a distance between the antireflection layer and the joint is 0.2 mm to 0.6 mm. 前記枠材は、コバール、ニッケル・鉄、およびインバーなどのニッケル鉄合金からなる群から選択された少なくとも一種により構成されている請求項１乃至６のいずれかに記載の発光装置。   The light emitting device according to claim 1, wherein the frame member is made of at least one selected from the group consisting of nickel iron alloys such as kovar, nickel / iron, and invar. 前記透光性部材が、ホウ珪酸ガラス、石英ガラス、サファイアガラス、フッ化カルシウムガラス、アルミノホウ珪酸ガラス、オキシナイトライドガラス、カルコゲナイドガラスからなる群から選択された少なくとも１種により構成されている請求項１乃至７のいずれかに記載の発光装置。   The translucent member is made of at least one selected from the group consisting of borosilicate glass, quartz glass, sapphire glass, calcium fluoride glass, aluminoborosilicate glass, oxynitride glass, and chalcogenide glass. The light emitting device according to any one of 1 to 7. 前記透光性部材の熱膨張係数と前記枠材の熱膨張係数とが同じである請求項１乃至８のいずれかに記載の発光装置。   The light emitting device according to any one of claims 1 to 8, wherein a thermal expansion coefficient of the translucent member and a thermal expansion coefficient of the frame member are the same. 前記透光性部材の上面と前記枠材の上面とが面一である請求項１乃至９のいずれかに記載の発光装置。   The light emitting device according to claim 1, wherein an upper surface of the translucent member and an upper surface of the frame member are flush with each other. 前記反射防止層が形成されていない領域の面積と、前記反射防止層が形成されている領域の面積との比率が、１：２〜１：５である請求項１乃至１０のいずれかに記載の発光装置。   The ratio of the area of the region where the antireflection layer is not formed to the area of the region where the antireflection layer is formed is 1: 2 to 1: 5. Light-emitting device. 発光素子と、該発光素子を収容する凹部を有する基体と、前記発光素子の上部に離間して配置され前記基体の凹部を覆う蓋体と、を有してなり、
前記蓋体は、前記発光素子からの光を透過する透光性部材と、該透光性部材の外周に設けられ前記透光性部材を保持する枠材と、を有し、前記枠材が前記基体の上面と接合してなり、
前記基体の上面と凹部との境界は、前記接合部より内側にあることを特徴とする発光装置。 A light-emitting element, a base having a recess for accommodating the light-emitting element, and a lid that is disposed separately from the light-emitting element and covers the recess of the base.
The lid includes a translucent member that transmits light from the light emitting element, and a frame member that is provided on an outer periphery of the translucent member and holds the translucent member. Bonded to the upper surface of the substrate,
The boundary between the upper surface of the said base | substrate and a recessed part exists inside the said junction part, The light-emitting device characterized by the above-mentioned. 前記基体の上面と凹部との境界は、八角形である請求項１２に記載の発光装置。   The light emitting device according to claim 12, wherein a boundary between the upper surface of the substrate and the concave portion is an octagon. 前記枠材は、内側の開口が円形である請求項１２または１３に記載の発光装置。   The light emitting device according to claim 12 or 13, wherein the frame member has a circular inner opening. 前記透光性部材の上面および下面の少なくともいずれか一方の面に反射防止層が形成されてなる請求項１２乃至１４のいずれかに記載の発光装置。   The light emitting device according to any one of claims 12 to 14, wherein an antireflection layer is formed on at least one of an upper surface and a lower surface of the translucent member.
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