KR880001180A - 인쇄회로장치 - Google Patents

인쇄회로장치 Download PDF

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Publication number
KR880001180A
KR880001180A KR870005620A KR870005620A KR880001180A KR 880001180 A KR880001180 A KR 880001180A KR 870005620 A KR870005620 A KR 870005620A KR 870005620 A KR870005620 A KR 870005620A KR 880001180 A KR880001180 A KR 880001180A
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KR
South Korea
Prior art keywords
printed circuit
circuit device
chip
circuit board
semiconductor
Prior art date
Application number
KR870005620A
Other languages
English (en)
Other versions
KR950013744B1 (ko
Inventor
히로시 오꾸아끼
Original Assignee
하시모도 나미오
오끼뎅끼 고오교오 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority claimed from JP61129488A external-priority patent/JPS62286259A/ja
Priority claimed from JP61157264A external-priority patent/JPS6313351A/ja
Application filed by 하시모도 나미오, 오끼뎅끼 고오교오 가부시끼가이샤 filed Critical 하시모도 나미오
Publication of KR880001180A publication Critical patent/KR880001180A/ko
Application granted granted Critical
Publication of KR950013744B1 publication Critical patent/KR950013744B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
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    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
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    • H01L23/293—Organic, e.g. plastic
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    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H01L2924/1617—Cavity coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

내용 없음

Description

인쇄회로장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2도는 본 발명에 의한 인쇄회로장치의 제1실시예를 도시하는 단면도. 제3도는 본 발명에 의한 인쇄회로장치의 제조과정을 도시하는 사시도. 제4도는 본 발명에 의한 인쇄회로 장치의 제2실시예를 도시하는 평면도.

Claims (16)

  1. 구성요소로서 (a)반도체소자 설치부위(23) 및 여러개의 전도성 배선층(22)을 표면에 구비하는 인쇄회로판(21), (b)상기 반도체소자 설치부위(23)에 고정 설치되고 표면에 여러개의 전극들을 구비하는 반도체 IC 칩(26), (C)상기 인쇄회로판(21)에 구비된 전도성 배선층(22)과 상기 IC 칩(26)에 구비된 전극을 전기적으로 상호연결하는 전선(27), (d)상기 전도성 배선층(22)의 표면에 형성된 접착층(25), (e)상기 IC 칩(26)을 밀폐시키기 위해 상기 접착층(25)으로서 상기 인쇄회로판(21)에 고정설치시킨 밀폐커버(28), 등을 구비하는 인쇄회로장치.
  2. 제1항에 있어서 상기 밀폐커버(28)는 열가소성 수지로 만들어지는 것을 특징으로 하는 인쇄회로장치.
  3. 제3항에 있어서 상기 열가소성 수지는 폴리에틸렌, 폴리프로필렌 및 폴리메틸펜텐중 어느 하나인 것을 특징으로 하는 인쇄회로장치.
  4. 제4항에있어서 상기 밀폐커버(28)는 2중 구조로되고 그 상층은 금속으로 만들어지는 것을 특징으로하는 인쇄회로장치.
  5. 구성요소로서 (a)반도체소자 설치부위(23) 및 여러개의 전도성 배선층(22)을 표면에 구비하는 인쇄회로판(21), (b)상기 반도체소자 설치부위(23)에 고정 설치되고, 여러개의 전극들을 표면에 구비하는 반도체IC 칩(26), (c) 상기 인쇄회로판(21)에 구비된 전도성 배선층(22)과 상기 IC 칩(26)에 구비된 상기 전극들을 전기적으로 상호연결하는 전선(27), (d)상기 전도성 배선층의 표면들에 각각 형성된 접착층(25), (e)상기 인쇄회로판(21)상에 고정설치되고 상기 반도체 IC 칩(26)을 둘러싸는 프레임(57), (f)상기 프레임(57)내의 상기 반도체 IC 칩(26)전체를 밀폐하기 위한 밀폐용 물질, (g)상기 프레임(57)가 상기 IC 칩(26)을 밀폐하기 위해 상기 인쇄회로(21)상에 접착층(25)으로서 고정 설치시킨 밀폐커버(28), 등을 구비하는 인쇄회로장치.
  6. 제5항에 있어서 상기 밀폐커버(28)는 열가소성 물질로 만들어지는 것을 특징으로 하는 인쇄회로장치.
  7. 제6항에있어서, 상기 열가소성 수지는 폴리에틸렌, 폴리프로필렌, 및 폴리메틸펜텐중의 하나인 것을 특징으로하는 인쇄회로장치.
  8. 제5항에있어서 상기 밀폐커버(28)는 2중의 구조이며, 그 상층은 금속으로 만들어지는 것을 특징으로하는 인쇄회로장치.
  9. 제5항에있어서 상기 밀폐용 물질은 에폭시 수지, 실리콘 수지, 및 폴리이미드수지 중 하나인 것을 특징으로 하는 인쇄회로장치.
  10. 제5항에있어서 상기 IC 칩(26)은 EPROM 칩이며, 상기 밀폐커버(28) 및 밀폐용 물질은 각각 자외선 투과 수지로 구성되는 것을 특징으로 하는 인쇄회로장치.
  11. 제5항에있어서 상기 밀폐용 물질은 실리콘 수지로 구성되며 상기 밀폐커버(28)는 폴리메틸펜텐수지로 구성되는 것을 특징으로하는 인쇄회로장치.
  12. 구성요소로서 (a) 여러개의 반도체소자 설치부위(23)와 그 주위에 배치된 여러개의 전도성 배선층(22)을 표면에 구비하는 인쇄회로판(21), (b) 상기 설치부위중 최소한 하나의 각각 고정 설치되고 그 표면에 여러개의 전극을 각각 구비하는 여러개의 반도체 IC 칩 (26), (c)상기 인쇄회로판(21)의 전도성 배선층과 상기 IC 칩(26)의 상기 전극들을 전기적으로 상호 연결하는 전선(27) (d)상기 전도성 배선층(22)에 각각 형성된 접착층(25), (e)상기 여러개의 IC 칩(26)을 수용하기 위한 여러개의 오목한부위(48a)를 구비하고 상기 여러개의 IC칩(26)을 밀폐하기 위하여, 상기 접착층(25)을 이용하여 상기 인쇄회로판(21)에 고정 설치한 밀폐커버(28), 등을 구비하는 인쇄회로장치.
  13. 제12항에 있어서 상기 인쇄회로판(21)은 위치고정용 구멍을 구비하며 상기 밀폐커버(28)는 상기 구멍에 해당하는 부위에 위치 고정용 돌출부(48c)를 구비하는 것을 특징으로 하는 인쇄회로장치.
  14. 제12항에 있어서 상기 밀폐커버(28)는 열가소성수지로 구성되는 것을 특징으로하는 인쇄회로장치.
  15. 제14항에 있어서 상기 열가소성 수지는 폴리에틸렌, 폴리프로필렌 및 폴리메틸펜텐중 하나인 것을 특징으로하는 인쇄회로장치.
  16. 제12항에 있어서 상기 밀폐커버(28)는 2중 구조이며, 그 상층은 금속으로 만들어지는 것을 특징으로 하는 인쇄회로장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019870005620A 1986-06-04 1987-06-03 인쇄회로장치 KR950013744B1 (ko)

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JP61-129488 1986-06-04
JP129448 1986-06-04
JP61129488A JPS62286259A (ja) 1986-06-04 1986-06-04 半導体装置およびその製造方法
JP61157264A JPS6313351A (ja) 1986-07-04 1986-07-04 半導体装置およびその製造方法
JP157264 1986-07-04
JP61-157264 1986-07-04

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