KR950030321A - 반도체장치 및 그 제조방법 및 기판 - Google Patents
반도체장치 및 그 제조방법 및 기판 Download PDFInfo
- Publication number
- KR950030321A KR950030321A KR1019950009706A KR19950009706A KR950030321A KR 950030321 A KR950030321 A KR 950030321A KR 1019950009706 A KR1019950009706 A KR 1019950009706A KR 19950009706 A KR19950009706 A KR 19950009706A KR 950030321 A KR950030321 A KR 950030321A
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- South Korea
- Prior art keywords
- substrate
- semiconductor chip
- bonded
- holes
- semiconductor device
- Prior art date
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- 239000000758 substrate Substances 0.000 title claims abstract description 71
- 239000004065 semiconductor Substances 0.000 title claims abstract description 62
- 238000004519 manufacturing process Methods 0.000 title claims 2
- 239000000654 additive Substances 0.000 claims abstract 11
- 230000000996 additive effect Effects 0.000 claims abstract 11
- 239000002184 metal Substances 0.000 claims abstract 11
- 229910000679 solder Inorganic materials 0.000 claims abstract 2
- 239000011347 resin Substances 0.000 claims 5
- 229920005989 resin Polymers 0.000 claims 5
- 230000002093 peripheral effect Effects 0.000 claims 4
- 230000017525 heat dissipation Effects 0.000 claims 3
- 239000000919 ceramic Substances 0.000 claims 1
Classifications
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- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
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Abstract
본 발명은 BGA형의 반도체장치에 관한 것이며, 고주파신호특성의 향상의 실현을 목적으로 한다.
기판(31), 기판(31)상에 페이스다운 본딩된 반도체 칩(32)과, 기판 (31)상의 댐부재(33)과, 금속판(34)과, 기판(31)의 하면의 땜납볼(13A)를 갖는다. 기판(31)의 관통구멍은 충전코어부(52)에 의해 메워져 있다. 애디티브층(51)은 관통구멍의 부분에도 형성되어 있으며, 배선패턴(23A)은 관통구멍을 우회하지 않는 가장 짧은 경로를 갖는다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 제1실시예가 되는 BGA형 반도체장치를 나타낸 일부 절재사시도, 제2도는 제1도중의 Ⅱ-Ⅱ선에 따른 단면도, 제3도는 기판의 일부를 확대하여 나타낸 평면도.
Claims (21)
- 기판과, 기판의 상면에 고정되어 있는 반도체 칩과, 기판의 하면에 배치된 단자로 되며, 기판은, 복수의 관통구멍을 가지며, 각 관통구멍의 내부에 충전코어부를 갖는 기판본체와, 기판본체의 상면에 상기 관통구멍도 포함해서 형성되어 있는 애디티브층으로 되며, 에디티브층은, 관통구멍에 의해 제약을 받지않은 경로를 가지는 배선패턴을 갖는 구성으로 한 것을 특징으로 한 반도체장치.
- 제1항에 있어서, 기판은, 복수의 관통구멍을 가지며, 각 관통구멍의 내부에 충전코어부를 갖는 기판본체와, 기판본체의 상면에 상기 관통구멍도 포함해서 형성되어 있는 애디티브층으로 되며, 애디티브층은 상기 관통구멍의 위를 통하는 경로를 가지는 배선패턴을 갖는 구성으로 한 것을 특징으로 한 반도체장치.
- 복수의 관통구멍을 가지며, 각 관통구멍의 내부에 충전코어부를 갖는 기판본체와, 기판본체의 상면에 상기 관통구멍도 포함해서 형성되어 있는 애디티브층으로 되며, 애디티브층은, 관통구멍에 의해 제약을 받지않는 경로를 가지는 배선패턴을 갖는 구성의 기판의 상면에 반도체 칩을 고정하는 공정과, 상기 기판의 하면에 단자를 형성하는 공정으로 된 구성으로 한 것을 특징으로 하는 반도체장치의 제조방법.
- 기판과, 기판의 상면에 페이스다운 본딩되어 있는 반도체 칩과, 반도체 칩을 둘러싸고 상기 기판상에 접착되어 있는 틀 형상의 댐부재와, 댐부재, 및 반도체 칩의 위를 향한 뒷면에 접착되어 있는 금속판과, 상기 기판의 하면에 배치된 단자로 된 구성으로 한 것을 특징으로 한 반도체 장치.
- 기판과, 기판의 상면에 페이스다운 본딩되어 있는 반도체 칩과, 반도체 칩을 둘러싸고 상기 기판상에 접착되어 있는 틀 형상의 댐부재와, 개구를 가지며, 상기 댐부재, 및 반도체 칩의 위를 향한 뒷면중에서 주위측의 부분에 접착되어있는 금속판과, 상기 기판의 하면에 배치된 단자로 되며, 상기 반도체 칩의 뒷면이 노출된 구성으로 한 것을 특징으로 한 반도체장치.
- 기판과, 기판의 상면에 페이스다운 본딩되어 있는 반도체 칩과, 반도체 칩을 둘러싸고 상기 기판상에 접착되어 있는 틀 형상의 댐부재와, 개구를 가지며, 상기 댐부재, 및 반도체 칩의 위를 향한 뒷면중에서 주위측의 부분에 접착되어있는 금속판과, 금속판의 개구로부터 노출한 상기 반도체 칩의 뒷면에 접착되어 있는 방열핀과, 상기 기판의 하면에 배치된 단자로 된 구성으로 한 것을 특징으로 한 반도체장치.
- 기판과, 기판의 상면에 페이스다운 본딩되어 있는 반도체 칩과, 반도체 칩의 상면에 접착되며, 또한 반도체 칩을 덮고, 주위의 부분이 상기 기판에 접착된 금속제의 캡과, 상기 기판의 하면에 배치된 단자로 된 구성으로 한 것을 특징으로 한 반도체장치.
- 기판과, 기판의 상면에 페이스다운 본딩되어 있는 반도체 칩과, 개구를 가지며, 개구의 주위의 부분이 상기 반도체 칩의 상면에 접착되고, 주위의 부분이 상기 기판에 접착된 금속제의 캡과, 상기 기판의 하면에 배치된 단자로 되며, 상기 반도체 칩의 뒷면이 노출한 구성으로 한 것을 특징으로 한 반도체장치.
- 기판과, 기판의 상면에 페이스다운 본딩되어 있는 반도체 칩과, 개구를 가지며, 개구의 주위의 부분이 상기 반도체 칩의 상면에 접착되고, 주위의 부분이 상기 기판에 접착된 금속제의 캡과, 캡의 개구로부터 노출되어 있는 상기 반도체 칩의 뒷면에 접착되어 있는 방열핀과, 상기 기판의 하면에 배치된 단자로 된 구성으로 한 것을 특징으로 한 반도체장치.
- 기판과, 기판의 상면에 페이스다운 본딩되어 있는 반도체 칩과, 반도체 칩을 둘러싸고 상기 기판상에 접착되어 있는 댐부재와, 댐부재의 내측에 형성되어 있고, 상기 반도체 칩을 봉지하는 수지패키지부와, 상기 기판의 하면에 배치된 단자로 된 구성으로 한 것을 특징으로 한 반도체장치.
- 기판과, 기판의 상면에 페이스다운 본딩되어 있는 반도체 칩과, 반도체 칩을 둘러싸고 상기 기판상에 접착되어 있는 댐부재와, 댐부재의 내측에 형성되어 있고, 상기 반도체 칩을 봉지하는 수지패키지부와, 수지패키지부에 접착되어 있는 방열핀과, 상기 기판의 하면에 배치된 단자로 된 구성으로 한 것을 특징으로 한 반도체장치.
- 기판과, 기판의 상면에 페이스다운 본딩되어 있는 반도체 칩과, 반도체 칩을 둘러싸고 상기 기판상에 접착되어 있는 댐부재와, 댐부재의 내측에 형성되어 있고, 상기 반도체 칩을 봉지하는 수지패키지부와, 수지패키지부에 접착되어 있는 금속판과, 상기 기판의 하면에 배치된 단자로 된 구성으로 한 것을 특징으로 한 반도체장치.
- 제3항∼제12항중의 어느 1항에 있어서, 상기 단자는 땜납 볼로 구성한 것을 특징으로 한 반도체장치.
- 복수의 관통구멍을 가지며, 각 관통구멍의 내부에 충전코어부를 갖는 기판본체와, 기판본체의 상면에 상기 관통구멍도 포함해서 형성되어 있는 애디티브층으로 되며, 애디티브층은 관통구멍에 의해 제약을 받지않는 경로를 가지는 배선패턴을 갖는 구성으로 한 것을 특징으로 한 기판.
- 복수의 관통구멍을 가지며, 각 관통구멍의 내부에 충전코어부를 갖는 기판본체와, 기판본체의 상면에 상기 관통구멍도 포함해서 형성되어 있는 애디티브층으로 되며, 애디티브층은, 상기 관통구멍의 위를 통하는 경로를 가지는 배선패턴을 갖는 구성으로 한 것을 특징으로 한 기판.
- 복수의 면에 전극을 갖는 반도체 칩과, 복수의 외부접속배선을 가지며, 반도체 칩의 일면에 형성된 제1의 전극을 소정의 제1의 외부접속배선에 플립칩(flip-chip) 접합함으로써 반도체 칩을 탐재하는 기판과, 반도체 칩을 덮도록 배설되며, 반도체 칩의 상기 일면과 다른 면에 형성된 단수 또는 복수의 제2의 전극과 기판에 형성된 소정의 제2의 외부접속배선을 전기적으로 접속하는 도전부재를 구비하는 것을 특징으로 한 반도체장치.
- 제16항에 있어서, 제2의 전극은 같은 전위의 전극으로 한 것을 특징으로 한 반도체장치.
- 제16항 또는 제17항에 있어서, 반도체 칩과 기판과의 접합위치에 제1의 전극과 제2의 전극을 전기적으로 분리하는 절연부재를 배설한 것을 특징으로 한 것을 특징으로 한 반도체장치.
- 제16항∼제18항중의 어느 1항에 있어서, 기판은 프린트배선기판 또는 세라믹기판 또는 프렉시블기판중의 어느 하나의 기판을 사용한 것을 특징으로 한 반도체장치.
- 제16∼제19항중의 어느 1항에 있어서, 반도체 칩을 복수개 배설하고, 복수의 반도체 칩에 각각 형성되어 있는 제2의 전극을 도전부재에 의해 제2의 외부접속배선에 전기적으로 접속한 것을 특징으로 한 반도체장치.
- 제16∼제19항중의 어느 1항에 있어서, 반도체 칩을 복수개 적층 배설하고, 그 상부에 위치한 반도체 칩에 형성된 제2의 전극을 도전부재에 의해 제2의 외부접속배선에 전기적으로 접속한 것을 특징으로 한 반도체장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
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-
1995
- 1995-03-17 JP JP7059562A patent/JP3034180B2/ja not_active Expired - Lifetime
- 1995-04-13 EP EP06116868A patent/EP1715512A3/en not_active Withdrawn
- 1995-04-13 DE DE69536084T patent/DE69536084D1/de not_active Expired - Lifetime
- 1995-04-13 EP EP95105640A patent/EP0685878B1/en not_active Expired - Lifetime
- 1995-04-13 EP EP01129844A patent/EP1198000A1/en not_active Withdrawn
- 1995-04-13 EP EP99101351A patent/EP0915504A1/en not_active Ceased
- 1995-04-25 KR KR1019950009706A patent/KR100199437B1/ko not_active IP Right Cessation
- 1995-04-28 TW TW091212186U patent/TW559338U/zh not_active IP Right Cessation
- 1995-04-28 TW TW092209806U patent/TW563902U/zh not_active IP Right Cessation
-
1997
- 1997-01-13 US US08/782,381 patent/US5729435A/en not_active Expired - Lifetime
- 1997-09-08 US US08/924,958 patent/US5978222A/en not_active Expired - Lifetime
-
1998
- 1998-11-18 US US09/195,232 patent/US6088233A/en not_active Expired - Fee Related
-
2000
- 2000-02-18 US US09/506,733 patent/US6184133B1/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20150110085A (ko) | 2014-03-24 | 2015-10-02 | 대남환경 주식회사 | 해상 오일 방제선 |
Also Published As
Publication number | Publication date |
---|---|
EP1198000A1 (en) | 2002-04-17 |
EP0915504A1 (en) | 1999-05-12 |
EP0685878A3 (en) | 1996-11-06 |
US6184133B1 (en) | 2001-02-06 |
US5729435A (en) | 1998-03-17 |
EP1715512A3 (en) | 2013-02-13 |
EP0685878A2 (en) | 1995-12-06 |
KR100199437B1 (ko) | 1999-06-15 |
JPH0817964A (ja) | 1996-01-19 |
TW559338U (en) | 2003-10-21 |
US6088233A (en) | 2000-07-11 |
US5978222A (en) | 1999-11-02 |
EP0685878B1 (en) | 2010-06-23 |
JP3034180B2 (ja) | 2000-04-17 |
EP1715512A2 (en) | 2006-10-25 |
DE69536084D1 (de) | 2010-08-05 |
TW563902U (en) | 2003-11-21 |
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