KR970030761A - 노치가 형성된 전도층을 포함한 패키지 - Google Patents

노치가 형성된 전도층을 포함한 패키지 Download PDF

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KR970030761A
KR970030761A KR1019960057066A KR19960057066A KR970030761A KR 970030761 A KR970030761 A KR 970030761A KR 1019960057066 A KR1019960057066 A KR 1019960057066A KR 19960057066 A KR19960057066 A KR 19960057066A KR 970030761 A KR970030761 A KR 970030761A
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conductive layer
hole
notches
package
pair
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KR100232385B1 (ko
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히로유끼 우찌다
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가네꼬 히사시
닛뽕덴끼 가부시끼가이샤
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Abstract

기판(1)과, 기판내에 형성된 전도층(2, 3)과, 제 1관통구멍(TH3)을 통하여 전도층에 접속된 내부 리드소자(8) 및 제 2관통구멍(TH1, TH2)을 통하여 전도층에 접속된 외부 리드소자(3, 4)를 포함하는 패키지에서, 노치(9, 10)는 제 1관통구멍과 제 2관통구멍에 근접하여 전도층 내에 형성된다.

Description

노치가 형성된 전도층을 포함한 패키지
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
도 3은 본 발명에 따른 패키지의 실시예 1을 나타내는 부분절단 투시도.

Claims (14)

  1. 기판(1)과, 기판내에 형성된 전도층(2, 3)과, 제 1관통구멍(TH3)을 통하여 전도층에 접속된 내부 리드소자(8)및 제2관통구멍(TH1, TH2)을 통하여 상기 전도층에 접속된 외부 리드소자(3, 4)를 구비하는 패키지에 있어서, 노치(9,10)가 상기 제1관통구멍 및 제2관통구멍에 근접하여 상기 전도층 내에 형성되는 것을 특징으로 하는 패키지.
  2. 제 1항에 있어서, 상기 노치(9)는 상기 제 1관통구멍과 제 2관통구멍의 바깥쪽에 위치되는 것을 특징으로 하는 패키지.
  3. 제 2항에 있어서, 상기 노치(10)는 상기 제 1관통구멍과 제 2관통구멍 사이의 상기 전도층의 부분(3a)의 바깥쪽에 위치되는 것을 특징으로 하는 패키지.
  4. 제 3항에 있어서, 상기 노치는 다른 전도층(11)을 따라 위치되는 것을 특징으로 하는 패키지.
  5. 제 4항에 있어서, 상기 노치들 사이의 간격은 상기 다른 전도층의 폭의 약 4배인 것을 특징으로 하는 패키지.
  6. 제 1항에 있어서, 상기 전도층에 접속된 바이패스 콘덴서(12)를 추가로 포함하는 것을 특징으로 하는 패키지.
  7. 제 6항에 있어서, 노치(12a, 12b)가 상기 바이패스 콘덴서와 상기 전도층의 접속부에 근접하여 상기 전도층내에 제공되는 것을 특징으로 하는 패키지.
  8. 박막 기판(1)과, 상기 박막 기판내에 형성된 제 1전도층 및 제 2전도층(2, 3)과, 제 1관통구멍을 통하여 상기 제 1전도층에 접속된 제 1내부리드 소자와, 제 1관통구멍(TH3)을 통하여 상기 제 1전도층에 접속된 제 2내부 리드 소자(8)와, 상기 제 3관통구멍(TH1)을 통하여 상기 제 1전도층에 접속된 제 1외부 리드 소자(8) 및 제 4관통구멍(TH2)을 통하여 상기 제 2전도층에 접속된 제 2외부 리드소자(8)를 구비하는 패키지에 있어서, 한쌍의 제 1노치가 상기 제 1관통구멍과 제 3관통구멍에 근접하여 상기 제 1전도층내에 각각 형성되며, 한쌍의 제 2노치(9)가 상기 제 2관통구멍과 제 2관통구멍에 근접하여 상기 제 2전도층내에 각각 형성되는 것을 특징으로 하는 패키지.
  9. 제 8항에 있어서, 상기 한쌍의 제 1노치는 상기 제 1관통구멍 및 제 3관통구멍의 바깥쪽에 위치되고, 상기 한쌍의 제 2노치는 상기 제 2관통구멍과 제 4관통구멍의 바깥쪽에 위치되는 것을 특징으로 하는 패키지.
  10. 제 8항에 있어서, 상기 한쌍의 제 1노치는 상기 제 1관통구멍과 제 3관통구멍 사이의 상기 제 1전도층의 부분의 바깥쪽에 위치되고, 상기 한쌍의 제 2노치는 상기 제 2관통구멍과 제 4관통구멍사이의 상기 한쌍의 제 2전도층 부분의 바깥쪽에 위치되는 것을 특징으로 하는 패키지.
  11. 제 10항에 있어서, 상기 한쌍의 제 1노치는 제 1신호층을 따라 위치되고, 상기 한쌍의 제 2노치는 제 2신호층(11)을 따라 위치되는 것을 특징으로 하는 패키지.
  12. 제 11항에 있어서, 상기 한쌍의 제 1노치 사이의 간격은 상기 제 1신호층의 폭의 약 4배이며, 상기 한쌍의 제 2노치사이의 간격은 상기 제 2신호층의 폭의 약 4배인 것을 특징으로 하는 패키지.
  13. 제 8항에 있어서, 제 5관통구멍(TH4)을 통하여 상기 제 1전도층에 접속된 제 1전극과, 제 6관통구멍(TH5)을 통하여 상기 제 2전도층에 접속된 제 2전극을 가진 바이패스 콘덴서(12)를 추가로 구비한 것을 특징으로 하는 패키지.
  14. 제 13항에 있어서, 노치(12a)가 상기 제 5관통구멍에 근접하여 상기 제 1전도층내에 제공되고, 노치(12b)가 상기 제 6관통구멍에 근접하여 상기 제 2전도층내에 제공되는 것을 특징으로 하는 패키지.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960057066A 1995-11-25 1996-11-25 노치가 형성된 전도층을 포함한 패키지 KR100232385B1 (ko)

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JP7329816A JP2755239B2 (ja) 1995-11-25 1995-11-25 半導体装置用パッケージ

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JP3794792B2 (ja) * 1997-07-22 2006-07-12 Ｔｄｋ株式会社 回路基板
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