KR910019192A - 반도체장치용 리드프레임 및 그 제조방법 - Google Patents

반도체장치용 리드프레임 및 그 제조방법 Download PDF

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Publication number
KR910019192A
KR910019192A KR1019910005673A KR910005673A KR910019192A KR 910019192 A KR910019192 A KR 910019192A KR 1019910005673 A KR1019910005673 A KR 1019910005673A KR 910005673 A KR910005673 A KR 910005673A KR 910019192 A KR910019192 A KR 910019192A
Authority
KR
South Korea
Prior art keywords
lead
lead frame
semiconductor device
inner lead
die pad
Prior art date
Application number
KR1019910005673A
Other languages
English (en)
Inventor
가즈도사 오구다
아끼히로 오까모도
Original Assignee
시기 모리야
미쓰비시뎅끼 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 시기 모리야, 미쓰비시뎅끼 가부시끼가이샤 filed Critical 시기 모리야
Publication of KR910019192A publication Critical patent/KR910019192A/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

내용 없음

Description

반도체장치용 리드프레임 및 그 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도는 이 발명의 한 실시예에 의한 반도체장치용 리드프레임을 표시하는 평면도, 제 2 도는 제 1 도에 표시한 리드프레임의 다이스패드의 끝단부 확대도, 제 3 도는 제 1 도에 표시한 리드프레임의 외측리드의 확대 사시도.

Claims (2)

  1. 반도체소자를 상부에 얹어놓고 끝단부는 에지가 없는 매끄러운 형상인 다이스패드와, 이 다이스패드의 주위에 비치되어 끝단부는 에지가 없는 매끄러운 형상인 내측 리드와, 이 내측리드에 접속된 단면은 상저가 하지보다 긴 사다리꼴형상인 외측리드를 구비한 것을 특징으로하는 반도체장치용 리드프레임.
  2. 다이스패드의 상면 및 하면 및 내측리드의 상면 및 하면에 각각 소정의 같은 크기의 마스크를 배치하고, 외측리드의 상면에 소정의 크기의 마스크를 배치하고 하면에는 상면에 배치한 마스크보다 약간 작은 마스크를 배치하고, 이어서, 상기 다이스패드, 내측리드 및 외측리드를 에칭하는 것을 특징으로하는 반도체장치용 리드프레임의 제조방법.
    ※ 참고사항 : 최초출원내용에 의하여 공개하는 것임.
KR1019910005673A 1990-04-12 1991-04-09 반도체장치용 리드프레임 및 그 제조방법 KR910019192A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2094952A JPH03293756A (ja) 1990-04-12 1990-04-12 半導体装置用リードフレーム及びその製造方法
JP2-94952 1990-04-12

Publications (1)

Publication Number Publication Date
KR910019192A true KR910019192A (ko) 1991-11-30

Family

ID=14124281

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910005673A KR910019192A (ko) 1990-04-12 1991-04-09 반도체장치용 리드프레임 및 그 제조방법

Country Status (3)

Country Link
US (1) US5083186A (ko)
JP (1) JPH03293756A (ko)
KR (1) KR910019192A (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5440170A (en) * 1990-09-10 1995-08-08 Fujitsu Limited Semiconductor device having a die pad with rounded edges and its manufacturing method
KR100552353B1 (ko) * 1992-03-27 2006-06-20 가부시키가이샤 히타치초엘에스아이시스템즈 리이드프레임및그것을사용한반도체집적회로장치와그제조방법
JPH06196603A (ja) * 1992-12-23 1994-07-15 Shinko Electric Ind Co Ltd リードフレームの製造方法
JPH06275764A (ja) * 1993-03-19 1994-09-30 Fujitsu Miyagi Electron:Kk リードフレーム及びそのリードフレームを用いた半導体装置の製造方法
JPH06318589A (ja) * 1993-05-10 1994-11-15 Mitsubishi Electric Corp 半導体集積回路装置
JP4279207B2 (ja) * 2004-06-18 2009-06-17 アルプス電気株式会社 入力装置およびこの入力装置を用いた表示入力装置
JP5893868B2 (ja) 2011-08-12 2016-03-23 シャープ株式会社 発光装置
JP6236484B2 (ja) * 2016-02-24 2017-11-22 シャープ株式会社 発光装置
DE102018128109A1 (de) 2018-11-09 2020-05-14 Infineon Technologies Ag Ein clip mit einem diebefestigungsabschnitt, der konfiguriert ist, um das entfernen von hohlräumen beim löten zu fördern

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53132975A (en) * 1977-04-26 1978-11-20 Toshiba Corp Semiconductor device
JPS60123047A (ja) * 1983-12-07 1985-07-01 Toshiba Corp 半導体装置
JPS61156845A (ja) * 1984-12-28 1986-07-16 Mitsubishi Electric Corp 樹脂封止型半導体装置用リ−ドフレ−ム
JPS61241957A (ja) * 1985-04-19 1986-10-28 Hitachi Yonezawa Denshi Kk リードフレームの製造方法およびリードフレームを用いた半導体装置の製造方法
JPS61259556A (ja) * 1985-05-13 1986-11-17 Sumitomo Electric Ind Ltd Ｉｃ用リ−ドフレ−ム
US4707418A (en) * 1985-06-26 1987-11-17 National Semiconductor Corporation Nickel plated copper tape
JPS6337954A (ja) * 1986-08-01 1988-02-18 Canon Inc 液体噴射記録装置
US4942452A (en) * 1987-02-25 1990-07-17 Hitachi, Ltd. Lead frame and semiconductor device
JPH01186662A (ja) * 1988-01-14 1989-07-26 Mitsui High Tec Inc 半導体装置用リードフレーム
JPH01251747A (ja) * 1988-03-31 1989-10-06 Toshiba Corp 半導体装置およびその製造方法
JPH02105559A (ja) * 1988-10-14 1990-04-18 Toppan Printing Co Ltd リードフレームおよびその製造方法

Also Published As

Publication number Publication date
JPH03293756A (ja) 1991-12-25
US5083186A (en) 1992-01-21

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