KR850003065A - 반듯하지 못한 방열기에 반도체장치를 고정시키기 위한 금속 및 수지홀더 및 그 제작방법 - Google Patents

반듯하지 못한 방열기에 반도체장치를 고정시키기 위한 금속 및 수지홀더 및 그 제작방법 Download PDF

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Publication number
KR850003065A
KR850003065A KR1019840006511A KR840006511A KR850003065A KR 850003065 A KR850003065 A KR 850003065A KR 1019840006511 A KR1019840006511 A KR 1019840006511A KR 840006511 A KR840006511 A KR 840006511A KR 850003065 A KR850003065 A KR 850003065A
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KR
South Korea
Prior art keywords
manufacturing
metal
semiconductor device
plate
resin holder
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KR1019840006511A
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English (en)
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KR910009781B1 (ko
Inventor
로마노 루찌
Original Assignee
쥬세페조치, 클라우디오 마찌오니
엣세 지 엣세-아티에 엣세 콤포넨티 엘렉트로니치 엣세. 피. 아.
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Application filed by 쥬세페조치, 클라우디오 마찌오니, 엣세 지 엣세-아티에 엣세 콤포넨티 엘렉트로니치 엣세. 피. 아. filed Critical 쥬세페조치, 클라우디오 마찌오니
Publication of KR850003065A publication Critical patent/KR850003065A/ko
Application granted granted Critical
Publication of KR910009781B1 publication Critical patent/KR910009781B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

내용 없음

Description

반듯하지 못한 방열기에 반도체장치를 고정시키기 위한 금속 및 수지홀더 및 그 제작방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따라 개량된 TO-220타잎 홀더의 확대 사시도이며, 제2a도, 제2b도, 제2c도는 본발명의 방법에 따른 홀더의 제조에서 a도는 펀칭전, b도는 펀칭중, c도는 펀칭후의 기계 동작의 단면도를 나타내며, 제3도는 방열기에 대해 보호되는 본 발명에 따른 홀더를 통한 단면도를 나타냄.

Claims (2)

  1. 플레이트의 일부가 씌워지고 대부분의 표면이 노출되며 엔벨로우프 내에 씌워지지 않은 부분이 1이상의 어퍼취를 갖도록 형성되어 있으며, 보부호부재가 연결된 금속 플레이트 및 합성수지 엔벨로우프로 구성된 종류의 반도체 장치용 홀더에 있어서, 플레이트가 플레이트의 나머지 부분에 연결된 금속은 단절되나 플레이트를 견고히 보호하는 실린더형 표면으로 된 부분을 어퍼취 주위에 구비된 것이 특징인 홀더.
  2. 어퍼취 주위의 플레이트 부분이 전단된후 압력에 의해 원위치로 복취되는 것이 특징인 홀더의 제작방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019840006511A 1983-10-21 1984-10-19 반듯하지 못한 방열기에 반도체장치를 고정시키기 위한 금속 및 수지홀더 및 그 제작방법 KR910009781B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IT8323385A IT1212780B (it) 1983-10-21 1983-10-21 Contenitore in metallo e resina per dispositivo a semiconduttore adatto al fissaggio su un dissipatore non perfettamente piano e processo per la sua fabbricazione.
IT23385A/83 1983-10-21

Publications (2)

Publication Number Publication Date
KR850003065A true KR850003065A (ko) 1985-05-28
KR910009781B1 KR910009781B1 (ko) 1991-11-30

Family

ID=11206617

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019840006511A KR910009781B1 (ko) 1983-10-21 1984-10-19 반듯하지 못한 방열기에 반도체장치를 고정시키기 위한 금속 및 수지홀더 및 그 제작방법

Country Status (8)

Country Link
US (1) US5001547A (ko)
JP (1) JPS60121744A (ko)
KR (1) KR910009781B1 (ko)
DE (1) DE3438435C2 (ko)
FR (1) FR2559956B1 (ko)
GB (1) GB2148597B (ko)
IT (1) IT1212780B (ko)
NL (1) NL8403177A (ko)

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Publication number Priority date Publication date Assignee Title
IT1201836B (it) * 1986-07-17 1989-02-02 Sgs Microelettronica Spa Dispositivo a semiconduttore montato in un contenitore segmentato altamente flessibile e fornite di dissipatore termico
US5175610A (en) * 1990-05-09 1992-12-29 Kabushiki Kaisha Toshiba Resin molded type semiconductor device having a metallic plate support
JP2001035977A (ja) * 1999-07-26 2001-02-09 Nec Corp 半導体装置用容器
US6972957B2 (en) * 2002-01-16 2005-12-06 Rockwell Automation Technologies, Inc. Modular power converter having fluid cooled support
US7187568B2 (en) * 2002-01-16 2007-03-06 Rockwell Automation Technologies, Inc. Power converter having improved terminal structure
US6965514B2 (en) * 2002-01-16 2005-11-15 Rockwell Automation Technologies, Inc. Fluid cooled vehicle drive module
US7187548B2 (en) 2002-01-16 2007-03-06 Rockwell Automation Technologies, Inc. Power converter having improved fluid cooling
US6898072B2 (en) * 2002-01-16 2005-05-24 Rockwell Automation Technologies, Inc. Cooled electrical terminal assembly and device incorporating same
US7142434B2 (en) 2002-01-16 2006-11-28 Rockwell Automation Technologies, Inc. Vehicle drive module having improved EMI shielding
US7061775B2 (en) * 2002-01-16 2006-06-13 Rockwell Automation Technologies, Inc. Power converter having improved EMI shielding
US7032695B2 (en) * 2002-01-16 2006-04-25 Rockwell Automation Technologies, Inc. Vehicle drive module having improved terminal design
US7177153B2 (en) 2002-01-16 2007-02-13 Rockwell Automation Technologies, Inc. Vehicle drive module having improved cooling configuration
JP4457895B2 (ja) * 2005-01-14 2010-04-28 船井電機株式会社 電源装置、並びにそれに適用可能な放熱部材固定構造及び回路基板

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1016728A (en) * 1911-07-26 1912-02-06 New Haven Electrical Mfg Co Electrical fitting.
FR75277E (fr) * 1959-03-06 1961-06-05 Prec Mecanique Labinal Perfectionnements apportés aux prises de courant
US3522490A (en) * 1965-06-28 1970-08-04 Texas Instruments Inc Semiconductor package with heat conducting mounting extending from package on side opposite conductor extensions
NL6903229A (ko) * 1969-03-01 1970-09-03
FR2233732B1 (ko) * 1973-06-15 1976-04-30 Unelec
IT7823238V0 (it) * 1978-11-08 1978-11-08 Ates Componenti Elettron Contenitore in metallo e resina per dispositivo a semiconduttore.
US4249034A (en) * 1978-11-27 1981-02-03 General Electric Company Semiconductor package having strengthening and sealing upper chamber
US4270138A (en) * 1979-03-02 1981-05-26 General Electric Company Enhanced thermal transfer package for a semiconductor device
JPS57149754A (en) * 1981-03-12 1982-09-16 Nec Corp Semiconductor device
FR2503932A1 (fr) * 1981-04-08 1982-10-15 Thomson Csf Boitiers a cosses plates pour composants semi-conducteurs de moyenne puissance et procede de fabrication
US4451973A (en) * 1981-04-28 1984-06-05 Matsushita Electronics Corporation Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor
IT8224533A0 (it) * 1982-12-01 1982-12-01 Ora Sgs Microelettronica Spa S Contenitore in metallo e resina ad elevata affidabilita' per dispositivo a semiconduttore.
JPS59152653A (ja) * 1983-02-21 1984-08-31 Hitachi Ltd レジンパツケ−ジ型半導体装置
GB2147457A (en) * 1983-09-28 1985-05-09 Philips Electronic Associated Encapsulated semiconductor device with composite conductive leads

Also Published As

Publication number Publication date
GB2148597B (en) 1987-05-28
FR2559956B1 (fr) 1987-12-18
IT8323385A0 (it) 1983-10-21
GB2148597A (en) 1985-05-30
US5001547A (en) 1991-03-19
IT1212780B (it) 1989-11-30
DE3438435A1 (de) 1985-05-02
JPS60121744A (ja) 1985-06-29
NL8403177A (nl) 1985-05-17
GB8426633D0 (en) 1984-11-28
FR2559956A1 (fr) 1985-08-23
DE3438435C2 (de) 1994-06-01
KR910009781B1 (ko) 1991-11-30

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