KR890016660A - 리드프레임 - Google Patents
리드프레임 Download PDFInfo
- Publication number
- KR890016660A KR890016660A KR1019890005547A KR890005547A KR890016660A KR 890016660 A KR890016660 A KR 890016660A KR 1019890005547 A KR1019890005547 A KR 1019890005547A KR 890005547 A KR890005547 A KR 890005547A KR 890016660 A KR890016660 A KR 890016660A
- Authority
- KR
- South Korea
- Prior art keywords
- leadframe
- resin
- inflow hole
- opening
- resin inflow
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 리드프레임의 평면도, 제2도 및 제3도는 각각 수지 유입구멍을 형성하는 공정을 나타낸 설명도, 제4도는 수지 유입구멍을 에칭가공에 의해서 형성한 경우의 설명도, 제5도는 수지 유입구멍에 수지가 유입고화된 상태를 나타낸 설명도, 제6도는 반도체 장치의 단면도.
Claims (1)
- 수지봉지형 반도체 장치에 사용되는 리드프레임에 있어서, 적어도 반도체 소자를 탑재하는 스테이지부이면에 수지 유입구멍을 갖고 이 수지 유입구멍의 개구부 단연부에 개구부의 안쪽으로 돌출한 돌출부를 갖는 것을 특징으로 하는 리드프레임.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63106738A JP2593912B2 (ja) | 1988-04-29 | 1988-04-29 | リードフレーム |
| JP63-106738 | 1988-04-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR890016660A true KR890016660A (ko) | 1989-11-29 |
Family
ID=14441266
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019890005547A KR890016660A (ko) | 1988-04-29 | 1989-04-27 | 리드프레임 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2593912B2 (ko) |
| KR (1) | KR890016660A (ko) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0575006A (ja) * | 1991-09-18 | 1993-03-26 | Fujitsu Ltd | リードフレーム及び樹脂封止型半導体装置 |
| US5293065A (en) * | 1992-08-27 | 1994-03-08 | Texas Instruments, Incorporated | Lead frame having an outlet with a larger cross sectional area than the inlet |
-
1988
- 1988-04-29 JP JP63106738A patent/JP2593912B2/ja not_active Expired - Lifetime
-
1989
- 1989-04-27 KR KR1019890005547A patent/KR890016660A/ko not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| JP2593912B2 (ja) | 1997-03-26 |
| JPH01278055A (ja) | 1989-11-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| E601 | Decision to refuse application |