JP2593912B2 - リードフレーム - Google Patents

リードフレーム

Info

Publication number
JP2593912B2
JP2593912B2 JP63106738A JP10673888A JP2593912B2 JP 2593912 B2 JP2593912 B2 JP 2593912B2 JP 63106738 A JP63106738 A JP 63106738A JP 10673888 A JP10673888 A JP 10673888A JP 2593912 B2 JP2593912 B2 JP 2593912B2
Authority
JP
Japan
Prior art keywords
resin
stage
inflow hole
lead frame
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63106738A
Other languages
English (en)
Japanese (ja)
Other versions
JPH01278055A (ja
Inventor
満晴 清水
三喜 今井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP63106738A priority Critical patent/JP2593912B2/ja
Priority to KR1019890005547A priority patent/KR890016660A/ko
Publication of JPH01278055A publication Critical patent/JPH01278055A/ja
Application granted granted Critical
Publication of JP2593912B2 publication Critical patent/JP2593912B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP63106738A 1988-04-29 1988-04-29 リードフレーム Expired - Lifetime JP2593912B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP63106738A JP2593912B2 (ja) 1988-04-29 1988-04-29 リードフレーム
KR1019890005547A KR890016660A (ko) 1988-04-29 1989-04-27 리드프레임

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63106738A JP2593912B2 (ja) 1988-04-29 1988-04-29 リードフレーム

Publications (2)

Publication Number Publication Date
JPH01278055A JPH01278055A (ja) 1989-11-08
JP2593912B2 true JP2593912B2 (ja) 1997-03-26

Family

ID=14441266

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63106738A Expired - Lifetime JP2593912B2 (ja) 1988-04-29 1988-04-29 リードフレーム

Country Status (2)

Country Link
JP (1) JP2593912B2 (ko)
KR (1) KR890016660A (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0575006A (ja) * 1991-09-18 1993-03-26 Fujitsu Ltd リードフレーム及び樹脂封止型半導体装置
US5293065A (en) * 1992-08-27 1994-03-08 Texas Instruments, Incorporated Lead frame having an outlet with a larger cross sectional area than the inlet

Also Published As

Publication number Publication date
JPH01278055A (ja) 1989-11-08
KR890016660A (ko) 1989-11-29

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